Innodisk SATA Slim 3MG2-P Series User manual

3MG2-P Series
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SATA Slim 3MG2-P
2 Rev 1.9 TPS, Oct.,2017
Table of contents
LIST F FIGURES ........................................................................................................ 6
1. PR DUCT VERVIEW .............................................................................................. 7
1.1 I NTR DUCTI N F I NN DISK SATA S LIM 3MG2-P ...................................................... 7
1.2 P R DUCT V IEW AND M DELS .................................................................................... 7
1.3 SATA I NTERFACE ................................................................................................... 8
1.4 C APACITY ............................................................................................................. 8
1.5 M -297 F RM F ACT R ........................................................................................... 8
2. PR DUCT SPECIFICATI NS ..................................................................................... 9
2.1 C APACITY AND D EVICE P ARAMETERS ........................................................................... 9
2.2 P ERF RMANCE ..................................................................................................... 10
2.3 E LECTRICAL S PECIFICATI NS .................................................................................. 10
2.3.1 Power Requirement ................................................................................... 10
2.3.2 Power Consumption ................................................................................... 11
2.4 E NVIR NMENTAL S PECIFICATI NS ........................................................................... 11
2.4.1 Temperature Ranges ................................................................................. 11
2.4.2 Humidity .................................................................................................... 11
2.4.3 Shock and Vibration ................................................................................... 11
2.4.4 Mean Time between Failures (MTBF) ......................................................... 11
2.5 CE AND FCC C MPATIBILITY .................................................................................. 12
2.6 R HS C MPLIANCE .............................................................................................. 12
2.7 R ELIABILITY ........................................................................................................ 12
2.8 T RANSFER M DE .................................................................................................. 12
2.9 P IN A SSIGNMENT ................................................................................................. 12
2.10 M ECHANICAL D IMENSI NS ................................................................................... 14
2.11 A SSEMBLY W EIGHT ............................................................................................. 14
2.12 S EEK T IME ........................................................................................................ 14
2.13 H T P LUG ......................................................................................................... 14
2.14 NAND F LASH M EM RY ........................................................................................ 14
3. THE RY F PERATI N ........................................................................................ 15
3.1 VERVIEW .......................................................................................................... 15
3.2 SATA III C NTR LLER ......................................................................................... 15
3.3 E RR R D ETECTI N AND C RRECTI N ........................................................................ 16
3.4 W EAR -L EVELING .................................................................................................. 16
3.5 B AD B L CKS M ANAGEMENT ..................................................................................... 16
3.6 I D ATA G UARD ...................................................................................................... 16
3.7 G ARBAGE C LLECTI N /TRIM ................................................................................. 16
3.8 QE RASER F UNCTI N ( PTI NAL ) ............................................................................ 17

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4. INSTALLATI N REQUIREMENTS ............................................................................ 19
4.1 SATA S LIM 3MG2-P P IN D IRECTI NS ..................................................................... 19
4.2 E LECTRICAL C NNECTI NS F R SATA S LIM 3MG2-P .................................................. 19
4.3 D EVICE D RIVE ..................................................................................................... 19
5. SMART FEATURE SET ............................................................................................. 20
6. PART NUMBER RULE .............................................................................................. 22

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R EVISI N H IST RY
Revision Description Date
Preliminary Fir t Relea ed July, 2014
Rev 1.0 Update power con umption
Add CE/FCC
Aug., 2014
Rev 1.1 Remove fla h endurance Jan., 2015
Rev 1.2 Add SMART feature et May, 2015
Rev 1.3 Update performance May, 2015
Rev 1.4 Support Micron MLC Oct., 2015
Rev 1.5 Add Quick era e function (optional) Nov., 2015
Rev 1.6 Add To hiba 15nm Dec., 2015
Rev 1.7 Add To hiba 15nm 512GB performance
Update power con umption
Aug., 2016
Rev 1.8 Update TBW information March, 2017
Rev 1.9 Update LED ignal information
Update RoHS/ REACH declaration of conformity
Oct.,2017

