IEI Technology GRAND-RE Series User manual

GRAND-RE Series
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User Manual
Storage Server with AMD Ryzen™ Embedded V1500B CPU,
Up to 32 GB DDR4 RAM, 3.5"/2.5" SATA 6Gb/s SSD Bays,
Two 2.5 GbE, USB 3.2, Rack Mount Chassis, RoHS
GRAND-RE Industrial server
MODEL:MODEL:
GRAND-RE Series
Rev. 1.00 – December 10, 2020

GRAND-RE Series
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Revision
Date Version Changes
December 10, 2020 1.00 Initial release

GRAND-RE Series
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Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.

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Manual Conventions
WARNING
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
CAUTION
Cautionary messages should be heeded to help reduce the chance of
losing data or damaging the product.
NOTE
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help avoid making mistakes.

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Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 OVERVIEW.................................................................................................................. 2
1.2 FEATURES................................................................................................................... 2
1.3 FRONT PANEL............................................................................................................. 3
1.4 REAR PANEL............................................................................................................... 3
1.5 SYSTEM BOARD ......................................................................................................... 4
1.6 SPECIFICATIONS ......................................................................................................... 5
1.7 LED INDICATOR SPECIFICATIONS............................................................................... 6
2 UNPACKING................................................................................................................. 8
2.1 PACKING LIST............................................................................................................. 9
2.2 OPTIONAL ITEMS...................................................................................................... 10
3 INSTALLATION ..........................................................................................................11
3.1ANTI-STATIC PRECAUTIONS...................................................................................... 12
3.2 INSTALLATION PRECAUTIONS................................................................................... 13
3.3 REMOVING THE CASE COVER................................................................................... 14
3.3.1 Reinstalling the Case Cover............................................................................. 15
3.4 MEMORY MODULE INSTALLATION ........................................................................... 16
3.5 EXPANSION CARD INSTALLATION............................................................................. 17
3.6 HARD DRIVE INSTALLATION..................................................................................... 19
3.6.1 Hard Drive Bay Numbering............................................................................. 19
3.6.2 Installing Hard Drive....................................................................................... 19
3.7 POWER-ON PROCEDURE........................................................................................... 21
3.7.1 Installation Checklist....................................................................................... 21
3.7.2 Power-on Procedure ........................................................................................ 22
4 MAINTENANCE......................................................................................................... 23
4.1 COMPONENT REPLACEMENT PROCEDURE ................................................................ 24
4.2 POWER SUPPLY UNIT REPLACEMENT ....................................................................... 25
A REGULATORY COMPLIANCE.............................................................................. 26

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B SAFETY PRECAUTIONS......................................................................................... 31
B.1 SAFETY PRECAUTIONS............................................................................................. 32
B.1.1 General Safety Precautions............................................................................. 32
B.1.2 Anti-static Precautions .................................................................................... 33
B.1.3 Product Disposal............................................................................................. 34
B.2 MAINTENANCE AND CLEANING PRECAUTIONS ........................................................ 35
B.2.1 Maintenance and Cleaning.............................................................................. 35
B.2.2 Cleaning Tools................................................................................................. 35
C HAZARDOUS MATERIALS DISCLOSURE......................................................... 36
C.1 ROHS II DIRECTIVE (2015/863/EU) ....................................................................... 37
C.2 CHINA ROHS........................................................................................................... 38

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List of Figures
Figure 1-1: GRAND-RE Series Storage Server ............................................................................2
Figure 3-1: Case Cover Retention Screws.................................................................................14
Figure 3-2: Remove the Case Cover...........................................................................................14
Figure 3-3: Place the Cover .........................................................................................................15
Figure 3-4: Slide the Cover..........................................................................................................15
Figure 3-5: Tighten Captive Screws............................................................................................16
Figure 3-6: Power Button.............................................................................................................22

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List of Tables
Table 1-1: Specifications ...............................................................................................................5
Table 2-1: Package List..................................................................................................................9
Table 2-2: Optional Items.............................................................................................................10

