IBM Small J10 Series User manual

IBM Cloud Object Storage System
Version 3.14.12
IBM Small J10 Disk Enclosure Manual
4957-J10/4958-J10
IBM

Note
Before using this information and the product it supports, read the following information:
• The general information in Notices
• The information in Safety and environmental notices
• The information in the IBM Environmental Notices and User Guide (provided on a DVD)
This edition applies to IBM COS Small Disk Enclosure J10 and is valid until replaced by new editions.
© Copyright International Business Machines Corporation , 2020.
US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract with
IBM Corp.

Contents
Figures.................................................................................................................. v
Tables................................................................................................................. vii
Document information.......................................................................................... ix
Safety and environmental notices......................................................................... xi
Safety notices.............................................................................................................................................. xi
Environmental notices...............................................................................................................................xiv
Electromagnetic Compatibility Notices...............................................................................................xiv
Declared noise emissions................................................................................................................... xvii
Support information............................................................................................xix
Chapter 1. Appliance safety precautions................................................................ 1
Physical........................................................................................................................................................ 1
Electrical.......................................................................................................................................................1
Electronic components................................................................................................................................ 1
Chapter 2. System overview.................................................................................. 3
Small disk enclosure.................................................................................................................................... 3
Enclosure conguration............................................................................................................................... 3
Enclosure specications.............................................................................................................................. 5
Enclosure core product................................................................................................................................5
Operator’s (Ops) panel.................................................................................................................................6
Power cooling module (PCM).......................................................................................................................7
I/O module................................................................................................................................................... 9
Drive carrier modules................................................................................................................................ 11
Chapter 3. Installation.........................................................................................15
Installation planning..................................................................................................................................15
Prepare for installing the small disk enclosure.........................................................................................15
Rack mount rail kit..................................................................................................................................... 16
Installing the enclosure.............................................................................................................................17
Power cord connection..............................................................................................................................18
Grounding checks...................................................................................................................................... 18
System congurations............................................................................................................................... 18
SAS cable connections.............................................................................................................................. 19
Chapter 4. Operation........................................................................................... 21
Powering on............................................................................................................................................... 21
Operator’s (Ops) panel.............................................................................................................................. 21
Disk drive LEDs...........................................................................................................................................23
Power off.................................................................................................................................................... 23
Chapter 5. Troubleshooting and problem solving.................................................. 25
Overview.....................................................................................................................................................25
Initial start-up problems........................................................................................................................... 25
iii

LEDs............................................................................................................................................................25
Temperature sensors.................................................................................................................................28
Troubleshooting the small disk enclosure system................................................................................... 29
Dealing with hardware faults.....................................................................................................................31
Continuous operation during replacement............................................................................................... 31
Field Replaceable Units (FRUs) for IBM COS Small Disk Enclosure ........................................................31
Chapter 6. Module removal and installation..........................................................33
Overview.....................................................................................................................................................33
Replacing a PCM........................................................................................................................................ 33
Replacing a drive carrier module...............................................................................................................37
Replacing an I/O module...........................................................................................................................40
Spare parts and ancillary items.................................................................................................................42
Chapter 7. Technical specications...................................................................... 43
Notices................................................................................................................45
Trademarks................................................................................................................................................ 46
Homologation statement...........................................................................................................................47
iv

Figures
1. IBM COS 2U12 Disk Enclosure .....................................................................................................................3
2. IBM COS 2U12 Enclosure System – front view............................................................................................ 4
3. IBM COS 2U12 Enclosure System – rear view ............................................................................................ 4
4. IBM COS Module Locations (2U12) ..............................................................................................................5
5. Enclosure Front Operator’s Panel................................................................................................................. 6
6. 580W Power Cooling Module........................................................................................................................7
7. 580W PCM LEDs............................................................................................................................................ 8
8. 12Gb/s SAS I/O Module................................................................................................................................ 9
9. 12Gb/s SAS I/O Module Connectors and Indicators (viewed from rear of enclosure).............................10
10. Blank I/O Module...................................................................................................................................... 11
11. 3.5” SAS Drive........................................................................................................................................... 12
12. Anti-tamper Lock (3.5” Drive)...................................................................................................................12
13. Anti-tamper Lock (3.5” Drive)...................................................................................................................13
14. How to unpack the small disk enclosure..................................................................................................16
15. Securing brackets to rail........................................................................................................................... 17
16. Typical AC Power Cable Connections to PCMs........................................................................................ 18
17. SAS cable connections..............................................................................................................................19
18. Enclosure Front Operator’s Panel............................................................................................................ 22
19. 3.5” Drive Carrier LEDs............................................................................................................................. 23
20. 3.5" Drive carrier LEDs..............................................................................................................................28
21. Removing a PCM (1 of 2)...........................................................................................................................34
22. Removing a PCM (2 of 2)...........................................................................................................................35
23. Installing a PCM (1 of 2)............................................................................................................................36
v