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List of Tables
T ABLE 1: D EVICE PARAMETERS .....................................................................................................................................9
T ABLE 2: P ERF RMANCE ..............................................................................................................................................10
T ABLE 3: I NN DISK SATA S LIM 3MG2-P P WER R EQUIREMENT .................................................................10
T ABLE 4: P WER C NSUMPTI N ...............................................................................................................................11
T ABLE 5: T EMPERATURE RANGE F R SATA S LIM 3MG2-P ...............................................................................11
T ABLE 6: S H CK /V IBRATI N T ESTING F R SATA S LIM 3MG2-P .................................................................11
T ABLE 7: SATA S LIM 3MG2-P MTBF....................................................................................................................12
T ABLE 8: I NN DISK SATA S LIM 3MG2-P P IN A SSIGNMENT ..........................................................................13

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List of Figures
F IGURE 1: I NN DISK SATA S LIM 3MG2-P ............................................................................................................7
F IGURE 2: I NN DISK SATA S LIM 3MG2-P B L CK D IAGRAM .........................................................................15
F IGURE 3: S IGNAL S EGMENT AND P WER S EGMENT ............................................................................................19

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1. Product verview
1.1 Introduction of Innodisk SATA Slim 3MG2-P
Innodi k SATA Slim 3MG2-P provide a totally brand new highly co t-effective SSD olution with
good performance and longer life pan. Cu tomer can pay much le than SLC fla h but embrace
longer life and performance than current MLC fla h IC ba ed SSD olution. SATA Slim 3MG2-P i
a perfect ub titute for traditional HDD, which are applied with an evolved L2 Wear Leveling
Architecture, and ignificantly improve SSD random data tran fer rate and life pan. Furthermore,
SATA Slim 3MG2-P upport TRIM for window 7, it can improve performance when deleting file .
SATA Slim 3MG2-P provide high capacity fla h memory within JEDEC MO-297 pec., which
electrically compatible with Serial ATA (SATA) tandard, and upport SATA III tandard (6.0GHz)
with high performance. It ha good performance; no latency time and mall eek time. It
effectively reduce the booting time of operation y tem and the power con umption i le than
hard di k drive (HDD).
1.2 Product View and Models
Innodi k SATA Slim 3MG2-P i available in follow capacitie within MLC fla h IC .
SATA Slim 3MG2-P 08GB SATA Slim 3MG2-P 64GB
SATA Slim 3MG2-P 16GB SATA Slim 3MG2-P 128GB
SATA Slim 3MG2-P 32GB SATA Slim 3MG2-P 256GB
SATA Slim 3MG2-P 512GB
Figure 1: Innodisk SATA Slim 3MG2-P

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1.3 SATA Interface
SATA Slim 3MG2-P upport SATA III interface, and backward compliant with Serial ATA Gen 1,
Gen 2 and Gen 3 pecification (Gen 3 upport 1.5Gbp /3.0Gbp /6.0Gbp data rate)..
1.4 Capacity
Innodi k SATA Slim 3MG2-P provide unformatted 8GB, 16GB, 32GB, 64GB, 128GB, 256GB and
512GB capacitie within MLC Fla h IC.
1.5 M -297 Form Factor
SATA Slim 3MG2-P ha a compact de ign 54.0mm (W) x 39.0mm (L) x 4.0mm (H) without metal
material ca e, and i ea y for in tallation.

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2. Product Specifications
2.1 Capacity and Device Parameters
SATA Slim 3MG2-P device parameter are hown in Table 1.
Table 1: Device parameters
Capacity LBA Cylinders Heads Sectors
User
Capacity(MB)
8GB 13695696 13587 16 63 6,687
16GB 29323728 16383 16 63 14,318
32GB 60579792 16383 16 63 29,580
64GB 121138416 16383 16 63 59,150
128GB 242255664 16383 16 63 118,289
256GB 484490160 16383 16 63 236,567
512GB 968959152 16383 16 63 473,124

