HP Z24nf Installation instructions

EL-MF877-00 Page 1
Template Revision A
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP Z24nf 23.8-inch Narrow Bezel IPS Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Function key BD, IF BD, POWER BD
3
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps Panel
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Power BD only (C805)
1
External electrical cables and cords
USB cable, Display cable, Power cord
3
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0

EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD)
#0
Description #2 SCREW DRIVER(PHILLIPS HEAD)
#1
Description #3 SCREW DRIVER(PHILLIPS HEAD)
#2
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Stand Base From Display Head
2. Remove Rear Cover From Display Head
3. Remove Front Cover From Display Head
4. Remove Key Board Off From Front Cover
5. Disassemble Front Cover ASSY
6. Disassemble Rear Cover ASSY
7. Take Screw(*4) Off From Chassis Cover & Remove Panel
8. Take Screw(x9) Off From P.C.B
9. Take Screw(x6) Off From P.C.B
10. Take Off P.C.B From Chassis& Remove BKT (Printed Circuit Assemblies>10cm**2)
11. Remove Mylar From Chassis Cover
12. Remove Gasket From Chassis Cover
13. LCD PANEL EXPLODE
14. Remove VESA Cover&Pivot Cover off Stand Base
15. Remove Riser Lift Cover off Stand Base
16. Remove Base Cover & Base Cover BKT Off Stand Base
17. Remove Stand Front Cover off Stand BKT
18. Remove Stand Rear Cover Off Stand BKT
19. Remove Vesa Cover Assy Off Stand BKT
20. Remove Vesa Cover Off VESA BKT
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP Z24nf Disassembly Process
Alex Wang
Mechanical Engineer
March-10-2015

2
Pick up display head
Pick up display head.

3
Remove Stand Base From Display Head

4
Remove Rear Cover From Display Head.
Remove Rear Cover From Display Head
Remove four wall mount screws from display head .
Rear cover

5
Remove Front Cover From Display Head
Remove Front Cover.
Remove Connector
Remove two front cover screws from two side.
Front cover

6
Disassembly front coverASSY
Disassembly front cover assembly.
FC bracket
FC plastic
Key mylar
Acetate tape
EVA
Key mylar
touch key

7
Disassemble Middle CoverASSY
2.Remove 12 pcs screws from middle cover.
Middle cover
1.Remove connector from panel.

8
1.Remove top side two screw. 2.Take off the LVDS.
Disassembly bracket ASSY
Chassis

9
Disassemble Panel mylar
Panel mylar
Remove the panel mylar.

10
Disassembly display movement
AC Switch
AC socket
IF board
Power board
Bracket
Take Screw(x15) Off From P.C.B

11
Remove VESA Cover, pivot cover off
Take 3 screws off
Take 2 screws off

12
Remove Riser Lift cover off

13
Remove Base Cover & Base Cover BKT Off
Take 4 Rubbers off
Take 4 Screws off

14
Remove Stand Front Cover Off

15
Remove Stand Front Cover Off
Take 5 Screws off