HP OMEN X 25f Installation instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
OMEN X 25f
HSD-0021-Q
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
I/F Board*1, Ctrl Board*1, Ctrl Lens Board*1, LED
Board*1, LED Driver Board*1, G-sync2 Board*1
6
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
0
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps panel*1
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
In adapter
1
External electrical cables and cords
DP cable*1, USB3.0 cable*1, Power cord*1,
Adapter*1
4
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing refractory
ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
1
Hexagon Screw Driver
0
Flathead screwdriver
1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove stand by quick release button to separate the stand and monitor head.
2. Use tool to separate rear cover from monitor head through tear down slot.
3. Use tool to release screw from bucket, then separate bucket and trim from monitor head by hand.Separate top corner first
then pull up the bucket to separate bucket and SHD.
4. Use tool to release screws on SHD, then separate the SHD from monitor head, separate the mylar and thermal pad which on
the SHD. Release two screws on the SHD to separate the release button and springs.
5. Tear the tape from lamp wire ,motor wire ,color sensor wire, then disassemble the lamp wire, motor wire ,color sensor wire,
LVDS FFC*4 and ctrl-BD FFC from connector.

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
6. Release screws on the power board and interface board, then disassemble power-BD and interface-BD from the chassis.
7. Separate the front bezel from the panel, then use tool to release screws to disassemble ctrl-BD and separate the button
and lens from the bezel.
8. Tear the AL-tape on the middle-top side and release side mount screws(*4) to separate chassis and panel, then
disassemble the LVDS FFC and lamp wire from the panel by hand.
9. Separate the colorimeter module from top side on the monitor head by hand.
10. To separate colorimeter module, release screw which on the bracket, then remove the motor, worm, arm. Disassemble the
arm to the front and back cover and remove the color sensor board from the front cover.Remove the position sensor board
from the bracket.
11. Remove the battery which is on the interface board.
12. Remove the gasket, thermal pad and tape on the chassis.
13. Use tool to release screws and separate base
14. Use tool to release screws and separate base cover.
15. Use tool to release screws and separate VESA from stand
16. Use tool to release screws and separate the back cover from stand.
17. Use tool to release screws and separate hinge module.
18. Use tool to release screws and separate QR button.
19. Use tool to release screws and separate lift POM and front cover.
20. Use tool to release screws and separate hinge shield.
21. Use tool to release screws and separate constant force springs from hinge shield.
22. Use tool to release screws and separate the site of constant force springs.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
1. Use tool to release screw from stand hinge then separate stand and monitor head.
2. Use tool to release screws.

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
3. Use tool to separate rear cover from monitor head through tear down slot.
4. Use tool to release screw bezel trin, then separate bezel trin plastic, lens and bezle trin SHD.

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
5. Separate rear cover by hand.

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
6. Separate ctrl FFC & stand LED FFC
7. Use tool to release screw, then separate ctrl PCB, stand LED PCB and power LED PCB from rear cover.

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
8. Separate internal and release tape *3, power wire and LVDC FFC

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
9. Use tool to release screw, then separate middle frame.
10. Use tool to release screw, then separate interface PCB and LED driver PCB
11. Remove the screws form column, and separate plastic part.
12. Remove cable clip.

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01

EL-MF877-00 Page 10
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
13. Remove the screw from hook, and remove hook.
14. Remove the screw from BKT, and remove life module, and disassemble lift module.

EL-MF877-00 Page 11
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
15. Remove the rubber from base.