HP 24 Assembly instructions

EL-MF877-00
Template Revision B
Page 1
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Calculators
Marketing Name / Model
[List multiple models if applicable.]
Name / Model #1: HP Mini-in-One 24 Display
Name / Model #2 :
Name / Model #3 :
Name / Model #4
Name / Model #5
Purpose: The document is intended for use byend-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined byEU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies(PCA)
With a surface greater than 10 sq cm
4
Batteries All types including standard alkaline and lithium coin
or button style batteries 0
Mercury-containingcomponents For example, mercuryin lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode RayTubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 417
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords 1
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
1.0 Items Requiring Selective Treatment

EL-MF877-00
Template Revision B
Page 2
PSG instructions for this template are available at EL-MF877-01
Components and waste containing asbestos
0
Components, parts and materials containing
refractoryceramic fibers
0
Components, parts and materials containing
radioactivesubstances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 screwdriver(Phillips head) T3
Description #2 screwdriver(Phillips head)
M3
Description #3 screwdriver(Phillips head) M3
Description #4 screwdriver(Phillips head)
M4
Description #5 screwdriver(plum flower head) T15
Description #6 screwdriver(Phillips head) M3
Description #7 screwdriver(Phillips head) M3
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Quick release Base stand
2. To remove the Speaker grill , then turn back the display head.
3. To released the snaps of Bucket then and remove the FFC cables of side USB board, OSD board and
Audio board at the same time then Bucket can be removed.
4. Strip the screws to remove the shielding(contain the other material ), also remove the shutter & webcam
module.
5. To remove the cables of webcam and light bar then strip the screws from PCBA.,
6. Release all materials
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Below action which may easily damage product .please notice it
1.To release the
Deco Bezel by
hand.
2.To release all
the snaps and
screwsthen to
remove the
Buckt.
Screwd
river(#
1 &
T15)
2
1
*3pcs. *4pcs.
1

EL-MF877-00
Template Revision B
Page 3
PSG instructions for this template are available at EL-MF877-01
To release the
scerws then to
remove the IO
shielding.
Screwd
river(#
1)
*3 pcs.
2
To release the
scerws and
snaps then
take out the
PCBAs.
Screwd
river(#
1)
*2 pcs.
3
1.To releae the
webcam
module.
N/A
4
1.To release the
screws then to
remove the Die
casting.
2.To release all
cables. (LVDS
cable,FFC*2,W
ebcam cable,
Type C and
Audio cable)
3.To release the
screws on
scaler board
then to remove
the PCBA.
Screwd
river(#
1 )
*4pcs.
5

EL-MF877-00
Template Revision B
Page 4
PSG instructions for this template are available at EL-MF877-01
To release the
screws on the
support bracket
then remove
the speakers.
Screwd
river(#
1)
*2pcs.
6
To release the
screws and
remove the
Chassis &
Middle Frame..
Screwd
river(#
1)
*1pc *13pcs
7
To rip off
the Gasket
N/A
*4pcs
8