Huawei EM770 Owner's manual

ProductSpecification
HUAWEI EM770 HSPAPCEmbedded Module
V100R001
Issue 01
Date 2008-09-15
HUAWEITECHNOLOGIES CO., LTD.
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HUAWEIEM770 HSPAPCEmbedded ModuleV100R001
Product Specification
Issue1
(2008-09-15)
Huawei Confidential: This documents is Huawei Proprietary and Confidential(NDA
Required).Itmaynotbe duplicated,neitherdistributedexternallywithout
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About ThisDocument
Summary
Thisdocument providesinformation about themajorfunctions, supported services,
systemarchitecture, andtechnicalreferencesofHUAWEI EM770 HSPAPC
Embedded Module.
Thefollowingtableliststhe contentsofthisdocument.
Chapter Details
1Overview Describesthe basicfunctions, keyfeatures, and
hardwareand softwareoverviewofthe EM770.
2Mechanical
Specifications Describesthe mechanicalspecificationsofthe EM770.
3Electrical
Specifications Describesthe electricalspecificationsofthe EM770.
4RFSpecifications Describesthe RFspecificationsofthe EM770.
5Softwareand Tools Describesthe softwareand toolsofthe EM770.
6.TechnicalReference Describesthe technicalreferencesofthe EM770.
AAcronymsand
Abbreviations Liststhe acronymsand abbreviationsmentioned inthis document.
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HUAWEIEM770 HSPAPCEmbedded ModuleV100R001
Product Specification
Issue1
(2008-09-15)
Huawei Confidential: This documents is Huawei Proprietary and Confidential(NDA
Required).Itmaynotbe duplicated,neitherdistributedexternallywithout
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History
Issue Details Date Author ApprovedBy
01 Creation 2008-09-15 TanXiao'an XieConglong
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HUAWEIEM770 HSPAPCEmbedded ModuleV100R001
Product Specification
Issue1
(2008-09-15)
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Required).Itmaynotbe duplicated,neitherdistributedexternallywithout
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Contents
1Overview.........................................................................................................................7
1.1Introduction.................................................................................................................................7
1.2KeyFeatures...............................................................................................................................8
1.3HardwareOverview.....................................................................................................................9
1.3.1HardwareLogicBlockDiagram...........................................................................................9
1.3.2ExternalHardwareInterfaces............................................................................................10
1.4SoftwareOverview....................................................................................................................12
2Mechanical Specifications...........................................................................................14
2.1Dimensionsand interfaces.........................................................................................................14
2.1.1Dimensionsand interfacesofthe EM770..........................................................................14
2.1.2Dimensionsofthe Mini PCIExpress Connector.................................................................15
2.1.3Dimensionsofthe Antenna Connector...............................................................................16
2.2Reliability...................................................................................................................................18
2.3Temperature..............................................................................................................................18
3Electrical Specifications..............................................................................................19
3.1Mini PCIExpress PinDefinition.................................................................................................19
3.2PinDescriptions........................................................................................................................22
3.2.1DigitalSignal DC Characteristics.......................................................................................22
3.2.2PowerSourcesand Grounds............................................................................................23
3.2.3USBSignals......................................................................................................................23
3.2.4USIMSignals....................................................................................................................23
3.2.5W_DISABLE#Signal.........................................................................................................26
3.2.6LED_WWAN# Signal.........................................................................................................27
3.2.7PERST#Signal.................................................................................................................28
3.2.8NC Pins............................................................................................................................29
3.3PowerSupplyand Consumption................................................................................................29
4RFSpecifications.........................................................................................................32
4.1Operating Frequencies..............................................................................................................32
4.2Conducted Rxsensitivityand Txpower.....................................................................................32
4.3Antenna Design Requirements..................................................................................................33
4.3.1Recommended Indexof the ModuleAntennas...................................................................33
4.3.2Design Recommendations................................................................................................34
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HUAWEIEM770 HSPAPCEmbedded ModuleV100R001
Product Specification
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4.4Offline Mode..............................................................................................................................35
5SoftwareandTools......................................................................................................36
5.1Firmware...................................................................................................................................36
5.1.1Version Descriptions.........................................................................................................36
5.2Drivers......................................................................................................................................36
5.2.1WindowsDrivers...............................................................................................................37
5.2.2LinuxDrivers.....................................................................................................................37
5.3Dashboard................................................................................................................................38
5.3.1WindowsDashboard.........................................................................................................38
5.3.2LinuxDashboard...............................................................................................................40
5.4Tools.........................................................................................................................................40
5.4.1FirmwareUpdateTool.......................................................................................................40
5.4.2ModuleLabelPrint Tool MLT............................................................................................44
5.4.3Engineering Tools.............................................................................................................54
5.4.4Debugging Board..............................................................................................................54
6Technical Reference.....................................................................................................61
6.1Layer1Specifications(Physical)...............................................................................................61
6.2Layer2Specifications(MAC/RLC).............................................................................................61
6.3Layer3Specifications(RRC).....................................................................................................61
6.4Layer3NAS/CoreNetwork (MM/CM)........................................................................................61
6.5GSMProtocol Specifications......................................................................................................62
6.6GPRSProtocolSpecifications....................................................................................................62
6.7General Specifications...............................................................................................................62
6.8Performance/Test Specifications................................................................................................63
6.9SIMSpecifications.....................................................................................................................63
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HUAWEIEM770 HSPAPCEmbedded ModuleV100R001
Product Specification
Issue1
(2008-09-15)
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1 Overview
1.1Introduction
HUAWEI EM770 HSPAPCEmbedded Module(hereinafterreferred toasthe EM770)
isahigh-speed packet access (HSPA)Wireless WideArea Network(WWAN)PC
module. It isamulti-mode wireless terminalforbusiness professionals.