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2.2 Performance
Bur t Tran fer Rate: 6.0Gbp
Table 2: Performance
Capacity 8GB 16GB 32GB 64GB 128GB 256GB 512GB
To hiba
19nm
Sequential Read
(max.) MB/
140 290 530 520 520
N/A
520
Sequential Write
(max.) MB/
20 40 85 160 160 460
4KB Random Read
(QD32) IOPS
16,000 32,000 62,000 85,000 86,000 75,000
4KB Random Write
(QD32) IOPS
5,000 11,000 22,000 43,000 44,000 79,000
To hiba
15nm
Sequential Read
(max.) MB/
140 140* 270** 520 520 530 520
Sequential Write
(max.) MB/
25 25* 45** 90 180 350 460
4KB Random Read
(QD32) IOPS
14,800 14,200* 27,000** 52,900 75,300 75,900 75,300
4KB Random Write
(QD32) IOPS
6,600 6,000* 11,600** 23,700 46,700 83,400 77,700
Micron
Sequential Read
(max.) MB/
N/A
220 430 520 520 520
Sequential Write
(max.) MB/
35 75 145 145 295
4KB Random Read
(QD32) IOPS
21,000 42,000 69,000 69,000 75,000
4KB Random Write
(QD32) IOPS
9,000 19,000 37,000 37,000 74,000
Note: Ba ed on Cry talDi kMark 3.03 with file ize 1000MB
*To hiba 15nm 16GB i 1 channel.
**To hiba 15nm 32GB i 2 channel .
2.3 Electrical Specifications
2.3.1 Power Requirement
Table 3: Innodisk SATA Slim 3MG2-P Power Requirement
Item Symbol Rating Unit
Input voltage V
IN
+5 DC +- 5% V

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2.3.2 Power Consumption
Table 4: Power Consumption
Mode Power Consumption
Read 301 mA (max.)
Write 655 mA (max.)
Idle 114 mA (max.)
DEVSLP Mode 3mW (min.)
Slumber Mode 30mW (min.)
* Target: SATA Slim 3MG2-P 512GB (To hiba 15nm)
2.4 Environmental Specifications
2.4.1 Temperature Ranges
Table 5: Temperature range for SATA Slim 3MG2-P
Temperature Range
Operating Standard Grade: 0°C to +70°C
Indu trial Grade:-40°C to +85°C
Storage -55°C to +95°C
2.4.2 Humidity
Relative Humidity: 10-95%, non-conden ing
2.4.3 Shock and Vibration
Table 6: Shock/Vibration Testing for SATA Slim 3MG2-P
Reliability Test Conditions Reference Standards
Vibration 7 Hz to 2K Hz, 20G, 3 axe IEC 68-2-6
Mechanical Shock Duration: 0.5m , 1500 G, 3 axe IEC 68-2-27
2.4.4 Mean Time between Failures (MTBF)
Table 7 ummarize the MTBF prediction re ult for variou SATA Slim 3MG2-P configuration . The
analy i wa performed u ing a RAM Commander
™
failure rate prediction.
‧ Failure Rate: The total number of failure within an item population, divided by the total
number of life unit expended by that population, during a particular mea urement interval
under tated condition.
‧ Mean Time between Failures (MTBF): A ba ic mea ure of reliability for repairable item :
The mean number of life unit during which all part of the item perform within their pecified
limit , during a particular mea urement interval under tated condition .
‧

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Table 7: SATA Slim 3MG2-P MTBF
Product Condition MTBF (Hours)
Innodi k SATA Slim 3MG2-P Telcordia SR-332 GB, 25°C >3,000,000
2.5 CE and FCC Compatibility
SATA Slim 3MG2-P conform to CE and FCC requirement .
2.6 RoHS Compliance
SATA Slim 3MG2-P i fully compliant with RoHS directive.
2.7 Reliability
Parameter Value
Read Cycle Unlimited Read Cycle
Fla h endurance 3,000 P/E cycle
Wear-Leveling Algorithm Support
Bad Block Management Support
Error Correct Code Support
TBW* (Total Bytes Written) Unit:TB
Capacity Sequential workload Client workload
8GB 21.3 9.4
16GB 42.6 18.8
32GB 85.2 37.5
64GB 170.5 75
128GB 340.9 150
256GB 681.8 300
512GB 1364 600
Note:
1. Sequential: Mainly equential write, te ted by Vdbench
2. Cli
ent: Follow JESD218 Te t method and JESD219A Workload, te ted by ULINK. (The capacity lower
than 64GB client workload i not pecified in JEDEC219A, the value are e timated.)
3. Ba ed on out-of-box performance.
2.8 Transfer Mode
SATA Slim 3MG2-P upport following tran fer mode:
Serial ATA III 6.0Gbp
Serial ATA II 3.0Gbp
Serial ATA I 1.5Gbp
2.9 Pin Assignment
Innodi k SATA Slim 3MG2-P u e a tandard SATA pin-out. See Table 8 for SATA Slim 3MG2-P pin
a ignment.

