Innodisk 4IG2-P Series User manual

1
4IG2-P Series
Customer:
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Number:
Innodisk
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Date:
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M.2 (P80) 4IG2-P
2 V1.3 TPS, Feb., 2023
Table of contents
1. PRODUCT OVERVIEW .........................................................................................................................................8
1.1 INTRODUCTION OF INNODISK M.2 (P80) 4IG2-P .......................................................................... 8
1.2 PRODUCT VIEW AND MODELS ............................................................................................................... 8
PCIE INTERFACE............................................................................................................................................ 9
2.1 CAPACITY AND DEVICE PARAMETERS................................................................................................... 9
2.2 PERFORMANCE ........................................................................................................................................ 9
2.3 ELECTRICAL SPECIFICATIONS ............................................................................................................. 10
2.3.1 Power Requirement..........................................................................................................................10
2.3.2 Power Consumption .........................................................................................................................10
2.4 ENVIRONMENTAL SPECIFICATIONS .................................................................................................... 10
2.4.1 Temperature Ranges .......................................................................................................................10
2.4.2 Humidity..................................................................................................................................................10
2.4.3 Shock and Vibration .........................................................................................................................10
2.4.4 Mean Time between Failures (MTBF) .................................................................................... 11
2.5 CE AND FCC COMPATIBILITY ............................................................................................................. 11
2.6 ROHS COMPLIANCE ............................................................................................................................. 11
2.7 RELIABILITY ......................................................................................................................................... 11
2.8 TRANSFER MODE .................................................................................................................................. 12
2.10 MECHANICAL DIMENSIONS ............................................................................................................... 14
2.11 ASSEMBLY WEIGHT ........................................................................................................................... 15
2.12 SEEK TIME .......................................................................................................................................... 15
2.13 NAND FLASH MEMORY..................................................................................................................... 15
3. THEORY OF OPERATION.................................................................................................................................16
3.1 OVERVIEW............................................................................................................................................. 16
3.2 PCIE GEN. 4 X4 CONTROLLER............................................................................................................ 16
3.3 ERROR DETECTION AND CORRECTION................................................................................................ 17
3.4 WEAR-LEVELING .................................................................................................................................. 17
3.5 BAD BLOCKS MANAGEMENT ................................................................................................................ 17
3.6 IDATA GUARD ....................................................................................................................................... 17
3.7 GARBAGE COLLECTION/TRIM ........................................................................................................... 17
3.8 THERMAL MANAGEMENT ...................................................................................................................... 18
3.9 IPOWER GUARD.................................................................................................................................... 18
3.10 DIE RAID .......................................................................................................................................... 18
4. INSTALLATION REQUIREMENTS................................................................................................................19
4.1 M.2 (P80) 4IG2-P PIN DIRECTIONS.............................................................................................. 19
4.2 ELECTRICAL CONNECTIONS FOR M.2 (P80) 4IG2-P ..................................................................... 19

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4.3 DEVICE DRIVE ...................................................................................................................................... 19
5. SMART / HEALTH INFORMATION..............................................................................................................20
5.1 GET LOG PAGE (LOG IDENTIFIER 02H)............................................................................................ 20
6. PART NUMBER RULE .........................................................................................................................................25

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4 V1.3 TPS, Feb., 2023
Features:
PCIe Gen. 4x4, NVMe SSD
Innodisk 3D TLC NAND
Support iSLC technology
M.2 2280-D2-M
iPowerguard
iDataguard
Thermal throttling Management
Support End-to-End Data Path
Protection(ETEP)
Performance:
Sequential Read up to 7,100 MB/s
Sequential Write up to 5,200 MB/s
Power Requirements:
Input Voltage:
3.3V±5%
Max Operating
Wattage:
10.2W
Idle Wattage:
2.4W
Reliability:
Capacity
TBW
DWPD
160GB
320GB
640GB
1.28TB
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Data Retention
10 Years
Warranty
5 Years
For warranty details, please refer to:
https://www.innodisk.com/en/support_and_service/warranty

M.2 (P80) 4IG2-P
5 V1.3 TPS, Feb., 2023
REVISION HISTORY
Revision
Description
Date
V1.0
First release
Dec., 2022
V1.1
Add WT information
Jan., 2023
V1.2
Update TBW
Jan., 2023
V1.3
Revise PN rule, Pin Assignment,
performance
Feb., 2023

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List of Tables
TABLE 1: DEVICE PARAMETERS.....................................................................................................................................9
TABLE 2: PERFORMANCE - 112 LAYERS 3D TLC ....................................................................................................9
TABLE 3: INNODISK M.2 (P80) 4IG2-P POWER REQUIREMENT ...................................................................10
TABLE 4: TYPICAL POWER CONSUMPTION ..............................................................................................................10
TABLE 5: TEMPERATURE RANGE FOR M.2 (P80) 4IG2-P .................................................................................10
TABLE 6: SHOCK/VIBRATION TESTING FOR M.2 (P80) 4IG2-P ...................................................................10
TABLE 7: M.2 (P80) 4IG2-P MTBF......................................................................................................................11
TABLE 8: M.2 (P80) 4IG2-P TBW........................................................................................................................11
TABLE 9: INNODISK M.2 (P80) 4IG2-P PIN ASSIGNMENT ............................................................................13
TABLE 10: INNODISK M.2 (P80) 4IG2-P LED INDICATOR ............................................................................13
TABLE 11: GET LOG PAGE – SMART / HEALTH INFORMATION LOG ..............................................................20

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List of Figures
FIGURE 1: INNODISK M.2 (P80) 4IG2-P (STANDARD TEMPERATURE).........................................................8
FIGURE 2: INNODISK M.2 (P80) 4IG2-P (WIDE TEMPERATURE)..................................................................8
FIGURE 3: INNODISK M.2 (P80) 4IG2-P WITH HEAT-SPREADING COPPER LAYER DIAGRAM.................14
FIGURE 4: INNODISK M.2 (P80) 4IG2-P WITH HEAT-SPREADING COPPER LAYER DIAGRAM.................14
FIGURE 5: INNODISK M.2 (P80) 4IG2-P ............................................................................................................15
FIGURE 6: INNODISK M.2 (P80) 4IG2-P BLOCK DIAGRAM ...........................................................................16
FIGURE 7: SIGNAL SEGMENT AND POWER SEGMENT ............................................................................................19

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1. Product Overview
1.1 Introduction of Innodisk M.2 (P80) 4IG2-P
Innodisk M.2 (P80) 4IG2-P is iSLC series which is designed to outdo the endurance, performance
and reliability of 3D TLC-based solutions. Through the use of flash management algorithms, iSLC
improves SSD endurance up to 30,000 times. In addition, iSLC improves the performance of solid
state drives, with similar write performance of SLC-based solutions.
M.2 (P80) 4IG2-P supports PCIe Gen. 4x4, and it is compliant with NVMe 1.4 providing excellent
performance. M.2 (P80) 4IG2-P with heat-spreading design dissipate heat generating from IC
making SSD perform more steady. M.2 (P80) 4IG2-P have Die RAID protection to reduce bad
blocks happening and optimize data integrity.
Innodisk M.2 (P80) 4IG2-P provides ultra-speed and high IOPS and offers maximum capacity up
to 1.28TB, making the SSD optimal for server and heavy data workload applications.
CAUTION TRIM must be enabled.
TRIM enables SSD’s controller to skip invalid data instead of moving. It can free up significant amount of
resources, extends the lifespan of SSD by reducing erase, and write cycles on the SSD. Innodisk’s handling
of garbage collection along with TRIM command improves write performance on SSDs.
1.2 Product View and Models
Innodisk M.2 (P80) 4IG2-P is available in follow capacities within 3D TLC flash ICs.
M.2 (P80) 4IG2-P 160GB
M.2 (P80) 4IG2-P 320GB
M.2 (P80) 4IG2-P 640GB
M.2 (P80) 4IG2-P 1.28TB
Figure 1: Innodisk M.2 (P80) 4IG2-P (Standard Temperature)
Figure 2: Innodisk M.2 (P80) 4IG2-P (Wide Temperature)

