HP HSR6602-G Installation instructions

Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP HSR6602-G Router(JG353A)
HP HSR6602-XG Router(JG354A)
HP HSR6602-G TAA-compliant Router(JG776A)
HP HSR6602-XG TAA-compliant Router((JG777A))
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
tweezers
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.
2. Unscrew the screws on mounting angle 2, and then remove the mounting angle 2.
3. Remove all of the labels.
4. Unscrew the screws on fan-assembly 3, and then remove the fan-assembly 3.
5. Unscrew the screws on power mask 4, and then remove the power mask 4.
6. Remove the blank panel 5.
7. Unscrew the screws on top cover 6, and remove the top cover 6.
8. Unscrew the screws on power bracket 7, and then remove power bracket 7.
9. Unscrew the screws on PCB 8, and then remove PCB 8.
10. Unscrew the screws on PCB 9, and remove PCB 9.
11. Unscrew the screws on PCB 10, and remove PCB 10.
12. Remove shielding fingers 11.
13. Unscrew all the screws on the fan-assembly 3, and remove PCB 3.4.
14. Clear the yellow adhesive, if had, by the tweezers.
15. Pry the button battery up from socket.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
Figure 1Remove the mounting angle 2Figure 2 Treatments to rear panel
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Figure 3Remove top cover 6 and PCB 8 Figure 4 Remove PCB 9 and PCB 10
Figure 5 Treatments to Fan assembly 3
Figure 6 Clear the yellow adhesives by the tweezers Figure 7 Pry up the button battery
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3.3 Material of the facility built
Facility Components Material Weight(g) Weight percentage
Selective treatment for materials
and components
Details
1
Fe
84
0.8%
Fe recycling
2
Fe
150
1.4%
Fe recycling
3
3.1
Fe
42
0.4%
Fe recycling
3.2
Fe
41
0.4%
Fe recycling
3.3
Cable
10
0.1%
3.4 Complex PCB 10 0.1%
The surface of PCB is greater
than 10 square centimeters;
3.5
Fe
383
3.6%
Fe recycling
3.6
PC
50*5
2.4%
4
Fe
96*2
1.8%
Fe recycling
5
Fe
313
3.0%
Fe recycling
6
Fe
2515
23.7%
Fe recycling
7
Fe
759
7.2%
Fe recycling
8 Complex PCB 100 0.9%
The surface of PCB is greater
than 10 square centimeters;
9 Complex PCB 250 2.4%
The surface of PCB is greater
than 10 square centimeters;
10 Complex PCB 1200 11.3%
The surface of PCB is greater
than 10 square centimeters;
11
Be-Cu
6
0.1%
Cu recycling
12
Fe
4300
40.5%
Fe recycling
4. Revised record
Date
Version
Author
Modify content
2012.11.21
V0
Wu Xuejun
Initial version
2013.07.19
V1
Liu Ziye
Add the module JG776A and JG777A
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