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Table 8: Innodisk SATA Slim 3MG2-P Pin Assignment
Name Type Description
S1 GND NA
S2 A+
Differential Signal Pair A
S3 A-
S4 GND NA
S5 B-
Differential Signal Pair B
S6 B+
S7 GND NA
Key and Spacing separate signal and power segments
P1 NC NA
P2 NC NA
P3 NC NA
P4 GND NA
P5 GND NA
P6 GND NA
P7 V5 5V Power, Pre-Charge
P8 V5 5V Power
P9 V5 5V Power
P10 GND NA
P11 DAS/DSS
Device Activity Signal / Di able Staggered
P12 GND NA
P13 NC NA
P14 NC NA
P15 NC NA

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2.10 Mechanical Dimensions
2.11 Assembly Weight
An Innodi k SATA Slim 3MG2-P within MLC fla h IC , 32GB’ weight i 40 gram approx. The total
weight of SSD will be le than 50 gram .
2.12 Seek Time
Innodi k SATA Slim 3MG2-P i not a magnetic rotating de ign. There i no eek or rotational
latency required.
2.13 Hot Plug
The SSD upport hot plug function and can be removed or plugged-in during operation. U er ha
to avoid hot plugging the SSD which i configured a boot device and in talled operation y tem.
Surpri e hot plug : The in ertion of a SATA device into a backplane (combine ignal and power)
that ha power pre ent. The device power up and initiate an OOB
equence.
Surpri e hot removal: The removal of a SATA device from a powered backplane, without fir t being
placed in a quie cent tate.
2.14 NAND Flash Memory
Innodi k SATA Slim 3MG2-P u e Multi Level Cell (MLC) NAND fla h memory, which i
non-volatility, high reliability which ha 3,000 program/era e time and high peed memory
torage.

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3. Theory of peration
3.1 verview
Figure 2 how the operation of Innodi k SATA Slim 3MG2-P from the y tem level, including the
major hardware block .
Figure 2: Innodisk SATA Slim 3MG2-P Block Diagram
Innodi k 2 SATA Slim 3MG2-P integrate a SATA III controller and NAND fla h memorie .
Communication with the ho t occur through the ho t interface, u ing the tandard ATA protocol.
Communication with the fla h device( ) occur through the fla h interface.
3.2 SATA III Controller
Innodi k SATA Slim 3MG2-P i de igned with ID 201, a SATA III 6.0Gbp (Gen. 3) controller, which
upport external DDDR3 DRAM. The Serial ATA phy ical, link and tran port layer are compliant
with Serial ATA Gen 1, Gen 2 and Gen 3 pecification (Gen 3 upport 1.5Gbp /3.0Gbp /6.0Gbp
data rate). The controller ha 4 channel for fla h interface.

