Inspur NF5280M5 User manual

Inspur Server User Manual
NF5280M5

© Copyright Inspur 2017. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means
without prior written consent of Inspur.
The information in this manual is subject to change without notice.
Inspur is the registered trademark of Inspur. All the other trademarks or registered
trademarks mentioned in this manual are the property of their respective holders.
Edition:1.13
May,2021
Edition Statement:Add numbers and names for some figures and tables.

Abstract
This manual contains technical information such as specifications, hardware operations,
software configuration, fault diagnosis, etc. that are relevant to the maintenance and
operation of this server.
It is recommended that server installation, configuration and maintenance is performed by
experienced technicians only.
Target Audience
This manual is intended for:
●Technical support engineers
●Product maintenance engineers
●Technicians
Warnings
This manual introduces the NF5280M5 server’s technical features, system installaon
and setup, which will help the user to understand how best to ulize the server and all its
funcons.
1. For your safety, please do not disassemble the server’s components arbitrarily. Please do
not extend conguraon or connect other peripheral devices arbitrarily. If needed, please
contact Inspur for our support and guidance.
2. Before disassembling the server’s components, please be sure to disconnect all the power
cords connected to the server.
3. BIOS and BMC setup is a signicant factor in correctly conguring your server. If there
are no special requirements, it is suggested to use the Default Values and not alter the
parameter sengs arbitrarily. Aer the rst login, please change the BMC user password in
me.
4. Please install the product-compable operang system and use the driver provided by
Inspur. If you use an incompable operang system or non-Inspur driver , it may cause
compability issues and aect the normal use of the product, Inspur will not assume any
responsibility or liability.
Inspur is not responsible for any damages, including loss of prots, loss of informaon,
interrupon of business, personal injury, and/or any damage or consequenal damage
without limitaon, incurred before, during, or aer the use of our products.

Contents
1 Safety Instructions......................................................................................................................... 1
2 Product Specifications................................................................................................................... 5
2.1 Introduction................................................................................................................................ 5
2.2 Features and Specifications........................................................................................................ 7
2.3 Compatible Peripherals – AOC Cables........................................................................................ 8
2.4 Power Efficiency ......................................................................................................................... 9
3 Component Identification ............................................................................................................. 11
3.1 Front Panel Components ........................................................................................................... 11
3.2 Rear Panel Components ............................................................................................................. 14
3.3 Motherboard Components......................................................................................................... 16
4 Operations..................................................................................................................................... 18
4.1 Power up the Server................................................................................................................... 18
4.2 Power down the Server.............................................................................................................. 18
4.3 Extend the Server from the Rack................................................................................................ 18
4.4 Remove the Access Panel........................................................................................................... 19
4.5 Remove the Access Panel........................................................................................................... 19
4.6 Install the Access Panel .............................................................................................................. 20
4.7 Remove the PCIE Riser Cage....................................................................................................... 20
4.8 Install the PCIE Riser Cage .......................................................................................................... 21
4.9 Remove the Air Baffle................................................................................................................. 23
4.10 Remove the TPM...................................................................................................................... 23
4.11 M.2 SSD Option ........................................................................................................................ 24
4.12 OCP/PHY Card Option............................................................................................................... 25
5 Setup ............................................................................................................................................. 26
5.1 Optimum Environment............................................................................................................... 26
5.2 Rack Warnings............................................................................................................................ 28
5.3 Identifying the Contents of the Server Shipping Carton.............................................................29
5.4 Installing Hardware Options....................................................................................................... 29
5.5 Installing the Server into the Rack.............................................................................................. 30
5.6 Installing the Operating System.................................................................................................. 30

