HP Stream 14 Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Stream Laptop PC 14
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
M/B
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries Battery pack & RTC
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing

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refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
#0
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove screw rubber F / R from D base
2. Remove rubber foot x 8screw rubber F / R from D base
3. Remove D base sub-Assy. from unit
4. Dis-connect battery pack connector from M/B.
5. Remove screw M2L2.5 x3 on battery pack.
6. Remove screw M2L6 x2 on battery pack.
7. Remove battery pack &Battery cable from unit.
8. Dis-connect speaker connector from M/B
9. Remove speaker from unit.
10. Dis-connect K/B membrane, TP FFC, power FFC ,DC cable connector from M/B
11. Dis-connect RTC battery connector from M/B
12. Dis-connect LCD cable connector from M/B
13. Dis-connect DC in cable connector from M/B
14. Dis-connect WLAN antenna cable from WLAN module
15. Remove screw M2L2.5 x 1 on WLAN module
16. Remove WLAN module from unit
17. Remove screw M2L2 x 3&M2X2.5 X2 on M/B
18. Remove M/B from unit
19. Remove screw M2L2 x 2 on thermal plate
20. Remove Thermal plate form MB.
21. Remove antenna cable & LCD cable from unit
22. Remove screw L2.5L5 x 4 on hinge L / R bracket
23. Remove LCD sub-Assy. from unit
24. Remove DC cable connector from TOP.
25. Remove power FFC from D/B Pow.
26. Remove screw M2L2.5 x 1 on D/B Pow.
27. Remove D/B Pow. from C top sub-Assy.
28. Remove TP FFC from TP module
29. Remove screw M2L2.5 x 3 on TP support bracket
30. Remove TP support bracket from C top sub-Assy.
31. Remove screw M2L2 x 3 on TP holder bracket
32. Remove TP holder bracket & TP module & TP mylar from C top sub-Assy.
33. Remove screw M2L2 x1 on Kb hook.
34. Remove LCD bezel from LCD sub-Assy.
35. Remove screw M2L2.5 x 4 on LCM ears
36. Remove LCM from LCD sub-Assy.

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37. Dis-connect LCD cable connector from LCM
38. Remove screw M2L2.5 x 2 & M2.5L4 x 2 &M2.5L2.5 x 4 on hinge L / R bracket
39. Remove hinge L / R from LCD sub-Assy.
40. Dis-connect LCD cable connector from Cam. module
41. Remove LCD cable from LCD sub-Assy.
42. Remove Cam. module from LCD sub-Assy.
43. Remove antenna cable from LCD sub-Assy.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total
3.22 Remove base rubber foot and screw

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3.23 Remove base assy..

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3.24 Remove speaker & battery pack & Battery cable & WLAN module & RTC Battery

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3.25 Remove MB & Thermal plate

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3.26 Remove DC cable & power board & power FFC & KB hook

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3.27 TP support bracket & TP holder BKT & TP module

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3.28 Remove LCD Bezel

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3.28 Remove LCD module & hinge &camera module & LCD cable & Antenna cable

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3.27 Remove LCD bezel
3.28 Remove Panel

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3.29 Remove camera module and hinge -L & -R & LCD cable & antenna cable

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