HP Compaq Presario X6000 Series Assembly instructions

HP-00007-01, Appendix 3 13-Oct-2004
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
Compaq Presario X6000 Series Notebook PC Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10 square cm 1
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
1
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case plastics only. 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials
containing refractory ceramic fibers 0

HP-00007-01, Appendix 3 13-Oct-2004
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Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver Type-cross #1
Screwdriver Type-cross #0
Screwdriver Type-T #8
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Remove battery
2 Remove HDD/RAM door with M2.5 screw*4
3 Remove antenna cable from mini PCI
4 Remove M2.5screw*19 on bottom side
5 Remove HDD
6 Release fan cable near ram on MB.
7 Remove 2 nut on VGA port and M2.5screw*4 on rear side
8 Reverse machine and open LCD.
9 Remove keyboard cover and than remove keyboard with 4 latches.
10 Remove fan cable /lead switch/daughter cable board on keyboard cover area
11 Remove M2.5 screw*3 on top side and then remove LCD module and antenna
12 Remove top-case with M2.5 screw*2.
13 Remove small board with M2.5 *1 screw on left side, and also remove small board cable.
14 Remove M2.5*screw*7 on top-side and then remove left fan cable on MB.
15 Remove Main board.
16 Remove RTC coin cell battery from MB for selective treatment
17 Remove LCD rubber*6 on LCD module
18 Remove M2.58screw *6 and then remove LCD bezel
19 Remove M28screw *16 on top side and then remove LCD panel
20 Remove screw*4 (M2) and then remove LCD bracket R/L
21 Remove mercury bulb from LCD assembly for selective treatement

HP-00007-01, Appendix 3 13-Oct-2004
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3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below: