HP V223hz Installation instructions

Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP V223hz 21.5-inch LED Backlit Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
11
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
1
External electrical cables and cords
4
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
200mm
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
200mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the monitor on a flat, soft and clean surface. .
2. Remove the screw in red to remove the stand.
3. Remove the aluminum foil/the black tape and remove the key board.
4. Remove the pin.
5. Remove the screws.
6. Remove the mainframe
7. Remove the MYLAR and tape.
8. Remove the screws in the red to remove the main board and power board
9. Remove the connect pin
10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Pls. refer the attached:
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01

1
11. Mechanical Instructions
Step Figure Description
Preparation
Lay the monitor
on a flat, soft
and clean
surface.
Remove the
stand-base
assy
Remove the
screws to
remove the
stand-base
assy.
Remove the
mylar /the
black tape
Remove the
mylar /the black
tape

2
Remove the
pins
Remove the
pins.
Remove the
screws
Remove the
screws.
Remove the
mainframe
Remove the
mainframe.

3
Remove the
mylar and the
black tape
Remove the
mylar and the
black tape
Remove the
main board
and power
board
Remove the
screws in the
red to remove
the main board
and power
board
Remove the
connectors
Remove the
connect pins

4
The
mainframe
The mainframe
Panel
Panel
Bezel
Bezel