6 Hardware Options Installation....................................................................................................... 32
6.1 Introduction................................................................................................................................ 32
6.2 Processor Option........................................................................................................................ 32
6.3 Memory Option.......................................................................................................................... 34
6.4 Hot-plug HDD Option ................................................................................................................. 37
6.5 Redundant Hot-plug Power Supply Option ................................................................................38
6.6 Expansion Board Option............................................................................................................. 39
6.7 Air Baffle Option......................................................................................................................... 40
7 Cabling........................................................................................................................................... 42
8 BIOS Setup..................................................................................................................................... 43
8.1 Common Operations .................................................................................................................. 44
8.2 BIOS Parameter Description....................................................................................................... 59
9 BMC Settings ................................................................................................................................ 104
9.1 Introduction................................................................................................................................ 104
9.2 Server System Overview............................................................................................................. 104
9.3 IPMI2.0 ....................................................................................................................................... 106
9.4 Management Web GUI............................................................................................................... 112
9.5 SNMP.......................................................................................................................................... 115
9.6 Smash-Lite CLI ............................................................................................................................ 116
9.7 System Information and State.................................................................................................... 119
9.8 Device State Monitor and Diagnostic......................................................................................... 129
9.9 Logs ............................................................................................................................................ 132
9.10 Event Alerting ........................................................................................................................... 135
9.11 Diagnostics ............................................................................................................................... 137
9.12 BMC Self Recovery.................................................................................................................... 139
9.13 LED............................................................................................................................................ 140
9.14 BMC Network........................................................................................................................... 140
9.15 Users......................................................................................................................................... 143
9.16 Protocols and Ports .................................................................................................................. 150
9.17 Time and NTP ........................................................................................................................... 151
9.18 BIOS and BMC........................................................................................................................... 152
9.19 Storage ..................................................................................................................................... 154
9.20 Server Control........................................................................................................................... 157
9.21 Power Supply and Power Consumption ................................................................................... 158

9.22 Fan Speed Control (FSC) ........................................................................................................... 161
9.23 Firmware Update...................................................................................................................... 162
9.24 Restore Factory Defaults .......................................................................................................... 167
9.25 Serial Over LAN (SOL) and System Serial Log Recording...........................................................168
9.26 Console Redirection(KVM) ....................................................................................................... 169
9.27 Virtual Media............................................................................................................................ 173
9.28 Redfish...................................................................................................................................... 175
9.29 Appendix .................................................................................................................................. 179
10 Common Faults, Diagnosis and Troubleshooting ........................................................................180
10.1 Hardware Problems.................................................................................................................. 180
10.2 Software Problems ................................................................................................................... 183
11 Battery Replacement................................................................................................................... 185
12 Regulatory Compliance Notices................................................................................................... 186
12.1 Regulatory Compliance Identification Numbers....................................................................... 186
12.2 Federal Communications Commission Notice.......................................................................... 186
12.3 European Union Regulatory Notice.......................................................................................... 187
12.4 Disposal of Waste Equipment by Users in the European Union...............................................187
12.5 Korean Notice........................................................................................................................... 188
12.6 Chinese Notice.......................................................................................................................... 188
12.7 Battery Replacement Notice .................................................................................................... 188
12.8 Battery Caution ........................................................................................................................ 189
12.9 Restricted Access Area ............................................................................................................. 190
13 Electrostatic Discharge ................................................................................................................ 191
13.1 Preventing Electrostatic Discharge........................................................................................... 191
13.2 Grounding Methods to Prevent Electrostatic Discharge ..........................................................191
14 Warranty...................................................................................................................................... 192
14.1 Introduction.............................................................................................................................. 192
14.2 Warranty Service ...................................................................................................................... 192
14.3 Warranty Exclusions ................................................................................................................. 193
15 Appendix ..................................................................................................................................... 194
15.1 Drive Neodymium Content Reference...................................................................................... 194

1
Safety Instructions
1 Safety Instructions
WARNING: Please be advised to follow the instructions below for safety. Failure to do so could
result to potential dangers that may cause property loss, personal injury or death.
1. The power supplies in the system may produce high voltages and energy hazards that
may cause personal injury. For your safety, please do not attempt to remove the cover
of the system to remove or replace any component without assistance provided by
Inspur. Only service technicians trained by Inspur are authorized to remove the cover of
the host, and to remove and replace internal components.
2. Please connect the equipment to the appropriate power supply. Use only power
supplies with the correct voltage and electrical specifications according to the label. To
protect your equipment from damages caused by a momentary spike or plunge of the
voltage, please use relevant voltage stabilizing equipment, or uninterruptible power
supplies.
3. If you must use an extension cable, please use a three-core cable with properly
grounded plugs. Observe extension cable ratings. Ensure that the total rating of all
equipment plugged into the extension cable does not exceed 80 percent of the ratings
limit for the extension cable.
4. Please be sure to use the power supply components that come with the server, such as
power cable, power socket (if provided with the server) etc. For your safety, please do
not replace power cables or plugs randomly.
5. To prevent electric shock dangers caused by leakage in the system, please make sure
that the power cables of the system and peripheral equipment are correctly connected
to the earthed/grounded power socket. Please connect the three-core power lcable
plug to the three-core AC power socket that is well earthed and easy to access. Be sure
to use earthing /grounding pin of power cable and do not use the patch plug or the
earthing/grounding pin unplugged with cables. In the case that the earthing/grounding
conductors are not installed and it is uncertain whether there are appropriate earthing/
grounding protections, please do not use or attempt to operate the equipment. Contact
and consult an electrician.
6. Please do not push any objects into the openings of the system. Doing so may cause
fire or electric shock.