24. Installing a PCM (2 of 2)............................................................................................................................36
25. Removing a Drive Carrier Module (1 of 2)................................................................................................ 37
26. Removing a Drive Carrier Module (2 of 2)................................................................................................ 38
27. Installing a Drive Carrier Module (1 of 2)................................................................................................. 38
28. Installing a Drive Carrier Module (1 of 2)................................................................................................. 39
29. Engaging a Drive Carrier Module in an Enclosure.....................................................................................39
30. Activating the Anti-tamper Lock...............................................................................................................40
31. I/O Module Latch Operation..................................................................................................................... 40
32. Removing an I/O Module.......................................................................................................................... 41
33. Installing an I/O Module........................................................................................................................... 42
vi

Tables
1. Declared noise emissions in accordance with ISO 9296(1-5)................................................................. xvii
2. IBM COS small disk enclosure variants........................................................................................................ 5
3. Ops Panel LEDs Status.................................................................................................................................. 7
4. LEDs - 580W PCM..........................................................................................................................................8
5. SAS Activity LEDs........................................................................................................................................ 10
6. Module Status LEDS.................................................................................................................................... 10
7. Small disk enclosure conguration.............................................................................................................15
8. Ops Panel LEDs Status................................................................................................................................ 22
9. PSU LED status............................................................................................................................................ 25
10. Ops Panel LED states................................................................................................................................ 26
11. LEDs: Drive carrier LEDs............................................................................................................................28
12. I/O module LED states..............................................................................................................................28
13. Alarm conditions....................................................................................................................................... 29
14. Alarm conditions....................................................................................................................................... 29
15. Thermal monitoring and control...............................................................................................................30
16. Thermal alarm........................................................................................................................................... 30
17. Small disk enclosure dimensions............................................................................................................. 43
18. Small disk enclosure weights................................................................................................................... 43
19. Ambient temperature and humidity......................................................................................................... 43
20. Power cooling module specications.......................................................................................................44
vii

viii

Document information
Intended purpose and audience
This manual contains the instructions for installing and maintaining this appliance. The audience for this
guide consists of those individuals responsible for installing IBM Cloud Object Storage System™
appliances.
Note:
• The equipment and device described for installation herein are sophisticated and relatively complex to
install. The party or parties installing the equipment must be familiar with installations of computer
hardware and disk drives prior to attempting this installation. Only personnel procient in working with
computer hardware and disk drives should attempt to install this appliance.
• After all appliances have been installed in the rack, refer to the Appliance Conguration Guide to
congure the appliance settings required prior to setting up the system.
• After these appliances are congured, refer to the System Manager Administration Guide for information
about how to congure, operate, and maintain your system.
• Both the Appliance Conguration Guide and the System Manager Administration Guide assume that all
necessary appliances for the system are installed in the rack.
© Copyright IBM Corp. , 2020 ix

x IBM Cloud Object Storage System: IBM Small J10 Disk Enclosure Manual

Safety and environmental notices
Review the safety notices, environmental notices, and electronic emission notices for IBM® Cloud Object
Storage System before you install and use the product.
Suitability for telecommunication environment - This product is not intended to connect directly or
indirectly by any means whatsoever to interfaces of public telecommunications networks.
Examples of a caution and a danger notice. Numbers in parentheses refer to message numbers in the IBM
Safety Notices publication G229-9054, which is included with your product.
CAUTION: A caution notice indicates the presence of a hazard that has the potential of causing
moderate or minor personal injury. (C001)
DANGER: A danger notice indicates the presence of a hazard that has the potential of causing
death or serious personal injury. (D002)
Safety notices
Safety notices for this product.
Familiarize yourself with the IBM Safety Notices publication G229-9054, which is included with your
product.
DANGER: When working on or around the system, observe the following precautions:
Electrical voltage and current from power, telephone, and communication cables are hazardous.
To avoid a shock hazard:
• If IBM supplied the power cord(s), connect power to this unit only with the IBM provided power
cord. Do not use the IBM provided power cord for any other product.
• Do not open or service any power supply assembly.
• Do not connect or disconnect any cables or perform installation, maintenance, or reconguration
of this product during an electrical storm.
• The product might be equipped with multiple power cords. To remove all hazardous voltages,
disconnect all power cords.
– For AC power, disconnect all power cords from their AC power source.
– For racks with a DC power distribution panel (PDP), disconnect the customer's DC power
source to the PDP.
• When connecting power to the product ensure all power cables are properly connected.
– For racks with AC power, connect all power cords to a properly wired and grounded electrical
outlet. Ensure that the outlet supplies proper voltage and phase rotation according to the
system rating plate.
– For racks with a DC power distribution panel (PDP), connect the customer's DC power source
to the PDP. Ensure that the proper polarity is used when attaching the DC power and DC power
return wiring.
• Connect any equipment that will be attached to this product to properly wired outlets.
• When possible, use one hand only to connect or disconnect signal cables.
• Never turn on any equipment when there is evidence of re, water, or structural damage.
• Do not attempt to switch on power to the machine until all possible unsafe conditions are
corrected.
• Assume that an electrical safety hazard is present. Perform all continuity, grounding, and power
checks specied during the subsystem installation procedures to ensure that the machine meets
safety requirements.
© Copyright IBM Corp. , 2020 xi

• Do not continue with the inspection if any unsafe conditions are present.
• Before you open the device covers, unless instructed otherwise in the installation and
conguration procedures: Disconnect the attached AC power cords, turn off the applicable
circuit breakers located in the rack power distribution panel (PDP), and disconnect any
telecommunications systems, networks, and modems.
• Connect and disconnect cables as described in the following procedures when installing,
moving, or opening covers on this product or attached devices.
To disconnect:
1. Turn off everything (unless instructed otherwise).
2. For AC power, remove the power cords from the outlets.
3. For racks with a DC power distribution panel (PDP), turn off the circuit breakers located in the
PDP and remove the power from the Customer's DC power source.
4. Remove the signal cables from the connectors.
5. Remove all cables from the devices.
To connect:
1. Turn off everything (unless instructed otherwise).
2. Attach all cables to the devices.
3. Attach the signal cables to the connectors.
4. For AC power, attach the power cords to the outlets.
5. For racks with a DC power distribution panel (PDP), restore the power from the Customer's
DC power source and turn on the circuit breakers located in the PDP.
6. Turn on the devices.
Sharp edges, corners and joints may be present in and around the system. Use care when handling
equipment to avoid cuts, scrapes and pinching. (D005)
CAUTION: The battery contains lithium. To avoid possible explosion, do not burn or charge the
battery.
Do Not:
• Throw or immerse into water
• Heat to more than 100 degrees C (212 degrees F)
• Repair or disassemble
Exchange only with the approved part. Recycle or discard the battery as instructed by local
regulations. In the United States, IBM has a process for the collection of this battery. For
information, call 1-800-426-4333. Have the IBM part number for the battery unit available when
you call. (C003)
DANGER: Observe the following precautions when working on or around your IT rack system:
• Heavy equipment-personal injury or equipment damage might result if mishandled.
• Always lower the leveling pads on the rack cabinet.
• Always install stabilizer brackets on the rack cabinet unless the earthquake option is to be
installed.
• To avoid hazardous conditions due to uneven mechanical loading, always install the heaviest
devices in the bottom of the rack cabinet. Always install servers and optional devices starting
from the bottom of the rack cabinet.
• Rack-mounted devices are not to be used as shelves or work spaces. Do not place objects on top
of rack-mounted devices. In addition, do not lean on rack mounted devices and do not use them
to stabilize your body position (for example, when working from a ladder).
xii IBM Cloud Object Storage System: IBM Small J10 Disk Enclosure Manual

• Each rack cabinet might have more than one power cord.
– For AC powered racks, be sure to disconnect all power cords in the rack cabinet when directed
to disconnect power during servicing.
– For racks with a DC power distribution panel (PDP), turn off the circuit breaker that controls
the power to the system unit(s), or disconnect the customer's DC power source, when
directed to disconnect power during servicing.
• Connect all devices installed in a rack cabinet to power devices installed in the same rack
cabinet. Do not plug a power cord from a device installed in one rack cabinet into a power device
installed in a different rack cabinet.
• An electrical outlet that is not correctly wired could place hazardous voltage on the metal parts
of the system or the devices that attach to the system. It is the responsibility of the customer to
ensure that the outlet is correctly wired and grounded to prevent an electrical shock. (R00l part
1 of 2)
CAUTION:
• Do not install a unit in a rack where the internal rack ambient temperatures will exceed the
manufacturer's recommended ambient temperature for all your rack-mounted devices.
• Do not install a unit in a rack where the air flow is compromised. Ensure that air flow is not
blocked or reduced on any side, front, or back of a unit used for air flow through the unit.
• Consideration should be given to the connection of the equipment to the supply circuit so that
overloading of the circuits does not compromise the supply wiring or overcurrent protection. To
provide the correct power connection to a rack, refer to the rating labels located on the
equipment in the rack to determine the total power requirement of the supply circuit.
• (For sliding drawers.) Do not pull out or install any drawer or feature if the rack stabilizer
brackets are not attached to the rack or if the rack is not bolted to the floor. Do not pull out more
than one drawer at a time. The rack might become unstable if you pull out more than one drawer
at a time.
• (For xed drawers.) This drawer is a xed drawer and must not be moved for servicing unless
specied by the manufacturer. Attempting to move the drawer partially or completely out of the
rack might cause the rack to become unstable or cause the drawer to fall out of the rack. (R001
part 2 of 2)
DANGER: Multiple power cords. The product might be equipped with multiple AC power cords or
multiple DC power cables. To remove all hazardous voltages, disconnect all power cords and
power cables. (L003)
Safety and environmental notices xiii