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PCIe Interface
Innodisk M.2 (P80) 4IG2-P supports PCIe Gen. 4 interface and compliant with NVMe 1.4. M.2
(P80) 4IG2-P can work under PCIe Gen. 1, Gen. 2, Gen. 3 and Gen. 4.
Most of operating system includes NVMe in-box driver now. For more information about the driver
support in each OS, please visit http://nvmexpress.org/resources/drivers.
2. Product Specifications
2.1 Capacity and Device Parameters
M.2 (P80) 4IG2-P device parameters are shown in Table 1.
Table 1: Device parameters
Capacity
LBA
User Capacity(MB)
160GB
312581808
152627
320GB
625142448
305245
640GB
1250263728
610480
1.28TB
2500506288
1220950
2.2 Performance
Burst Transfer Rate: 8 GB/s
Table 2: Performance - 112 Layers 3D TLC
Capacity
Unit
160GB
320GB
640GB
1.28TB
Sequential**
Read (Q8T1)
MB/s
4,800
7,100
6,700
6,400
Sequential**
Write (Q8T1)
2,080
3,650
3,500
5,200
4KB Random**
Read (Q32T16)
IOPS
374,000
687,000
647,000
774,000
4KB Random**
Write (Q32T16)
534,000
687,000
747,000
672,000
Note: * Performance results are measured in Room Temperature with Out-of-Box devices and may vary depending
on overall system setup.
Note: ** Performance results are based on CrystalDiskMark 7.0.0 with file size 1000MB. Unit of 4KB items is
I.O.P.S.

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2.3 Electrical Specifications
2.3.1 Power Requirement
Table 3: Innodisk M.2 (P80) 4IG2-P Power Requirement
Item
Symbol
Rating
Unit
Input voltage
VIN
+3.3 DC +- 5%
V
2.3.2 Power Consumption
Table 4: Typical Power Consumption
Mode
Power Consumption (W)
Read
8.7
Write
10.2
Idle
2.4
Power-on peak
8.7
Target: 1.28TB M.2 (P80) 4IG2-P
Note: Current results may vary depending on system components and power circuit design
Please refer to the test report for other capacities
2.4 Environmental Specifications
2.4.1 Temperature Ranges
Table 5: Temperature range for M.2 (P80) 4IG2-P
Temperature
Range
Operating
Standard Grade: 0°C to +70°C
Wide Grade: -40°C to +85°C
Storage
-40°C to +85°C SOP
2.4.2 Humidity
Relative Humidity: 10-95%, non-condensing
2.4.3 Shock and Vibration
Table 6: Shock/Vibration Testing for M.2 (P80) 4IG2-P
Reliability
Test Conditions
Reference Standards
Vibration
7 Hz to 2K Hz, 20G, 3 axes
IEC 60068-2-6
Mechanical Shock
Duration: 0.5ms, 1500 G, 3 axes
IEC 60068-2-27

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2.4.4 Mean Time between Failures (MTBF)
Table 7 summarizes the MTBF prediction results for various M.2 (P80) 4IG2-P configurations. The
analysis was performed using a RAM Commander™ failure rate prediction.
‧ Failure Rate: The total number of failures within an item population, divided by the total
number of life units expended by that population, during a particular measurement interval
under stated condition.
‧ Mean Time between Failures (MTBF): A basic measure of reliability for repairable items:
The mean number of life units during which all parts of the item perform within their specified
limits, during a particular measurement interval under stated conditions.
Table 7: M.2 (P80) 4IG2-P MTBF
Product
Condition
MTBF (Hours)
Innodisk M.2 (P80) 4IG2-P
Telcordia SR-332 GB, 25°C
>3,000,000
2.5 CE and FCC Compatibility
M.2 (P80) 4IG2-P conforms to CE and FCC requirements.
2.6 RoHS Compliance
M.2 (P80) 4IG2-P is fully compliant with RoHS directive.
2.7 Reliability
Table 8: M.2 (P80) 4IG2-P TBW
Parameter
Value
Flash endurance
100,000 P/E cycles
Error Correct Code
Support(LDPC)
Data Retention
Under 40˚C:
10 Years at initial NAND Status；1 Year at NAND Life End
TBW* (Total Bytes Written) Unit: TB
Capacity
Sequential workload
Client workload
160GB
14204
TBD
320GB
28409
TBD
640GB
56818
TBD
1.28TB
113636
TBD
* Note:
1. Sequential: Mainly sequential write are estimated by PassMark Burnin Test v8.1 pro.
2. Client: Follow JESD218 Test method and JESD219A Workload, tested by ULINK. (The
capacity lower than 64GB client workload is not specified in JEDEC219A, the values are
estimated.)
3. Based on out-of-box performance.