2
7. Please place the system far away from the cooling plate and heat sources, and be sure
not to block the air vents.
8. Please be sure not to scatter food or liquid in the system or on other components, and
do not use the product in humid or dusty environments.
9. Using an incompatible battery may cause explosion. When battery replacement is
required, please consult the manufacturer first, and choose batteries of the same or
equivalent type. Do not disassemble, crush, puncture the batteries or make the external
connection point short circuit, and do not expose them in the environment over 60°C.
Never throw batteries into fire or water. Please do not attempt to open or repair the
batteries. Dispose of used batteries according to instructions. For battery recycling,
please contact the local waste recycling center.
10. Before installing equipment into the rack, please install all front and side stabilizers on
the independent rack first. Please install the front stabilizers first, if connecting with
other racks. Please install stabilizers before installing equipment into the rack. Failure to
install the corresponding stabilizers before installing equipment into the rack may cause
the cabinet to tip over, possibly resulting to severe injury. After installing the equipment
and other components into the rack, only one component can be pulled out from the
rack through its sliding part at one time. Pulling out several components at the same
time may cause the rack to turn over, resulting to serious personal injury.
11. A minimum of two people are required to safely move a rack. The racks are extremely
awkward and heavy, moving them without adequate, trained personnel could result in
severe injury or death.
12. It is prohibited to directly short-circuit the copper busbar. Please do not touch the
copper busbar when the rack is powered on.
13. This is Class A product, and may cause radio interference. In such case, users may need
to take necessary measures to mitigate the interference.
14. The equipment is intended for installation in a Restricted Access Location.
Note: The following considerations may help avoid the occurrence of problems that could
damage the components or cause data loss, etc.
1. In the event of the following, please unplug the power cable plug from the power
socket and contact Inspur’s customer service department:

3
Safety Instructions
1) The power cables, extension cables or power plugs are damaged.
2) The products get wet.
3) The products have fallen or have been damaged.
4) Other objects have fallen into the products.
5) The products do not or are unable to function normally even when attempting to
operate according to the instructions.
2. If the system becomes wet or damp, please follow these steps:
1) Power off the equipment, disconnect them with the power socket, wait for 10 to 20
seconds, and then open the host cover.
2) Move the equipment to a well-ventilated place to dry the system at least for 24 hours
and make sure that the system is fully dried.
3) Close the host cover, reconnect the system to the power socket, and then power on.
4) In case of operation failure or other abnormal situations, please contact Inspur and get
technical support.
3. Pay attention to the position of system cables and power cables-avoid placing wires in
high foot traffic locations. Please do not place objects on the cables.
4. Before removing the host cover, and/or touching the internal components, please
allow for the equipment to cool first. To avoid damaging the motherboard, please
power off the system and wait for five seconds, and then remove the components from
the motherboard and/or disconnect the peripheral device from the system. Please
remember that only service technicians trained by Inspur are authorized to remove the
cover of the host, and to remove and replace internal components.
5. If there is modem, telecom or LAN options installed in the equipment, please pay
attention to the followings:
1) In the case of thunder and lightning, please do not connect or use the modem.
2) Never connect or use the modem in a damp environment.
3) Never insert the modem or telephone cables into the socket of network interface
controller (NIC).
4) Before unpacking the product package, installing internal components, touching
uninsulated cables or jacks of the modem, please disconnect the modem cables.
6. In order to prevent electrostatic discharge from damaging the electronic components in
the equipment, please pay attention to the followings:
1) Please remove any static electricity on your body before dismounting or touching any

