EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the access panel.(see Figure 1 below)
2. Disconnect the cables from the fan duct and the board.(see Figures 2-6 below)
3. Remove the optical drive and the hard drive from the chassis.(see Figures 7-15 below)
4. Remove the power supply from the chassis.(see Figure 16 below)
5. Remove the front bezel from the chassis.(see Figure 17 below)
6. Remove the front system fan from the chassis.(see Figures 18-19 below)
7. Remove the front I/O and speaker from the chassis.(see Figures 20-22 below)
8. Remove memory modules from the system board.(see Figure 23 below)
9. Remove the CPU from the system board .(see Figures 24-26 below)
10. Remove the battery from the system board.(see Figure 27 below)
11. Remove the system board from the chassis.(see Figures 28-29 below)
12. Remove the power supply cover and cables.(see Figures 30-32 below)
13. There are nine different possible power supplies in these computers. Use figures 33-41 to determine which power
supply you have, and then remove the electrolytic capacitors as shown in the appropriate figure.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