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Chapter
1
1 Introduction

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1.1 Overview
Figure 1-1: GRAND-RE Series Storage Server
The GRAND-RE series is powered by a high-performance AMD Ryzen™ Embedded
V1500B quad- core 2.2 GHz processor, with up to 32 GB of DDR4 memory. It is
provisioned for expansion with two USB 3.2 Gen 2 Type-C ports, one USB 3.2 Gen 2
Type-A port, and one USB 3.2 Gen 1 Type-A port.
The GRAND-RE supports up to eight SATA drive bays, features two 2.5 Gigabit Ethernet
ports, and one PCIe 3.0 x 8 slot for various applications and expansion options. Encrypted
file transfer performance can be enhanced with AES- NI encryption acceleration.
1.2 Features
The GRAND-RE has the following features
Supports high-performance AMD Ryzen™ quad-core processor
Supports two DDR4 DIMM modules with up to 32 GB DDR4 RAM
Supports one PCIe 3.0 x8 slot for adding more functionality
Two 2.5 Gigabit Ethernet ports
Support up to eight 3.5"/2.5" SATA 6Gb/s HDDs/SSDs

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1.3 Front Panel
1 Power button 4 LAN LED
2 Status LED 5 Drive status LED
3 Expansion unit LED
1.4 Rear Panel
GRAND-RE-08B:
1 PCIe low-profile cover 6 USB 3.2 Gen 1 Type-A port
2 2.5 Gigabit Ethernet activity LED 7 USB 3.2 Gen 2 Type-C ports
3 2.5 Gigabit Ethernet ports 8 USB 3.2 Gen 2 Type-A port
4 2.5 Gigabit Ethernet speed LED 9 Reset button
5 Power input

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GRAND-RE-08B-RP:
1 PCIe low-profile cover 6 Power supply unit 2
2 2.5 Gigabit Ethernet activity LED 7 USB 3.2 Gen 1 Type-A port
3 2.5 Gigabit Ethernet ports 8 USB 3.2 Gen 2 Type-C ports
4 2.5 Gigabit Ethernet speed LED 9 USB 3.2 Gen 2 Type-A port
5 Power supply unit 1 10 Reset button
1.5 System Board
1 PCIe 3.0 x8 slot 3 Memory slot 1
2 Memory slot 2

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1.6 Specifications
The specifications for the GRAND-RE are listed below.
GRAND-RE-08B-RP GRAND-RE-08B
CPU AMD Ryzen™ Embedded V1500B quad-core 2.2 GHz
processor
Encryption Acceleration AES-NI
Memory Maximum 32 GB (2 x 16GB)
2 x DDR4 DIMM slot
Note: For dual-DIMM configuration, you must use a pair of
identical DDR4 modules.
Drive Types 8 x 3.5"/2.5" SATA 6Gb/s HDDs/SSDs
Gigabit LAN Port 2 x 2.5GbE LAN port
PCIe Slot 1 x PCIe Gen 3 x8
USB Ports
1 x USB 3.2 Gen 1 Type-A port,
2 x USB 3.2 Gen 2 Type-C port,
1 x USB 3.2 Gen 2 Type-A port
LED Indicator Status/Power, LAN, Expansion unit, Drive 1 - 8
Button Power, Reset
Form Factor 2U rackmount
Dimension (H x W X D) 89 mm x 482 mm x 425 mm
Net Weight 9.15 kg 8.04 kg
Operating Temperature 0 to 40° C (32° to 104° F)
Relative Humidity 5 ~ 95% RH non-condensing, wet bulb: 27°C
Power Supply Two 300W, 100-240V One 250W, 100-240V
AC, 50/60 Hz AC, 50/60 Hz
Fan 2 x 80 mm 12V DC
Table 1-1: Specifications