4
electronic component in the equipment, to prevent the static electricity from conducting
itself to the sensitive components. You may remove the static electricity on the body by
touching the metal earthing objects (such as the unpainted metal surface on the rack).
2) Please do not take electrostatic sensitive components that are not ready to be installed
for application out of the antistatic package materials.
3) While working, please touch the earthing conductor or the unpainted metal surface on
the cabinet regularly to remove any static electricity from the body that may damage
the internal components.
7. Upon receiving the proper authorization from Inspur and dismounting the internal
components, please pay attention to the followings:
1) Switch the system power supply off and disconnect the cables, including all connections
of the system. When disconnecting the cables, please hold the connector of the cables
and slowly pull the plugs out. Never pull on the cables.
2) The products need to completely cool down before dismounting the host cover or
touching the internal components.
3) During the dismounting process, avoid making large movement ranges to prevent
damage to the components or scratching arms.
4) Handle components and plug-in cards with care. Please do not touch the components
or connection points on the plug-in cards. When handling the plug-in cards or
components, firmly grab the edges of the plug-in cards and components, and/or their
metal fixed supports.
8. During the process of rack installation and application, please pay attention to the followings:
1) After the rack installation is finished, please ensure that the stabilizers have been fixed
to the rack and supported to ground, and the weight of the rack is firm on ground.
2) Always load from the bottom up, and load the heaviest items first.
3) When pulling out the components from the rack, apply slight force to keep the rack
balanced.
4) When pressing down the release latch and the rail of components is sliding, please be
careful; as the sliding may hurt your fingers.
5) Do not overload the AC power supply branch circuits in the rack. The total load of the
rack should not exceed 80% of the ratings of the branch circuits.
6) Ensure that components in the rack have good ventilation conditions.
7) When repairing components in the rack, never step on any other components.

5
Product Specications
2 Product Specifications
2.1 Introduction
Inspur NF5280M5 is a high-end, dual-socket and rack-mounted server, which is designed
on the basis of the new generation of Intel® Xeon® scalable processors, to satisfy the
requirements of cloud computing, big data, data mining, deep learning and other high-end
IT applications. This server has high quality and high reliability on the performance, storage
and extension, and makes innovations and breakthroughs on computing performance,
flexible configuration and intelligent management, particularly suitable for telecom
operators, financial industry, internet companies and other large-scale enterprises.
●Main features:
■Support 2 Intel® Xeon® scalable processors, and support up to TDP 205W
■Support 2 channels UPI for 9.6, 10.4 GT/s
■Support up to 24 DIMM DDR4 memories, support RDIMM, LRDIMM, NVDIMM memories,
and support memory mirroring and sparing functions
■Support up to 24 * 2.5” SAS/SATA/SSD/NVME or 12 * 3.5” SAS/SATA drive in the front
■Support up to 10 * 2.5” SAS/SATA/SSD or 4 * 2.5” SAS/SATA/SSD + 3.5” SAS/SATA drive at
the rear
■Support up to 4 internal SAS/SATA HDDs
■Support Type-A and Type-C OCP cards
■Support 4 onboard OCU link ports, directly connected with NVME SSDs
■Support up to 14 onboard SATA HDDs
■Support up to 10 standard PCIE expanders, including 8 full-height and 2 half-height half-length
■Support up to 4 GPUs
■Onboard ASP 2500 BMC chip, equipped with KVM function
■Support hot-plug LCD module, and support BMC remote monitoring through mobile devices
■Support Intel remote BMC debug
■Modular design of drive module, PCI expander, power supply and fan module, free-tool
maintenance
■Utilize 80Plus Platinum CRPS, support PMBus and NM4.0 functions, support hot plug and
redundancy
■Hot-plug fan/fan bracket design; the fans support N+N redundancy, with low-noise design

