HP LA1*51g Series Installation instructions

EL-MF877-00 Page 1
Template Revision A
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
Name / Model #1 HP LA1951g LCD Monitor
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 4
Batteries All types including standard alkaline and lithium coin
or button style batteries 0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 2
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 1
External electrical cables and cords 4
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0

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Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD) #2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. External Electric Cables Dissecting Process
2. Remove Stand Base From Display
3. Remove Front Cover From Display Head
4. Remove Rear Cover From Display Head
5. Remove Mainframe &Panel
6. Take Screw off From Power Bd & Main Bd & USB Bd & Remove Mainframe
7. Remove Stand Cover From Stand&Base
8. Remove Base Cover From Stand&Base
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP- LA1x51g Disassembly
Process
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1.Remove Cable From Display Head. 2.Dissecting To Complete.
External Electric Cables Dissecting Process
Power CableUSB Cable

3
41
2
Remove Stand Base From Display
1.Take Screw(*4)From Stand & Remove Stand Base
Form Display. 2.Take Screw(*4)From Rear Cover.
4
3
2
1

Remove Front &Rear Cover From Display Head
1.Both Hands Upwardly Pull Up.
2. Toward the arrowhead , take the KEPC
board from the Front Cover. 3. Remove Front Cover.

1.Remove Connector off from KEPC board.
Remove Mainframe &Panel
3.Take Screw(*2)From Mainframe.
2.Take Screw(*2)From Mainframe.
4.Remove the Conductive Tape from the
Mainframe.

Remove Mainframe &Panel
1. Toward the arrowhead ,Remove the
sheet iron from Mainframe. 2.Remove Connector off from Power board.
3.Remove connector off from Panel. 4.Remove the panel.

Take Screw off From Power Bd & Main Bd
& USB Bd & Remove Mainframe
1.Remove Insulator Sheet off from Mainframe. 2.Remove the Conductive Tape from the
Mainframe.
3.Remove the Conductive Tape from the
Mainframe.

Take Screw off From Power Bd & Main Bd
& USB Bd & Remove Mainframe
2.Take screw(*1) off from Mainboard.
1
3.Take Mainboard off from Mainframe.
4.Remove Connector off from Mainboard
1.Take screw(*4) off from Mainboard.
4
32
1

Take Screw off From Power Bd & Main Bd
& USB Bd & Remove Mainframe
1.Take screw(*2) off from USB board. 2.Take USB board off from Mainframe.
3.Remove Connector off from USB board
1
2

Take Screw off From Power Bd & Main Bd
& USB Bd & Remove Mainframe
1.Take screw(*5) off from Power board. 2.Take Power board off from Mainframe.
3.Dissecting to complete.
1
23
45

Remove Stand&Base Cover From Stand&Base
1. Press down the Stand , push up the Hinge
Cover and remove it. 1.Take screw(*4) off from Stand&Base.
3. Pull off the limit buckle. 4. Dissecting to complete.
13
2 4

Remove Stand&Base Cover From Stand&Base
1. Remove the Front Stand Cover.
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24
3.Take screw(*4) off from Rear Stand Cover.
2. Toward the arrowhead , pull over Rear
Stand Cover.

Remove Stand&Base Cover From Stand&Base
1.Use tools, let the rubber melt, and remove
VESA Cover. 1.Turn VESA , and remove Front Stand
Cover.
1
3.Take screw(*1) off ,and remove Rear Stand
Cover. 4.Dissecting To Complete.

Remove Stand&Base Cover From Stand&Base
1. Pull Rear Hinge Cover, and remove it. 2. Remove Front Hinge Cover.
3.Dissecting To Complete.

Remove Stand&Base Cover From Stand&Base
1. Remove Base foot.
3.Dissecting To Complete.
3.Take screw(*7) off ,and remove Base Trim
Cover.
1
2
345
6
7

Remove Stand&Base Cover From Stand&Base
1.Take screw(*3) off ,and remove Base
Cover.
2
13
2.Dissecting To Complete.