HP Z27i Installation instructions

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Product End-of-Life Disassembly Instructions
Product Category: Monitors
Marketing Name / Model
[List multiple models if applicable.]
HP Z27i 27-inch IPS Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Interface board, power board, control board, USB
board
4
Batteries All types including standard alkaline and lithium coin
or button style batteries 0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
power board
1
External electrical cables and cords DVI cable*1, Power cord*1, USB cable*1, DP
cable*1
All are inside monitor carton box
4
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0

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including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
Hexagonal inserted handle box wrench
Diagonal cutting nippers
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use tool to separate head and stand.
2. Use tool to release screws and disassemble the rear cover by hand.
3. Separate rubber and RC by hand.
4. Tear AL-tape and acrylic adhesive tape off and separate FFC wire from connecter.
5. Remove USB SHD and use tool to release screw.--> Separate USB BD from Main Chassis.
6. Take the lamp wire off from panel and use tool to release side mount screws.
7. Use tool to release screws on PCBs. Then tear down the gaskets, rubber and AL tapes on main chassis and separate
all connector on PCBs.
8. Use tool to release screws on CTRL BD and take Ctrl BD off from assy-BZL.
9. Use tool to separate OSD-BTN and PWR-BTN parts from BZL. And use pin at back side to separate the logo.
10. Use tool to release screws and separate VESA BKT from stand.
11. Separate cable clip from stand by hand.
12. Separate Lift front CVR from stand by hand and use tool to release screws --> separate Lift back CVR from stand.
13. Use tool to release screws --> separate tilt CVR from stand.
14. Separate Clum front CVR from stand by hand and use tool to release screws --> separate Clum back CVR from stand.
15. Tear all rubbers and release screws on base.
16. There are capacitors on Interface BD , PWR BD and USB BD
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Step 1 :Use quick release button to separate head and stand.
Step 2 : Use tool to release screws and disassemble the rear cover by hand..

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Step 3 : Separate information card and RC by hand.
Step 4 : Use tool to release screws and disassemble quick release button and slider by hand.
Step 5 : Remove the LVDS cable adhesive tape and eparate assy-BZL and internal.

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Step 6 :. Remove USB SHD and use tool to release screw.--> Separate USB BD from Main Chassis.
Step 7 : Take the lamp wire off from panel and use tool to release side mount screws.

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Step 8 : Use tool to release screws on PCBs. Then tear down the gaskets, rubber and AL tapes on main chassis and separate all
connector on PCBs.
Step 9: Use tool to release screws on CTRL BD and take Ctrl BD off from assy-BZL.

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Step 10: Use tool to separate OSD-BTN and PWR-BTN parts from BZL. And use pin at back side to separate the logo.

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Step11: Use tool to release screws and separate base
Step12: Use tool to release screws and separate base cover and base SHD

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Step13: Use tool to release screws and separate VESA from stand
Step14 : Use tool to release screws and separate VESA BKT and VESA cover

Step15 : Disassemble the middle cover by hand
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Step16 : Disassemble the front cover and back cover by hand

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Step17: Use tool to release screws and separate middle BKT ..
Step18: Use tool to release screws and separate Assy-slider

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Step19: Use tool to release screws and separate back cover