TheEM770 supportsthefollowingstandards:
lHSDPA/HSUPA
lUniversalMobileTelecommunicationsSystem(UMTS)
lEnhanced DataRatesforGlobalEvolution (EDGE)
lGeneralPacket RadioService(GPRS)
lGlobalSystemforMobileCommunications(GSM)
TheEM770 providesthe followingservices:
lHSPA/UMTSpacket dataservice
lEDGE/GPRSpacket dataservice
lWCDMA/GSMshortmessageservice(SMS)
TheEM770 canbeconnectedtoaPCviathe MiniPCI Express interface. Inthe
servicearea ofthe HSPA, UMTS,EDGE, GPRSorGSMnetwork, you cansurfthe
Internet,sendmessagesand emails, and receivemessages/emailscordlessly.The
EM770 isfast, reliable, and easytooperate.Thus, mobileuserscan experience
manynewfeaturesand serviceswiththe EM770. Thesefeaturesand serviceswill
enablealargenumberofuserstousetheEM770andthe averagerevenue peruser
(ARPU)ofoperatorswill increasesubstantially.
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HUAWEIEM770 HSPAPCEmbedded ModuleV100R001
Product Specification
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Figure1-1showsthe profileofthe EM770.
Figure1-1 ProfileoftheEM770
1.2KeyFeatures
Table1-1liststhekeyfeaturesofthe EM770.
Table1-1 KeyfeaturesoftheEM770
EM770
HSPA/UMTS2100MHz √
HSPA/UMTS1900MHz √
HSPA/UMTS1700MHz
HSPA/UMTS900 MHz
HSPA/UMTS850 MHz √
HSPA/UMTS800 MHz
GSM/GPRS/EDGE850/900/1800/1900 MHz √
HSPA equalizerand receivediversity √
HSPA dataserviceofDPA 7.2Mbit/sand UPA 2Mbit/s(5.76Mbit/s
ready) √
UMTSPS domaindataserviceofupto384 kbps √
EDGEpacket dataserviceofupto236.8kbps √
GPRSpacket dataserviceofupto85.6kbps √
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HUAWEIEM770 HSPAPCEmbedded ModuleV100R001
Product Specification
Issue1
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EM770
CSdomaindataservicebased on UMTSandGSM √
SMSbased on the CS/PS domainofGSMand WCDMA √
USSD √
Personalcomputer/Smart card(PC/SC)driver √
MiniPCI Express 1.2interface √
Windows2000/WindowsXP/WindowsVista/Linux2.6.18 orlater
versions √
1.3HardwareOverview
Thehardwareofthe EM770 consistsofthree sections: baseband section, power
management (PM)section, and radiofrequency(RF)section. Externalinterfaces
include theantenna interfaceand the MiniPCI Express interface.
1.3.1 Hardware LogicBlockDiagram
TheEM770 iscompleted on asingle-board. Figure1-2showsthe hardware
functionalblock diagram.
Figure1-2 Hardwarefunctionalblock diagram
Thecircuitryofthe EM770consistsofthree sections: baseband section,RFsection,
and PMsection.
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lThebaseband sectionincludesthe basebandprocessorand SDRAM/flashMCP.
