HP P27q G4 Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category:
Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
Name / Model #1: HP P27q G4 Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Main Board & Power Board & Key Board
3
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
0
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
Power Cord/HDMI cable/VGA cable
3
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
0

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver of "+" type
200mm
Hexagonal nut screw driver for DVI and D-SUB connector
200mm
Scraper
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Lay the monitor on a flat, soft and clean surface. (NOTE: The model using the curved surface screen, avoid crack)
2. Remove the screws by screw driver, to remove base; and then stand.
3. Use scraper to open all the latches along the edge of the Rear Cover;
4. Lift the Rear Cover and disconnect the connector to remove the Rear Cover
5.
6.
7.
8.
9.
10. Separate the panel, bezel and rear cover.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).

1
12. Mechanical Instructions
Step Figure Description
Preparation and
remove the
stand-base
ass'y
Lay the monitor
on a flat, soft
and clean
surface.
Remove the
screws to
remove the
stand-base
assy.
Remove the rear
cover
Remove the
rear cover
Disconnect the
cable and the
tape
Disconnect the
cable and the
tape
Disconnect the
tapes and
remove the
screws. Remove
the Led Board
Disconnect the
tapes and
remove the
screws.
Remove the
LED Board

2
Remove the
screws and
disconnect the
pins.
\
Remove the
screws and
disconnect the
pins.
Remove the
main board and
the power board
Remove the
mylar. remove
the screws to
remove the
main board and
the power
board.

3
Disconnect the
pins
Disconnect the
pins
The Mainframe
The Mainframe

4
Remove the
screws to
remove the key
board
Remove the
screws to
remove the key
board
The Rear Cover
The Rear
Cover

5
The panel and
the bezel
The panel and
the Bezel.