CAUTION: The weight of this part or unit is between 18 and 32 kg (39.7 and 70.5 lb). It takes two
persons to safely lift this part or unit. (C009)
Environmental notices
This information contains all of the environmental notices for IBM Systems products in English and other
languages.
The IBM Systems Environmental Notices information includes statements on limitations, product
information, product recycling and disposal, battery information, flat panel display, refrigeration and
water-cooling systems, external power supplies, and safety data sheets.
Electromagnetic Compatibility Notices
Class A Notices
The following Class A statements apply to IBM products and their features unless designated as
electromagnetic compatibility (EMC) Class B in the feature information.
When attaching a monitor to the equipment, you must use the designated monitor cable and any
interference suppression devices supplied with the monitor.
Canada Notice
CAN ICES-3 (A)/NMB-3(A)
xiv IBM Cloud Object Storage System: IBM Small J10 Disk Enclosure Manual

European Community and Morocco Notice
Germany Notice
Safety and environmental notices xv

Japan Electronics and Information Technology Industries Association (JEITA) Notice
Japan Voluntary Control Council for Interference (VCCI) Notice
Korea Notice
People's Republic of China Notice
Russia Notice
xvi IBM Cloud Object Storage System: IBM Small J10 Disk Enclosure Manual

Taiwan Notice
United States Federal Communications Commission (FCC) Notice
Declared noise emissions
Declared noise emissions in accordance with ISO 9296(1-5)
Table 1. Declared noise emissions in accordance with ISO 9296(1-5)
Product description
Models: A10, C10, M10, J10,
J11 & J12
Declared A-weighted
sound power level,
LWA,m(B)
Declared A-
Weighted
Sound Pressure
Level,
LpA,m (dB)
Statistical adder for
verication
Kv (B)
Operating Idling Operating Idling Operating Idling
Typical Conguration:
23 ± 2 degrees C, 500m
7.1(6) 7.1(6) 60 60 0.3 0.3
Maximum conguration:
27 degrees C, 500m
7.3(6) 7.3(6) 60 60 0.3 0.3
Safety and environmental notices xvii

Table 1. Declared noise emissions in accordance with ISO 9296(1-5) (continued)
Product description
Models: A10, C10, M10, J10,
J11 & J12
Declared A-weighted
sound power level,
LWA,m(B)
Declared A-
Weighted
Sound Pressure
Level,
LpA,m (dB)
Statistical adder for
verication
Kv (B)
Operating Idling Operating Idling Operating Idling
Maximum conguration:
Worst-case ambient Fan failure
8.7(6) 8.7(6) 74 74 0.3 0.3
Notes:
1. Declared level LWA,m is the upper-limit A-weighted sound power level; Declared level LpA,m is the
mean A-weighted sound pressure level measured at the 1-meter bystander positions.
2. The statistical adder for verication, Kv, is a quantity to be added to the declared mean A-weighted
sound power level, LWA,m such that there will be a 95% probability of acceptance, when using the
verication procedures of ISO 9296, if no more than 6.5% of the batch of new equipment has A-
weighted sound power levels greater than (LWA,m + Kv).
3. The quantity LWAc (formerly called LWAd), can be computed from the sum of LWA,m and Kv.
4. All measurements made in conformance with ISO 7779 and declared in conformance with ISO 9296.
5. B, dB, abbreviations for bels and decibels, respectively. 1 B = 10 dB.
6. Notice: Government regulations (such as those prescribed by OSHA or European Community
Directives) may govern noise level exposure in the workplace and may apply to you and your server
installation. The actual sound pressure levels in your installation depend upon a variety of factors,
including the number of racks in the installation; the size, materials, and conguration of the room
where you designate the racks to be installed; the noise levels from other equipment; the room
ambient temperature, and employees' location in relation to the equipment. Further, compliance
with such government regulations also depends upon a variety of additional factors, including the
duration of employees' exposure and whether employees wear hearing protection. IBM recommends
that you consult with qualied experts in this eld to determine whether you are in compliance with
the applicable regulations.
xviii IBM Cloud Object Storage System: IBM Small J10 Disk Enclosure Manual

Support information
Technical support contacts.
For more information on the product or help with troubleshooting, contact IBM Support at ibm.com/
mysupport or visit the Directory of worldwide contacts.
© Copyright IBM Corp. , 2020 xix

xx IBM Cloud Object Storage System: IBM Small J10 Disk Enclosure Manual