HP 2133 Mini-Note PC Assembly instructions

EL-MF877-00 Page 1
Template Revision A
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP 2133 Mini-Note PC
HP 2133
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 3
Batteries All types including standard alkaline and lithium coin
or button style batteries 2
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 1
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0

EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 Motor-screw-driver “+” Cross head
of screwdriver
Description #2 Motor-screw-driver “*” TORX T8
(2.31mm)
Description #3 Motor-screw-driver “-”
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Follow steps described in Disassembly instruction (file attached).
2. If parts can be removed without using a tool, remove it first.
3. Use correct screwdriver and torque value before unlock the screw.
4.
5. .
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

作业指导书
Document No. : SOP GALILEO FA DISASSEMBLY 站别:
作业名称:Ver.:编辑日期:
注意事项：
治具清单（治具规格） 数量 治具清单（治具规格） 数量
步骤:
制表：发行部门：IE
蒋春玲
1. 翻转机器(图一)
2.拆Battery module并放于Box盒内(图二).
1(1/1)
2008/4/13
1.00
Disassembly Battery
1
2

作业指导书
Document No. : SOP GALILEO FA DISASSEMBLY 站别:
作业名称:Ver.:编辑日期:
注意事项：
治具清单（治具规格） 数量 治具清单（治具规格） 数量
步骤:
制表：发行部门：IE
蒋春玲
1. 拆Rubber foot四处(图一)
2,拆螺丝1pcs 1pcs(6052B0130501)
并放于螺丝合盒内(图二)
扭力： 2.5 ±0.5 Kgf．cm
螺丝不可滑頭及空轉
2(1/1)
2008/4/13
1.00
電動起子(梅花頭) 1
Disassembly Rubber foot
图二
图一
1
23
4
6052B0130501

作业指导书
Document No. : SOP GALILEO FA DISASSEMBLY 站别:
作业名称:Ver.:编辑日期:
注意事项：
治具清单（治具规格） 数量 治具清单（治具规格） 数量
步骤:
制表：发行部门：IE
蒋春玲
1.拆BASE screw *3pcs (6052B0119401)
扭力： 2.5 ±0.5 Kgf．cm
螺丝不可滑頭及空轉
3(1/1)
2008/4/13
1.00
電動起子(梅花頭) 1
Disassembly screw of BASE
12
3

作业指导书
Document No. : SOP GALILEO FA DISASSEMBLY 站别:
作业名称:Ver.:编辑日期:
注意事项：
治具清单（治具规格） 数量 治具清单（治具规格） 数量
步骤:
制表：发行部门：IE
蒋春玲
1, 装Rubber foot*4
1.00 4(1/1)
2008/4/13
Lock Rubber foot
1
23
4

作业指导书
Document No. : SOP GALILEO FA DISASSEMBLY 站别:
作业名称:Ver.:编辑日期:
注意事项：
治具清单（治具规格） 数量 治具清单（治具规格） 数量
步骤:
制表：发行部门：IE
蒋春玲
1. 翻转机器放于治具上
2.拆Keyboard screw *3pcs(6052B0119201)
并放于螺丝盒内.
扭力： 2.5 ±0.5 Kgf．cm
螺丝不可滑頭及空轉
1.00 5(1/1)
2008/4/13
Disassembly screw of K/B
電動起子(十字)1
Galileo K/B 治具 1
1
23 1

作业指导书
Document No. : SOP GALILEO FA DISASSEMBLY 站别:
作业名称:Ver.:编辑日期:
注意事项：
治具清单（治具规格） 数量 治具清单（治具规格） 数量
步骤:
制表：发行部门：IE
蒋春玲
6(1/1)
2008/4/13
1.00
Take off K/B
1, 取Keyboard
先拆K/B左边的两处卡勾,后拆K/B右边一处卡勾.
2,拔M/B端K/B connector,并放K/B module 放Box盒内
check thermal pad的上方散热pad需在thermal module上

作业指导书
Document No. : SOP GALILEO FA DISASSEMBLY 站别:
作业名称:Ver.:编辑日期:
注意事项：
治具清单（治具规格） 数量 治具清单（治具规格） 数量
步骤:
制表：发行部门：IE
蒋春玲
7(1/2)
2008/4/13
1.00
1,拆top case 上方screw 2pcs(60520D055001)
,并放于box盒内
2,附带是SSD HDD,需拆SSD HDD螺丝1pcs
扭力： 2.0 ±0.5 Kgf．cm
螺丝不可滑头及空转
電動起子(梅花頭) 1
Disassembly Screw of Top
1
2
1
SSD HDD 1pcs 螺丝

作业指导书
Document No. : SOP GALILEO FA DISASSEMBLY 站别:
作业名称:Ver.:编辑日期:
注意事项：
治具清单（治具规格） 数量 治具清单（治具规格） 数量
步骤:
制表：发行部门：IE
蒋春玲
1. 拆HDD screw*2pcs, 60520D055001)
并放于box盒内
1. 拆HDD 附带screw*1pcs.
白
黑
9(1/1)
2008/4/13
1.00
Disassembly Screw of HDD
電動起子(十字頭) 1
•1
•2
•1