HP ProDesk 400 G6 MT Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 400 G6 SFF Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
5
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[] screws
[] snaps
[] adhesive
[] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
0

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity
of items
included
in product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Star screwdriver
OD 3.3mm
Cross screwdrive
OD 3.0mm
Cross screwdrive
OD 6.0mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove side panel
2. Remove front bezel
3. Unplug ODD & HDD cables
4. Remove drive cage
5. Remove FIO cage
6. Remove ODD & HDD
7. Remove all cables
8. Remove fan duct
9. Remove cooler
10. Remove CPU
11. Remove Memory
12. Remove WLAN module
13. Remove all PCIEXP cards
14. Remove card reader
15. Remove antenna cable
16. Remove MB and battery
17. Remove PSU
18. Remove speaker

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1
Release thumb screw
on the chassis rear
side.
Push side panel in
the end as shown,
and then pick up from
chassis.
See photo 1, 2
Screw tool:
Cross screwdriver
OD 6.0mm.
Photo 1
Photo 2

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

2
Release 4 bezel
latches from chassis
by pulling outwards
the bezel latches
then as shown.
See Photo 3
Pick up bezel in the
order as shown.
See Photo 4
Photo 3
Photo 4
1
2
Lift up bezel away
from chassis
Rotate bezel until
the bezel latches
align this line.

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

3
Unplug ODD & HDD
cables as shown.
See Photo 5
Photo 5
ODD cable
HDD cable

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
4
Press HDD cage first
then push button as
shown.
See Photo 6
Rotation drive cage
then pass through
HDD cables to drive
cage then remove
drive cage as shown.
See Photo 7, 8


Photo 6
1
Press HDD cage first
2
Push button
Photo 7
HDD SATA & PWR
cable pass through
to cage hole.
Hole for cable routing
Rotate
Photo 8
3
1
2

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
5
Pick up FIO bracket
from chassis as shown.
See Photo 9
6
Release 4 screws then
pull up HDD from drive
cage as shown.
See Photo 10, 11
Screw tool:
Star screwdriver OD
3.3mm.
Photo 9
Photo 10

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Push ODD latch then
pull ODD as shown.
See Photo 12, 13
Photo 12
Pull
Photo 13
Push
Photo 11

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

7
Release all cables
See Photo 14, 15,
16, 17, 18
Photo 14
Photo 15
Photo 16
Photo 17
Photo 18
Release cable from
fan duct hooks

EL-MF877-00 Page 10
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

8
Push fan duct latch
then pick up fan duct
from chassis as
shown.
See Photo 19, 20
Photo 20
1
2
Photo 19

EL-MF877-00 Page 11
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

9
Release 4 screws
from cooler then
unplug cable as
shown.
See Photo 21, 22
Screw tool:
Star screwdriver
OD 3.3mm.
Photo 22
Photo 21

EL-MF877-00 Page 12
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

10
Unlock CPU socket latch
and open cover then pick
up CPU as shown.
See Photo 23, 24

Unlock
Photo 23
Photo 24

EL-MF877-00 Page 13
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

11
Press memory slot
levers by pulling
outward.
Then pull up memory
as shown.
See Photo 25
12
Release WLAN card
screw then pull up
WLAN card from MB
as shown.
See Photo 26, 27
Screw tool:
Cross screwdriver
OD 3.0mm.
Photo 25
Photo 26
1
1
2
2
Press
Press
Pull
Pull
Photo 27

EL-MF877-00 Page 14
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

13
Open slot lock cover
then pull up all
PCIEXP cards as
shown.
See Photo 28, 29
14
Release one screw
then pull up card
reader as shown.
See Photo 30, 31
Screw tool:
Star screwdriver
OD 3.3mm.
Photo 28
Photo 29
Pull
Pull up
Photo 30
Photo 31
1
2

EL-MF877-00 Page 15
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
15
Release front antenna
screw then pull up
antenna cable.
Press rear antenna
cover latch then pull up
cover from chassis.
Release rear antenna
screw then pull up
antenna cable.
See Photo 32, 33, 34,
35, 36
Screw tool:
Cross screwdriver
OD 3.0mm.
Photo 32
Photo 33
Photo 34
Photo 36
1
2
Photo 35

EL-MF877-00 Page 16
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
16
Release betty and 8
screws then pick up
MB to release from
chassis in the order
as shown.
See Photo 37, 38
Screw tool:
Star screwdriver
OD 3.3mm.
Photo 37
Photo 38
1
2

EL-MF877-00 Page 17
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

17
Release 4 screws as
shown.
Push PSU latch then pull
PSU then pick up PSU
from chassis as shown.
See Photo 39, 40, 41
Screw tool:
Star screwdriver
OD 3.3mm.
18
Release one screw then
pick up speaker from
chassis as shown.
See Photos 42, 43
Screw tool:
Star screwdriver
OD 3.3mm.
Photo 39
Photo 41
Photo 40
Push
1
2
Photo 42
Photo 43