HP E-MSM466-R Assembly instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP E-MSM466-R Dual Radio 802.11n AP (AM) (J9715A)
HP E-MSM466-R Dual Radio 802.11n AP (WW) (J9716A)
HP E-MSM466-R Dual Radio 802.11n AP (JP) (J9717A)
HP E-MSM466-R Dual Radio 802.11n AP (IL) (J9718A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 4
Batteries All types including standard alkaline and lithium coin
or button style batteries 0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) Capacitor ,Ceramic Capacitor 600
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
screw driver #2
screw driver T20
screw driver Hex
Sleeve 8mm
screw driver #1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Screw off 14 86.0RNAA.021 screws on the enclosre.
2. Remove RF cable and screw off the N-type connector
3. Remove cable onnector between main board and surge board
4. Screw off 14 86.RAWC1.003 screws and remove bracket adapter
5. Remove heater from surge board
6. Screw off 4 86.0RNAA.019 screws to remove surge board from barcket adapter
7. Remove RF module
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).