EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
6. Release screws on the power board and interface board, then disassemble power-BD and interface-BD from the chassis.
7. Separate the front bezel from the panel, then use tool to release screws to disassemble ctrl-BD and separate the button
and lens from the bezel.
8. Tear the AL-tape on the middle-top side and release side mount screws(*4) to separate chassis and panel, then
disassemble the LVDS FFC and lamp wire from the panel by hand.
9. Separate the colorimeter module from top side on the monitor head by hand.
10. To separate colorimeter module, release screw which on the bracket, then remove the motor, worm, arm. Disassemble the
arm to the front and back cover and remove the color sensor board from the front cover.Remove the position sensor board
from the bracket.
11. Remove the battery which is on the interface board.
12. Remove the gasket, thermal pad and tape on the chassis.
13. Use tool to release screws and separate base
14. Use tool to release screws and separate base cover.
15. Use tool to release screws and separate VESA from stand
16. Use tool to release screws and separate the back cover from stand.
17. Use tool to release screws and separate hinge module.
18. Use tool to release screws and separate QR button.
19. Use tool to release screws and separate lift POM and front cover.
20. Use tool to release screws and separate hinge shield.
21. Use tool to release screws and separate constant force springs from hinge shield.
22. Use tool to release screws and separate the site of constant force springs.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
1. Use tool to release screw from stand hinge then separate stand and monitor head.
2. Use tool to release screws.
