HP Aruba 4100i Installation instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking
Marketing Name / Model
[List multiple models if applicable.]
HPE Aruba 4100i 24G CL4/6 POE 4SFP+ Sw (JL818A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
1544
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
7
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips screwdriver #2
M3
Hexagon screwdriver
M3
Phillips screwdriver #1
M3 M2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the Plastic Protectors cover, and terminal conn.
1. Using a Phillips screwdriver #2, remove the screws attaching the terminal
2. Remove the M4 screws on both sides
1. Using a Phillips screwdriver, remove the screws attaching the M4 screws on both sides 16PCS
3. Remove the top cover
1. Using a Phillips screwdriver #1, remove the screws attaching the top cover side 10pcs.
2. Using a Phillips screwdriver #1, remove the screws attaching the top cover right side 3pcs
3. Using a Phillips screwdriver #1, remove the screws attaching the top cover left side 3pcs
4. Using a Phillips screwdriver #1, remove the screws attaching the top cover back side 5pcs
5. Using a Phillips screwdriver #1, slightly loosen the screws attaching the top cover right side 4pcs
6. Using a Phillips screwdriver #1, slightly loosen the screws attaching the top cover left side 4pcs
7. Using a Phillips screwdriver #2, remove the screws attaching the heat sink top side 4pcs
8. Lift upward to remove cover the chassis. (heat sink together)

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
4. Remove the Led board
1. Remove led cable
2.Using a Phillips screwdriver #1, remove the screws attaching the led board 2pcs
5. Remove the riser bracket
1. Using a Phillips screwdriver #2, remove the screws attaching the riser bracket 3pcs
6. Remove the one power supplies
1. Disconnect AC inlet & main PCBA cable connections.
2. Using a Phillips screwdriver #2, remove the screws attaching the power.
7. Remove the main board PCBA assembly
1. Using a Phillips screwdriver #2, remove the screws attaching the PCBA.
8. Remove the main PCBA
9. 9-Finish
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 6
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 8
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01