HP E24q G4 Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Monitors & Display
Marketing Name / Model
[List multiple models if applicable.]
E24q G4
HSD-0055-Q
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
I/F Board*1, SPS board*1, Control Board*1, Lens
Board*1
4
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
0
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps Panel*1
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
C605 in SPS Board
1
External electrical cables and cords
HDMI cable*1, DP cable*1, USB cable*1, Power
cord*1
All are inside monitor carton box
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0

Item Description Notes
Quantity of
items
included in
product
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
1
Hexagon Screw Driver
1
Flathead screwdriver
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Press quick release button to separate head and stand.
2. Use screwdriver to loosen the 4 screws and disassemble the rear cover. Use flathead screwdriver to stick up rear cover
bottom and stick up upper-left, upper-right corner with hands, and then open the rear cover.

3. Unplug USB FFC and CTRL BD FFC.
4. Disassemble ctrl BD, USB SHD, USB BD
5. Remove all conductive tape.
6. Remove all insulating tape.
7. Unplug lamp wire, LVDS cable from connector, and disassemble shielding.
AUO
BOE/LG
BOE/LG
AUO

8. Loosen 3 screws on deco, and disassemble deco.
9. Loosen 12 screws on middle frame and disassemble middle frame.
10. Remove the Mylar on the P/BD. Loosen 6 PCBA screws from the PCBA as red circle.
Loosen 2 hexagonal screws from the SHD as yellow circle.
11. Remove all cable on PCBs. Disassemble IF BD and power BD, and then remove all thermal pad and gasket on
shielding.
1
3
2