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1.7 LED Indicator Specifications
The LED indicators of the GRAND-RE indicate the system status and information. The
following table lists the LED indicator behavior. Note that the following information is
applicable only when users have properly installed the hard drive, and connected the
system to the power supply.
LED Status Description
System Status
Red
The drive is invalid.
The disk volume has reached its full capacity.
The disk volume is about to reach its full capacity.
The system fan is not functioning.
An error occurred when accessing (read/write) the
data.
A bad sector is detected on the hard drive.
Green The system is ready.
Off All drives are in standby mode.
The device is powered off.
LAN Orange A network connection has been established.
Flashes orange The device is being accessed from the network.
2.5 Gigabit
Ethernet speed
Green The network connection is operating at 2.5 Gbps.
Orange
The network connection is operating at 1 Gbps.
The network connection is operating at 100 Mbps.
Off The network connection is operating at 10 Mbps.
2.5 Gigabit
Ethernet activity
Orange A network connection has been established.
Flashes orange The device is being accessed from the network.
Off There is no network connection.
Expansion Unit Blue An expansion unit is connected.
Off No USB or SATA external storage devices connected.

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Drive Status
Red A hard disk drive read/write error occurs.
Flashes green The disk data is being accessed.
Green The hard disk drive can be accessed.
Off No drive was detected

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Chapter
2
2 Unpacking

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2.1 Packing List
NOTE:
If any of the components listed in the checklist below are missing, do
not proceed with the installation. Contact the IEI reseller or vendor the
GRAND-RE was purchased from or contact an IEI sales representative
directly by sending an email to sales@ieiworld.com.
The GRAND-RE is shipped with the following components:
Quantity Item Image
1 Ethernet cable
1 or 2 Power cord
(Non-RP SKUs: 1; RP SKUs: 2)
1 Screw pack for 2.5" HDD installation
1 Screw pack for 3.5" HDD installation
Table 2-1: Package List

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2.2 Optional Items
The following are optional components which may be separately purchased:
Item P/N Description
Network card
QXG-10G2SF-CX4 Dual-port SFP+ 10GbE network card, low-profile,
PCIe 3.0 x8
LAN-10G2T-X550
Dual-port 10GbE network card
Dimension (LxWxH): 260 x 150 x 58 (mm)
Weight: 0.42 (kg)
QXG-10G1T
Single-port 10GbE network card, PCIe 3.0 x4
Dimension (LxWxH): 180 × 110 × 55 (mm)
Weight: 1.00 (kg)
QXG-2G1T-I225 Single-port 2.5GbE network card
QXG-2G2T-I225 Dual-port 2.5GbE network card
QXG-5G2T-111C Dual-port, 4-speed 5GbE network card
USB card QXP-10G2U3A Dual-port USB 3.2 Gen 2 (10Gb/s) Type-A
PCIe 3.0 x2 card, Asmedia ASM3142
SAS card SAS-12G2E Dual-port storage expansion, SAS 12Gb/s
Cable CAB-SAS10M-8644 Mini-SAS cable (SFF-8644 to SFF-8644), 1.0m
CAB-SAS05M-8644 Mini-SAS cable (SFF-8644 to SFF-8644), 0.5m
Rail kit RAIL-B02 Sliding rails for rack mount
RAM
RAM-4GDR4A0-UD-2400 4GB DDR4 RAM, 2400MHz, U-DIMM, 288-pin
RAM-8GDR4A0-UD-2400 8GB DDR4 RAM, 2400MHz, U-DIMM, 288-pin
RAM-16GDR4A0-UD-2400 16GB DDR4 RAM, 2400MHz, U-DIMM, 288-pin
Table 2-2: Optional Items

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Chapter
3
3 Installation

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3.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the maintenance of the GRAND-RE
may result in permanent damage to the GRAND-RE and severe injury to
the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER series motherboard and the power module. (Dry climates are
especially susceptible to ESD.) It is therefore critical that whenever the GRAND-RE is
opened and any electrical component handled, the following anti-static precautions are
strictly adhered to.
Wear an anti-static wristband: Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding: Before handling the board, touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the GRAND-RE, place it on an
anti-static pad. This reduces the possibility of ESD damaging the GRAND-RE.
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