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3.3 Error Detection and Correction
Highly ophi ticated Error Correction Code algorithm are implemented. The ECC unit con i t of
the Parity Unit (parity-byte generation) and the Syndrome Unit ( yndrome-byte computation).
Thi unit implement an algorithm that can correct 66 bit per 1024 byte in an ECC block.
Code-byte generation during write operation , a well a error detection during read operation, i
implemented on the fly without any peed penaltie .
3.4 Wear-Leveling
Fla h memory can be era ed within a limited number of time . Thi number i called the erase
cycle limit or write endurance limit and i defined by the fla h array vendor. The era e cycle
limit applie to each individual era e block in the fla h device.
Innodi k SATA Slim 3MG2-P u e a tatic wear-leveling algorithm to en ure that con ecutive
write of a pecific ector are not written phy ically to the ame page/block in the fla h. Thi
pread fla h media u age evenly acro all page , thereby extending fla h lifetime.
3.5 Bad Blocks Management
Bad Block are block that contain one or more invalid bit who e reliability are not guaranteed.
The Bad Block may be pre ented while the SSD i hipped, or may develop during the life time of
the SSD. When the Bad Block i detected, it will be flagged, and not be u ed anymore. The SSD
implement Bad Block management, Bad Block replacement, Error Correct Code to avoid data
error occurred. The function will be enabled automatically to tran fer data from Bad Block to
pare block , and correct error bit.
3.6 iData Guard
Innodi k’ iData Guard i a comprehen ive data protection mechani m that function before and
after a udden power outage to SSD. Low-power detection terminate data writing before an
abnormal power-off, while table-remapping after power-on delete corrupt data and maintain
data integrity. Innodi k’ iData Guard provide effective power cycling management, preventing
data tored in fla h from degrading with u e.
3.7 Garbage Collection/TRIM
Garbage collection and TRIM technology i u ed to maintain data con i tency and perform
continual data clean ing on SSD . It run a a background proce , freeing up valuable controller
re ource while orting good data into available block , and deleting bad block . It al o
ignificantly reduce write operation to the drive, thereby increa ing the SSD’ peed and
life pan.

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3.8 QEraser Function ( ptional)
QEra er function i de igned for emergency data era e in few econd by providing ATA command.
3.8.1 QEraser Command FAh-66h
U e to era e data block . When the command i i ued, the fla h i era ed immediately. Thi
command cau e the SSD to era e all u er data block , including any reallocated block , while
retaining all other y tem data and bad block information.
- Protocol: No Data
-Inputs
Table 9: Execute Quick Erase command for inputs information
Regi ter 7 6 5 4 3 2 1 0
Feature 66h
Sector Count Na
LBA Low Na
LBA Mid Na
LBA High Na
Device ob na ob DEV Na
Statu FAh
-Normal utputs
Table 10: Quick Erase command for normal output information
Regi ter 7 6 5 4 3 2 1 0
Error Na
Sector Count Na
LBA Low Na
LBA Mid Na
LBA High Na
Device Na Na Na DEV Na Na Na Na
Statu BSY DRDY Na DSC Na Na Na ERR
Device regi ter-

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DEV hall pecify the elected device.
Statu regi ter
BSY will be cleared to zero indicating command completion
DRDY will be et to one.
DF (Device Fault) will be cleared to zero.
DRQ will be cleared to zero
ERR will be cleared to zero.

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4. Installation Requirements
4.1 SATA Slim 3MG2-P Pin Directions
Figure 3: Signal Segment and Power Segment
4.2 Electrical Connections for SATA Slim 3MG2-P
A Serial ATA device may be either directly connected to a ho t or connected to a ho t through a
cable. For connection via cable, the cable hould be no longer than 1meter. The SATA interface ha
a eparate connector for the power upply. Plea e refer to the pin de cription for further detail .
Additionally, Innodi k SATA Slim 3MG2-P provide LED ignal which indicate power with red light,
and DAS for green light.
4.3 Device Drive
No additional device drive are required. Innodi k SATA Slim 3MG2-P can be configured a a boot
device.

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5. SMART Feature Set
Innodi k 3MG2-P upport the SMART command et and define ome vendor- pecific data to report
SMART attribute of SSD.
Value Command
D0h Read Data
D1h Read Attribute Thre hold
D2h Enable/Di able Auto ave
D3h Save Attribute Value
D4h Execute OFF-LINE Immediate
D5h Read Log
D6h Return Statu
D8h Enable SMART Operation
D9h Di able SMART Operation
DAh Return Statu
5.1 SMART Attributes
Innodi k’ 3MG2-P erie SMART data attribute are li ted in following table.
Attribute
ID (hex)
Raw Attribute Value Attribute Name
1 (01h) MSB 00 00 00 00 00 00 Raw Read Error Rate
5 (05h) LSB MSB 00 00 00 00 00 Reallocated Sector Count
9 (09h) LSB MSB 00 00 00 Power-on Hour
12 (0Ch) LSB MSB 00 00 00 Power Cycle Count