It implementsbaseband signalsprocessing,wirelessprotocols, and
management ofvariousperipheraldevices.
lTheRFsection includesthe RFtransceiver, PA, antenna switches, duplexer,
and antenna interfaces, andit supportsreceivediversity.
lThePMUsection includesPMICand DC-DC circuits, providingthe power
supplyand powermanagement forthe wholemodule.
lTheGPS sectionisoptional.
1.3.2 ExternalHardware Interfaces
1. Antenna interface
TheEM770 hasamainantennaconnectorand anauxiliaryantennaconnector.
Auxiliaryantennaconnector(labeled with Aon the PCB)
Mainantenna connector(labeled with Mon the PCB)
2. MiniPCI Express interface
Theinterfaceofthe EM770isastandardMiniPCI Express interface.TheEM770
consistsofseveralmajorsignals, asshowninthe followingfigure.
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Figure1-3 MiniPCI Express identification
USIMinterface:The USIMinterfaceprovidesthe interfaceforaUSIMcard.
TheUSIMcardcan beinsertedintothe PC.
USB interface:TheUSB interfacesupportsthree modesofUSB 2.0(low
speed, full speed, and highspeed). Becausethereisnot aseparateUSB-
controlled voltagebus, USB functionsimplemented on EM770whichare
expected toreport asself-powered devices.
Auxiliarysignals:Theauxiliarysignalsprovide someotherfunctions.
Powersourcesand grounds: ThePCI Express MiniCardprovidestwopower
sources, includingtheoneat 3.3Vaux(3.3Vaux)andtheoneat1.5V(+1.5V).
TheEM770 usesthe3.3voltageasthepowersupply.
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1.4SoftwareOverview
Figure1-4 Softwarelogicblock diagram
Descriptionsofthe functionalmodulesinthe systemarchitectureareasfollows.
Firmware Drivers
Thefirmwaredriversinclude driversofthe RFmodule, flash, and all the peripherals
suchastheSIMcardand USB device.
PlatformService Subsystem
Theplatformservicesubsysteminitializesprograms, diagnoses, downloadsdata,
and servesasawatchdog.
Application Service Subsystem
Theapplication servicesubsystemconsistsofvariousapplication servicesand a
WCDMA-GSMdualmode protocolstack.Application serviceshandlethe commands
and datasentfromPCside accordingtoservicecategories, and deliverthemto
Dashboard
PCDrivers
ApplicationService
Subsystem FirmwareDrivers
PlatformServiceSubsystem
PC
Firmware
Mini PCIEinterface
Firmware
PCDrivers
Dashboard
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the protocolstack.The protocolstack communicateswiththe networkside toprocess
the commandsand data, and returnsresponsefromnetworktoapplication services.
Finally, application servicesreturnresponsestoPCside.
Themainapplication servicesareasfollows:
lCall management service
lSMSservice
lCS/PS dataservice
PC Drivers
ThePCdriversareused toimplement functionssuchastheinteractionbetween the
dashboardand the firmware.
Dashboard
ThedashboardenablesthePCside todisplaythe interfacesofinitiatingor
answeringacall, and sendingandreceivingmessages. It providesthe interfacefor
CS/PS domainnetworkaccessingand periodicallyrefreshesthe interfaceofthe
current USB modemstatus. Theinterfaceisprovided tothe end users.
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Product Specification
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2 MechanicalSpecifications
2.1 Dimensionsand interfaces
2.1.1 DimensionsandinterfacesoftheEM770
Thedimensionsofthe EM770 are51 mm(length) ×30 mm(width) ×5mm(height),
whichcomplywiththe standarddimensionsspecifiedinthe PCI Express MiniCard
ElectromechanicalSpecificationRevision 1.2. Figure2-1showsthe dimensionsof
the EM770indetails.
Figure2-1 Dimensionsofthe EM770
Figure2-2showsthe appearanceofthe interfacesonthe EM770.
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Figure2-2 AppearanceoftheinterfacesontheEM770
MiniPCI Express connector
It isused toconnect the EM770totheWWANMiniPCI Express interfaceofthe PC.
Screwholes
Theyareusedtofixthe EM770 onthemainboardof the PCwithscrews.
Antenna interfaces
Theyareusedtoconnect toantennas.Auxiliaryantenna and mainantennaare
combined tosupport receivediversity.Thereceivediversitycan strengthen the
received RFsignalqualityand improveRFperformance, andwhethertoopen or
closethe receivediversityfunction can becontrolled bysoftware.
Note:
Westronglyrecommendaddingauxiliaryantenna whenyoudesign PCwiththeEM770.
2.1.2 Dimensionsofthe MiniPCIExpressConnector
TheEM770 adoptsastandardMiniPCI Express connectorthat has52 pinsand
complieswiththe PCI Express MiniCardElectromechanicalSpecification Revision
1.2.
