HP V221p Installation instructions

Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP V221p 21.5-inch LED Backlit LCD Monitor
:
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
2
External electrical cables and cords
2
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
200mm
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
200mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of rear cover;
2. Dismantle the stand & base of monitor;
3. Dismantle the cover of monitor;
4. Dismantle the button，pull out the pin of KEPC board ,get down the KEPC board;
5. Dismantle BEZEL;
6. Pull out the PIN of lamp;
7. Pull out the PIN of LVDS cable，separate the mainframe and PANEL;
8. Dismantle mainframe;
9. Dismantle the power board screws;
10. Dismantle the VGA and DVI screws;
11. First: Tear off the adhesive tape;
12. Second: Pull out the connector PIN which connect PWPC and main board;
13. Third: Take off both boards;
14. Pull out the pin of KEPC cable;
15.
16.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01

1
HP 21.5 Disassembly Process

2
External ElectricCables DissectingProcess
1.RemoveCable From Display Head. 2.Dissecting to Complete.
Power Cable
D-SUB &DVI Cable
AUDIO Cable

3
Remove Stand Base From Display
3
41
2
1.TakeScrew(*5) from RearCover. 2. Demount Stand & RemoveStand Base Form
Display.
5

4
Remove Rear Cover From DisplayHead
1.Both Hands Upwardly Pull Up.
3. Toward the arrowhead , take the
RearCoverfrom the Front Cover. 4. RemoveRear Cover.
3
1
2
2.Turn overDisplay Head.

5
Remove KEPC board From Front Cover
1. Take the KEPC assembly from the Front
Cover. 2.Remove Connectoroff from KEPC board
and disassemble KEPC assembly .

6
Remove Mainframe &Panel
1. Remove Connector off from Power
board & Panel. 2.Remove the Conductive Tape from theMainframe.
3.Remove Mainframe & Panel. 4.Removethe connecting wire

7
Remove Front Cover &Panel
1.Turn over Panel, and remove the Front
Coveroff from Panel.
2. Dissecting to complete.
3. Demount BRACKET-L& BRACKET-R Form
LNT panel.
Direct at the LNT panel Modle

8
Take Screw off From Mainframe Assembly
1.TakeScrew(*4or 2) from Mainframe.
3. Take Screw(*6) from Power Bd & Main Bd .
2.Tearoff Mylar form mainframe

9
Remove Mainframe & Barod
1. Direct at the Modle have Audio
function:
Remove the Audio Connector off from
PowerBd .
2.Remove the Power Bd & Main Bd off
from Mainframe. 3.Remove the connecting wire off from PowerBd & Main Bd .

10
Remove Audio & Mainframe
Direct at the Modle have Audio function:
1. Take Mainframe, remove the Audio
off from Mainframe.
2. Dissecting to complete.

11
Remove Stand & Base
1.Take Stand assembly.
2. Pinch the limit RIB of Base. 3. Remove the Stand off from the
Base.

12
Remove hinge&stand
1. Take screw(*2) off, and remove the Hinge
off from the Stand. 2. Dissecting to complete.

13
ThankYou