HP Z5000 Series Installation instructions

HP-00007-01, Appendix 3 13-Oct-2004
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Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Model Name HP Z5000 Series Digital Entertainment Center
Description Desktop PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of items included in
product.
Printed Circuit Boards (PCB) or
Printed Circuit Assemblies (PCA) With a surface greater than 10 square cm 12
Batteries All types including standard
alkaline and lithium coin or button
style batteries
1
Mercury containing components For example, mercury in lamps,
display backlights, scanner
lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case plastics only. 0
Components and parts containing
toner and ink, including liquids, semi-
liquids (gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials 0

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containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Clipper
Screw Driver
Knife
Thin slice iron
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Top Cover Disassemble: loosing four screws, removing top cover
2 Top Cover mylar Disassemble: using knife to pull Top Cover mylar out of Top Cover
3 Main Bezel sub-assembly Disassemble: ejecting six hooks, pulling out main bezel sub-
assembly
4 HDD Bay sub-assembly Disassemble: loosing two screws, taking HDD Bay sub-assembly
out of chassis
5 Power Supply Disassemble: loosing five screws, taking Power Supply out of chassis
6 Riser Board sub-assembly Disassemble: loosing three screws, taking Riser Board sub-
assembly out of Mother Board sub-assembly
7 Mother Board sub-assembly Disassemble: loosing one screw, pulling Mother Board sub-
assembly out of chassis
8 ODD sub-assembly Disassemble: pulling snap up, taking ODD sub-assembly out of
chassis
9 Card Reader sub-assembly Disassemble: loosing one screw, taking Card Reader sub-
assembly out of chassis
10 Front AV Board sub-assembly Disassemble: loosing one screw, taking Front AV Board out
of chassis
11 Display Board Disassemble: loosing four screws, taking Display Board out of chassis
12 Power LED Board Disassemble: loosing two screws, taking Power LED Board out of
chassis
13 FAN Holder sub-assembly Disassemble: loosing two screws, taking FAN Holder sub-
assembly out of chassis
14 Cable tie Disassemble: pulling two Cable tie out of chassis
15 ODD lock latch Disassemble: pressing four hooks, taking ODD lock latch out of chassis

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16 HDD bracket sub-assembly Disassemble: loosing one screw, taking HDD bracket sub-
assembly out of chassis
17 Plastic feet Disassemble: loosing two screws, taking two Plastic feet out of chassis
18 Rubber feet Disassemble: loosing two screws, taking two Rubber feet out of chassis
19 Transport Board Disassemble: loosing three screws, taking Transport Board out of Main
Bezel
20 Card Reader door sub-assembly Disassemble: pushing Damper hook, taking Card
Reader door sub-assembly out of Main Bezel
21 Card Reader door plate, Metal plate and Damper Disassemble: using knife to pull Card
Reader plate out of Card Reader door, taking Metal plate and Damper out of Card Reader
door
22 MG door sub-assembly Disassemble: pushing Damper hook, taking MG door sub-
assembly out of Main Bezel
23 HDD strip and Damper Disassemble: pushing HDD strip right side, taking HDD strip and
Damper out of MG door
24 MG door plate and Metal plate Disassemble: using knife to pull MG door plate out of MG
door, taking Metal plate out of MG door
25 Front AV door sub-assembly Disassemble: pushing Damper hook, taking Front AV door
sub-assembly out of Main Bezel
26 Front AV door plate, Metal plate and Damper Disassemble: using knife to pull Front AV
plate out of Front AV door, taking Metal plate and Damper out of Front AV door
27 ODD door sub-assembly Disassemble: pushing ODD door sub-assembly rightward, taking
ODD door sub-assembly out of Main Bezel
28 HP Jewel logo Disassemble: using thin slice iron to push HP Jewel logo out
29 ODD door plate, spring and spring pin Disassemble: using knife to pull ODD door plate out
of ODD door, taking spring and spring pin out of ODD door
30 Power Button sub-assembly and spring Disassemble: using thin slice to push Power
Button hooks to take Power Button sub-assembly and spring out of Main Bezel
31 Power Button plate Disassemble: using knife to pull Power Button plate out of Power
Button
32 Bezel plate Disassemble: using knife to pull Bezel plate out of Main Bezel
33 Display Window Disassemble: using knife to pull Display Window out of Main Bezel
34 AV Button Disassemble: pushing hooks to take AV Button out of Main Bezel
35 Bezel strip Disassemble: pushing hooks to take Bezel strip out of Main Bezel
36 Function Button Disassemble: pushing hooks to take six Function Buttons out of Main
Bezel
37 ODD Eject Actuator Disassemble: pushing hook to take ODD Eject Actuator out of Main
Bezel
38 ODD pad Disassemble: using knife to pull ODD pad out of ODD Eject Actuator

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39 Magnet Disassemble: using clipper to pull three Magnet out of Main Bezel
40 HDD Bay door and spring Disassemble: taking away both side of spring, taking HDD Bay
door and spring out of HDD Bay
41 HDD Bay connector Disassemble: loosing two screws, taking HDD Bay connector out of
HDD Bay
42 Riser Board plate Disassemble: loosing four screws, taking Riser Board plate out of Riser
Board bracket
43 Wireless LAN card Disassemble: loosing two screws, taking Wireless LAN card out of
Riser Board
44 Wireless LAN card bracket Disassemble: loosing two screws, taking out Wireless LAN
card bracket
45 TV card Disassemble: loosing two screws, taking TV card out of Riser Board
46 TV card bracket Disassemble: loosing two screws, taking out TV card bracket
47 Riser Board Disassemble: loosing one screw, taking Riser Board out of Riser Board
bracket
48 TV in card Disassemble: loosing two screws, taking TV in card out of Riser Board bracket
49 Component cap Disassemble: pulling Component cap out of Rear AV Board
50 Rear AV Board Disassemble: loosing five screws, taking Rear AV Board out of Mother
Board bracket
51 VGA Switch cable Disassemble: loosing two studs, taking VGA Switch cable out of Mother
Board bracket
52 Graphic card Disassemble: loosing one screw, taking Graphic card out of Mother Board
bracket
53 Graphic card bracket Disassemble: loosing two studs, taking out Graphic card bracket
54 Mother Board Disassemble: loosing eight screws, taking Mother Board out of Mother
Board bracket. Remove RTC coin cell battery for selective treatment.
55 IR Blaster Board Disassemble: loosing two screws, taking IR Blaster Board out of Mother
Board bracket
56 Mother Board mylar and Mother Board rubber Disassemble: pulling out Mother Board
mylar and Mother Board rubber out of Mother Board bracket
57 ODD slide latch Disassemble: loosing four screws, taking out ODD slide latch
58 Card Reader Disassemble: loosing three screws, taking Card Reader out of Card Reader
bracket
59 USB connector Disassemble: pushing four hooks, taking USB connector out of Card
Reader bracket
60 Card Reader Bezel Disassemble: pushing six hooks, taking Card Reader Bezel out of
Card Reader bracket
61 Card Reader LED lens Disassemble: using clipper to take out Card Reader LED lens

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62 Front AV Board Disassemble: loosing three screws, taking Front AV Board out of Front AV
Board bracket
63 FAN Disassemble: pressing three hooks, taking FAN out of FAN Holder
64 HDD and HDD screw rubber Disassemble: loosing four screws, taking HDD and HDD
screw rubber out of HDD bracket
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:

HP-00007-01, Appendix 3 13-Oct-2004
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