Figure2-3showsa52-pinMiniPCI Express connector(taketheMolex67910002 as
an example).
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Figure2-3 DimensionsoftheMiniPCIExpress connector
2.1.3 Dimensionsofthe AntennaConnector
TheEM770 providesan interfaceforconnectingan externalantenna. Theexternal
antenna isconnected tothemodulethroughthecoaxialconnectorthat istheHirose
U.FL-R-SMT-1(10)(you can get toknowHiroseU.FL-R-SMT-1(10)byvisitingthe
website http://www.hirose-connectors.com/products/U.FL_1.htm).
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Figure2-4 Dimensionsoftheantennaconnector
Figure2-5showsthe specificationsofthe antenna matingconnectors(takethe ones
withthe Hirosepart numberasU.FL-LPasexamples).
Figure2-5 Specificationsoftheantennamatingconnectors
Formoreinformation about HiroseLtd., SMDconnectors, and matingconnectors,
visit the websiteofHirose http://www.hirose-connectors.com.
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2.2Reliability
Table2-1 Requirementson theenvironment reliability
TestCase Standard
Hightemperature IEC60068-2-2
Hightemperature IEC60068-2-1
Randomvibration MIL-STD-810F
-METHOD514.5
Shock vibration ANSI/TIA-603-C-2004 -3.3.5
Operational
Sine sweepvibration ANSI/TIA-603-C-2004 -3.3.4
Hightemperature IEC60068-2-2
Lowtemperature IEC60068-2-1
Dampheat, cyclic IEC60068-2-30
Thermalshock IEC60068-2-14
Salt-fog IEC60068-2-11
Drop IEC60068-2-32
Environment
reliability
Non-
operational
Durability EIA-364-9
2.3Temperature
Description Minimum Maximum Unit
Operatingtemperature 10 +55
Storagetemperature 40 +85
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3 ElectricalSpecifications
3.1Mini PCI ExpressPin Definition
Thephysicalconnectionsand signallevelsofthe EM770 complywithPCI Express
MiniCEMspecifications. DeviceoperationscomplywithUSB 2.0specifications.
Table3-1liststheMiniPCI Express connectorpinsout ofthe EM770.
Table3-1 Definition ofminiPCI Express pins
DefinitionoftheEM770 MiniPCIExpresspins
Pin
No.
MiniPCI
Express
Standard
Description
HUAWEIPin
Description AdditionalDescription Directionto Module
1 WAKE# NC Not connected.
2 3.3Vaux VCC_3V3 3.3VDC supplyrailsfrom
the PCside. Input
3 COEX1 NC Not connected.
4 GND GND MiniCardground.
5 COEX2 NC Not connected.
6 1.5V NC Not connected.
7 CLKREQ# Pull up Pull up
8 UIM_PWR UIM_PWR Powersourceforthe
externalUIM/SIMcard. Output
9 GND GND MiniCardground.
10 UIM_DATA UIM_DATA ExternalUIM/SIMdata
signal. Input/Output
11 REFCLK- NC Not connected.
12 UIM_CLK UIM_CLK ExternalUIM/SIMclock
signal. Output
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DefinitionoftheEM770 MiniPCIExpresspins
Pin
No.
MiniPCI
Express
Standard
Description
HUAWEIPin
Description AdditionalDescription Directionto Module
13 REFCLK+ NC Not connected.
14 UIM_RESET UIM_RESET ExternalUIM/SIMreset
signal.Output
15 GND GND MiniCardground.
16 UIM_Vpp NC Not connected.
17 Reserved NC Not connected.
18 GND GND MiniCardground.
19 Reserved NC Not connected.
20 W_DISABLE# W_DISABLE_
N Forendingthe wireless communications Input
21 GND GND MiniCardground.
22 PERST# PERST# Forforcingahardware
reset on the card. Input
23 PERn0 NC Not connected.
24 3.3Vaux NC Not connected.
25 PERp0 NC Not connected.
26 GND GND MiniCardground.
27 GND GND MiniCardground.
28 1.5V NC Not connected.
29 GND GND MiniCardground.
30 SMB_CLK NC Not connected.
31 PETn0 NC Not connected.
32 SMB_DATA NC Not connected.
33 PETp0 NC Not connected.
34 GND GND MiniCardground.
35 GND GND MiniCardground.
36 USB_D- USB_D- USB signalD-. Input/Output
37 GND GND GND
38 USB_D+ USB_D+ USB signalD+. Input/Output
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