HP EliteDesk 800 G4 Installation instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 800 G4 SFF
Purpose: The document isintended for use byend-of-life recyclers or treatmentfacilities. Itprovides the basic instructions
for the disassembly of HPproducts to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Itemslisted belowareclassifiedasrequiringselectivetreatment.
1.2 Enter the quantity of items contained within the product which require selective treatment inthe right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
PrintedCircuit Boards(PCB) orPrintedCircuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline andlithiumcoin
or button style batteries
0
Mercury-containing components
For example, mercury inlamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includesbackgroundilluminateddisplayswithgas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Chicony 250W EPA92 HV :C1
1
External electrical cables and cords
0
Gas Discharge Lamps
0
Plasticscontaining BrominatedFlameRetardants
weighing > 25grams (not including PCBs or PCAs
already listed as a separate itemabove)
0
Components and parts containing toner and ink,
Include the cartridges, print heads, tubes, vent
0
1.0 Items Requiring Selective Treatment

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including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
0
Components,partsandmaterialscontaining
refractory ceramic fibers
0
Components,partsandmaterialscontaining
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically beused to disassemble the product to a point where components
and materials requiring selective treatment can beremoved.
Tool Description
Tool Size (if
applicable)
Description #1 Screw Driver, Cross Type
Description #2 Cut-Pliers, Small Size
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed toremove components andmaterials requiring selective treatment:
1.
Slide the latch and remove access panel.(see Figure 1-2below)
2. Rotate the driver cage form the hook on slide rail.(see Figure 3 below)
3. Disconnect power cable from the MB.(see Figure 4 below)
4. Disconnect SATA cables from the MB.(see Figure 5below)
5. Disconnect speaker cable from the MB.(see Figure 6below)
6. Disconnect other PSU cables from the MB.(see Figure 7-8below)
7. Remove the fan duct (see Figure 9-10below)
8. Disconnect P3 cable from MB.(see Figure 11 below)
9. Remove HDD/ODD from chassis.(see Figure 12-19below)
10. Remove the heatsink from MB.(see Figure 20-21below)
11. Separatethe fanfromCPU heatsink. （ seeFigure22below ）
12. Remove the memory card from the MB.(see Figure 23 below)
13. Remove the CPU from the MB.(see Figure 24-25below)
14. Remove M/B from chassis .(see Figure 26-27below)
15. Remove the battery from MB.(see Figure 28 below)
16. Remove LEDholder from MB.(see Figure 29below)
17. Remove front panel from chassis.(see Figure 30 below)
18. Remove Speaker from chassis.(see Figure 31 below)
19. Unscrew the PSU and disconnect all PSU cables from chassis.(see Figure 32-35 below)
20. Remove PSU cover and remove the Electrolytic Capacitors.(see Figure 36-41 below)
3.2
Optional Graphic. If the disassembly process iscomplex, insert a graphic illustration below toidentify theitems
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1Slide the latch and remove access panel
Figure 2 Remove the access panel
Figure 3 Rotate the driver cage from the hook
Figure 4 Disconnect Power SATA cable from MB
Figure 5 Disconnect All SATA cables from MB
Figure 6 Disconnect Speaker cable from MB

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Figure 7 Disconnect P1 power cable from the MB
Figure 8 Disconnect P2 power cable from MB
Figure 9 press the hook and pull up the fan duct
Figure 10 Remove the fan duct
Figure 11 Disconnect P3 Power cable from MB
Figure 12 Pull the HDD latch and rotate the HDD up

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Figure 13 Disconnect power cable from HDD
Figure 14 Disconnect SATA cable from HDD
Figure 15 Remove the HDD from HDD cage
Figure 16 Disconnect power cable from ODD
Figure 17 Disconnect SATA cable from ODD
Figure 18 Press the ODD latch and remove it

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Figure 19 Remove ODD from ODD cage
Figure 20 Disconnect CPU fan cable from MB
Figure 21 Use T15 screwdriver to unscrew the screw and
remove the heatsink
Figure 22 Use PH1 screwdriver tobreak upthe heatsink
into fan and cooler

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Figure 23 Remove memory from MB
Figure 24 Rotate the handle and pull it up
Figure 25 Remove CPU from the socket
Figure 26 Use T15 screwdriver toremove all MB screws
from MB
Figure 27 Remove MB from chassis
Step 28. Remove battery from MB

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Step 29 Remove LED cover from MB
Step 30 Remove the front bezel
Step 31Use T15 screwdriver remove speaker from the
front wall
Step 32Use T15 screwdriver toremove the PSU screws
from rear wall
Step 33 Remove all the power cables from the hook
Step 34 Press the latch and slide the PSU out

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Step 35 Remove the PSU from chassis
Step 36De-screwed from the external case top, use tool
#1
Step 37De-screwed from the external case bottom, use
tool #1
Step 38 Remove the external case of back side

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Step 39De-screwed from the main PCBA (solder side),
use tool #1
Step 40 Pull-off the connectors/housings
Step 41Cut-off andremove the biggest electrolyte
capacitor(C1), use tool #2