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HP S2032a Installation instructions

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EL-MF877-00 Page 1
Template Revision A
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP S2032a LCD Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
2
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
2
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
EL-MF877-00 Page 2
Template Revision A
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD)
#2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. External Electric Cables Dissecting Process
2. Remove Stand Base From Display Head
3. Remove Rear Cover From Display Head
4. Remove Front Cover From Display Head
5. Remove Key Board Off From Front Cover
6. Take Screw(x9)Off From Chassis Cover
7. Remove Interface BD and Power BD From Chassis
8. Explode Stand Base
9. Take Screw(x3) Off From P.C.B
10. LCD PANEL EXPLODE
11. Electrolytic Capacitors Over 25mm High& Diameter Dissecting Process
12. Electrolytic Capacitors Process Drawing
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
HP S2032a Disassembly Process
Jan-19-2010
External Electric Cables Dissecting Process
1.Remove Cable From Display Head.2.Dissecting To Complete.
Power Cord
VGA Cable
Remove Stand Base From Display Head
2. Remove Stand Base From Display Head.
1. Take screw(x3) off from display head
Remove Rear Cover From Display Head
1. Take screw(x1) off from display head
Remove Front Cover From Display Head
5. Remove Front Cover.
1.Remove light pipe Connector 2.Remove two pieces of AI foil
3.Remove FFC Connector
4.Remove key BD Connector from Interface BD
Remove Key Board Off From Front Cover
1. Take Screw(x2) Off From Front Cover
2. Remove key board from FC
Take Screw(x9) Off From Chassis Cover
1. Take screw (X5) off from Interface BD and Power BD
2. Take screw (X4) off from Interface BD and Power BD
Remove Interface BD and Power BD From Chassis Cover
1.Remove interface BD and power BD from chassis
cover
2.Remove rubber and sponge from chassis cover