HP dx1000 - Microtower PC Assembly instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
Compaq dx1000 Microtower PC
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
The QTY may vary from different PSU Models
2
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
system fan, cooler
2
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name
Plastic Part
Description
Weight
(grams)
ISO 11469:2000 Plastic Part
Mark
Optional:
Photo
Alamo Main Bezel
Main front bezel piece
150
>ABS<
Alamo Anna Bezel
Frame
Front bezel frame
194
>ABS<
System Fan Frame
Fan Frame
47
>PBT-GF30-FR(17)<
CPU Heatsink Fan Frame
Fan Frame
35
>PBT-GF30-FR(17)<
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Trox screw driver
T10
Description #2 Soldering Iron
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove cover from the unit
2. Remove all the cables from PCA
3. Remove PCI & PCI-E card from the PCA
4. Remove HDD from the system Remove ODD from PCA
5. Take off Front Panel
6. Take off ODD
7. Take off Cooler
8. Take off CMOS battery
9. Take off PS from the Unit
10. Cut off wire tie
11. Open PSU
12. Use screw driver to separate the small PCA from the main board
13. Electrolytic Capacitors location
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
1 Remove cover from the unit
Rotate screw to open the cover
2 Remove all the cables from PCA
Press the button to pull power cords off
Pull the other cords off PCA
3 remove PCI & PCI-E card from the PCA
Use screw driver to take off the screw as shown in the
photo

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3 Take PCI & PCI-E cards off the PCA
Use one hand to push the white plastic use the other hand
to pull off the card
4 Remove HDD from the system
Rotate the screw driver to take off the HDD holder
5 Take off Front Panel
Pull the button up and then take off the front panel

EL-MF877-00 Page 5
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PSG instructions for this template are available at EL-MF877-01
6 Take off ODD
Use one hand to pull the steel up , and the same time take
off ODD use the other hand
7 Take off Cooler
7.1 Press the steel button to loose Cooler fan
7 Take off Cooler
7.2 Rotate screw driver to loose screw and then
take the cooler off PCA

EL-MF877-00 Page 6
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8 Take off CMOS battery
Pull the battery holder as shown in the photo,
and then the battery will be off the PCA
9 Take off PS from the Unit
Use screw driver to loose screws and then take
the PS off the Unit
10 Cut off wire tie

EL-MF877-00 Page 7
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PSG instructions for this template are available at EL-MF877-01
11 open PSU
12 Use screw driver to separate the small PCA
from the main board
13 Remove Electrolytic Capacitors
13.1 Electrolytic Capacitors
13 Remove Electrolytic Capacitors
13.2 Use the Soldering Iron to heat the solder of
Electrolytic Capacitors and then remove it

EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01