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2.8 Transfer Mode
M.2 (P80) 4IG2-P support following transfer mode:
PCIe Gen. 4: 8GB/s
PCIe Gen. 3: 4GB/s
PCIe Gen. 2: 2GB/s
PCIe Gen. 1: 1GB/s

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2.9 Pin Assignment
Innodisk M.2 (P80) 4IG2-P follows standard M.2 spec, socket 3, key M PCIe-based SSD pinout.
See Table 9 for M.2 (P80) 4IG2-P pin assignment.
Table 9: Innodisk M.2 (P80) 4IG2-P Pin Assignment
Signal Name
Pin #
Pin #
Signal Name
75
GND
3.3V
74
73
GND
3.3V
72
71
GND
3.3V
70
69
NC
NC
68
67
NC
Notch
66
65
Notch
Notch
64
63
Notch
Notch
62
61
Notch
Notch
60
59
Notch
NC
58
NC
56
57
GND
NC
54
55
REFCLKp
CLKREQ# (I/O)(0/3.3V)
52
53
REFCLKn
PERST# (I)(0/3.3V)
50
51
GND
NC
48
49
PERp0
NC
46
47
PERn0
ALERT
44
45
GND
NC(reserved for
SMB_DATA)(I/O)(O/1.8V)
(I/O)(0/1.8V) (I/O)(0/1.8V)
42
43
PETp0
NC(reserved for SMB_CLK)
40
41
PETn0
GND
38
39
GND
NC
36
37
PERp1
NC
34
35
PERn1
GND
32
33
GND
NC
30
31
PETp1
NC
28
29
PETn1
NC
26
27
GND
NC
24
25
PERp2
NC
22
23
PERn2
NC
20
21
GND
3.3V
18
19
PETp2
3.3V
16
17
PETn2
3.3V
14
15
GND
3.3V
12
13
PERp3
LED#(O)(OD)
10
11
PERn3
NC
8
9
GND
NC
6
7
PETp3
3.3V
4
5
PETn3
3.3V
2
3
GND
1
GND
Table 10: Innodisk M.2 (P80) 4IG2-P LED indicator
LED Color
Function
Green
Power on
Access

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2.10 Mechanical Dimensions
M.2 Type 2280-D2-M with heat-spreading copper layer (Default accessory for Standard-Temperature)
Figure 3: Innodisk M.2 (P80) 4IG2-P with heat-spreading copper layer diagram
M.2 Type 2280-D2-M with heatsink (Default accessory for WT)
Figure 4: Innodisk M.2 (P80) 4IG2-P with heat-spreading copper layer diagram

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M.2 Type 2280-D2-M
Figure 5: Innodisk M.2 (P80) 4IG2-P
2.11 Assembly Weight
An Innodisk M.2 (P80) 4IG2-P within NAND flash ICs, 160GB’s weight is 7 grams approximately.
2.12 Seek Time
Innodisk M.2 (P80) 4IG2-P is not a magnetic rotating design. There is no seek or rotational latency
required.
2.13 NAND Flash Memory
Innodisk M.2 (P80) 4IG2-P uses 3D TLC NAND flash memory, which is non-volatility, high
reliability and high speed memory storage.

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3. Theory of Operation
3.1 Overview
Figure 4 shows the operation of Innodisk M.2 (P80) 4IG2-P from the system level, including the
major hardware blocks.
Figure 6: Innodisk M.2 (P80) 4IG2-P Block Diagram
Innodisk M.2 (P80) 4IG2-P integrates a PCIe Gen. 4x4 controller and NAND flash memories.
Communication with the host occurs through the host interface, using the standard NVM protocol.
Communication with the flash device(s) occurs through the flash interface.
3.2 PCIe Gen. 4 x4 Controller
Innodisk M.2 (P80) 4IG2-P is a PCIe Gen. 4x4 controller is compliant with NVMe 1.4, up to
32.0Gbps transfer speed. Also it is compliant with PCIe Gen. 1, Gen. 2, Gen. 3, and Gen. 4
specification. The controller supports up to 8 channels for flash interface.

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3.3 Error Detection and Correction
Innodisk M.2 (P80) 4IG2-P is designed with hardware LDPC ECC engine with hard-decision and
soft-decision decoding. Low-density parity-check (LDPC) codes have excellent error correcting
performance close to the Shannon limit when decoded with the belief-propagation (BP) algorithm
using soft-decision information.
3.4 Wear-Leveling
Flash memory can be erased within a limited number of times. This number is called the erase
cycle limit or write endurance limit and is defined by the flash array vendor. The erase cycle
limit applies to each individual erase block in the flash device.
Innodisk M.2 (P80) 4IG2-P uses a combination of two types of wear leveling- dynamic and static
wear-leveling to distribute write cycling across an SSD and balance erase count of each block,
thereby extending flash lifetime.
3.5 Bad Blocks Management
Bad Blocks are blocks that contain one or more invalid bits whose reliability are not guaranteed.
The Bad Blocks may be presented while the SSD is shipped, or may develop during the life time
of the SSD. When the Bad Blocks is detected, it will be flagged, and not be used anymore. The
SSD implement Bad Blocks management, Bad Blocks replacement, Error Correct Code to avoid
data error occurred. The functions will be enabled automatically to transfer data from Bad Blocks
to spare blocks, and correct error bit.
3.6 iData Guard
Innodisk’s iData Guard is a comprehensive data protection mechanism that functions before and
after a sudden power outage to the SSD. Low-power detection terminates data writing before an
abnormal power-off, while table-remapping after power-on deletes corrupt data and maintains
data integrity. Innodisk’s iData Guard provides effective power cycling management, preventing
data stored in flash from degrading with use.
3.7 Garbage Collection/TRIM
Garbage collection and TRIM technology is used to maintain data consistency and perform
continual data cleansing on SSDs. It runs as a background process, freeing up valuable controller
resources while sorting good data into available blocks, and deleting bad blocks. It also
significantly reduces write operations to the drive, thereby increasing the SSD’s speed and
lifespan.

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3.8 Thermal Management
M.2 (P80) 4IG2-P has built-in thermal sensor which can detect environment temperature of
SSD. In the meantime, firmware will monitor the thermal sensor to prevent any failure of
overheating. During extreme temperature, firmware will adjust the data transfer behavior to
maintain the SSD’s reliable operation.
3.9 iPower Guard
iPower Guard technology is a set of preventive measures that protect the SSD in an unstable
power supply environment. This comprehensive package comprises safeguards for startup and
shutdown to maintain device performance and ensure data integrity.
3.10 Die RAID
Die RAID is a controller function which leveraged user capacity to back up the data in NAND flash.
Die RAID supported can ensure the user data in the NAND Flash more consistent in certain
scenario. Innodisk M.2 (P80) 4IG2-P series is default enable the Die RAID function for the
industrial application.

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4. Installation Requirements
4.1 M.2 (P80) 4IG2-P Pin Directions
Figure 7: Signal Segment and Power Segment
4.2 Electrical Connections for M.2 (P80) 4IG2-P
M.2 interconnect is based on a 75 position Edge Card connector. The 75 position connector is
intended to be keyed so as to distinguish between families of host interfaces and the various
Sockets used in general Platforms. M.2 (P80) 4IG2-P is compliant with M.2 Socket 3 key M. M.2
(P80) 4IG2-P is compatible with host connector H3.2 or H4.2.
4.3 Device Drive
M.2 (P80) 4IG2-P is compliant with NVMe 1.4. Both Operation System and BIOS should include
NVMe driver to compatible with NVMe device. Nowadays, most of OS includes NVMe in-box
driver now. For more information about the driver support in each OS, please visit the website
http://nvmexpress.org/resources/drivers. For BIOS NVMe driver support please contact with
motherboard manufacture.

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5. SMART / Health Information
This log page is used to provide SMART and general health information. The information
provided is over the life of the controller and is retained across power cycles. More details about
Set Features command; please refer to NVM Express 1.3
5.1 Get Log Page (Log Identifier 02h)
Innodisk 4IG2-P series SMART / Health Information Log are listed in following table.
Table 11: Get Log Page – SMART / Health Information Log
Bytes
Description
0
Critical Warning: This field indicates critical warnings for the state of the
controller. Each bit corresponds to a critical warning type; multiple bits may be
set. If a bit is cleared to ‘0’, then that critical warning does not apply. Critical
warnings may result in an asynchronous event notification to the host. Bits in
this field represent the current associated state and are not persistent.
Bit
Definition
00
If set to ‘1’, then the available spare space has fallen
below the threshold.
01
If set to ‘1’, then a temperature is above an over
temperature threshold or below an under
02
If set to ‘1’, then the NVM subsystem reliability has
been degraded due to significant media related
03
If set to ‘1’, then the media has been placed in read
only mode.
04
If set to ‘1’, then the volatile memory backup device
has failed. This field is only valid if the
07:05
Reserved
2:1
Composite Temperature: Contains a value corresponding to a temperature in
degrees Kelvin that represents the current composite temperature of the
controller and namespace(s) associated with that controller. The manner in
which this value is computed is implementation specific and may not represent
the actual temperature of any physical point in the NVM subsystem. The value of