6
●2.5”×24 Configuration (i.e. Full Configuration)
Supports 24 * 2.5" SAS/SATA/SSD/NVME drive in the front, as shown in the figure below.
Figure 1-1
●3.5”×12 Configuration (i.e. Full Configuration)
Supports 12 * 2.5"/3.5" SAS/SATA/SSD/NVME drive in the front, as shown in the figure below.
Note: The 3.5” drive trays can hold 3.5”/2.5” drives.
Figure 2-2
●2.5”×25 Configuration (i.e. Full Configuration)
Supports 25 * 2.5” SAS/SATA/SSD in the front, as shown in the figure below.
6
●2.5”×24 Configuration (i.e. Full Configuration)
Supports 24 front 2.5” SAS/SATA/SSD/NVME HDDs, as shown in the figure below.
●3.5”×12 Configuration (i.e. Full Configuration)
Supports 12 front 3.5”/2.5” SAS/SATA/SSD/NVME HDDs, as shown in the figure below.
Note: The 3.5” HDD trays can hold 3.5”/2.5” HDDs.
●2.5”×25 Configuration (i.e. Full Configuration)
Supports 25 front 2.5” SAS/SATA/SSD HDDs, as shown in the figure below.
Figure 2-3

7
Product Specications
2.2 Features and Specifications
Table 2-1
Processor
Processor Type Two Skylake or Cascade Lake Intel® Xeon® scalable processors (supports up to
two 205W processors)
Socket 2
Chipset
Chipset Type C622, C624
Memory
Memory Type RDIMM, LRDIMM, NVDIMM, Apache Pass
Memory Slot Qty. 24
Total Memory Capacity Supports up to 3.0TB (128GB per memory module)
I/O
USB 2 rear USB 3.0 ports, 2 built-in USB 3.0 ports, and 2 front USB ports
VGA 1 front VGA port
1 rear VGA port
Serial Interface 1 built-in serial interface
UID 2 UID LEDs and buons (1 front and 1 rear)
Display
Controller Type Integrated in the Aspeed2500 chip, supports up to 1280*1024 resoluon
SAS Backplane
SAS3.0 Backplane Supports hot-plug SAS/SATA/SSD/NVME drive
NIC
NIC Controller The motherboard supports OCP/PCIE cards
Management
Management Chip It integrates 1 independent 1000Mbps network interface, special for IPMI
remote management
PCI Expansion Slot
• Onboard: 2 PCI Express 3.0 ×24 slots + 1 PCI Express 3.0 ×24 slot (16 lane),
used to support PCI-E Riser card
• The Riser card supports horizontal-inserted and full-height cards
• Riser slot1 (CPU0 out): 1 Riser card, supporting 3 PCI Express 3.0 ×8 slots, or 1
PCI Express 3.0 x16 slot + 1 PCI Express 3.0 x8 slot
Riser slot2 (CPU0/1 out): 1 Riser card, supporting 3 PCI Express 3.0 ×8 slots,
or 1 PCI Express 3.0 x16 slot + 1 PCI Express 3.0 x8 slot
Riser slot3 (CPU1 out): 1 Riser card, supporting 2 PCI Express 3.0 ×8 slots, or
1 PCI Express 3.0 x16 slot
• Onboard: 1 Type A/C slot (for supporting OCP/PHY card)
Drive
Drive Type 2.5”/3.5” SAS/SATA/SSD/NVME drive (The machine you purchased shall prevail)

8
External Storage Drive
Opcal Drive Supports external USB drive
T-ash Card Supports built-in TF card
Power
Specicaons
Single/dual power supply/supplies of 550W/800W/1300W/1600W and above
output power; 1+1 redundancy; 2 power modules; Supports PMBus power
supply; Node Manager 4.0 funcon
Power Input Please refer to the power input on the nameplate label of the host
Physical
Packing Box Dimensions 800-length packing box: 651 width × 295 height × 1075 depth (unit: mm)
780-length packing box: 651 width × 295 height × 1031 depth (unit: mm)
Host Machine Dimensions 800-length chassis: 435 width × 87 height × 797.5 depth (unit: mm)
780-length chassis: 435 width × 87 height × 779.5 depth (unit: mm)
Product Weight
Full conguraon: 12 * 3.5” drive bay (with 12 drives installed)
Host weight: 31.2kg;
Gross weight: 41kg (Gross weight includes: Host + Packing Box + Rails + Accessory Box)
Full conguraon: 24 * 2.5” drive bay (with 24 drives installed)
Host weight: 25.2kg;
Gross weight: 35kg (Gross weight includes: Host + Packing Box + Rails + Accessory Box)
Environmental
Operang Temperature 10℃-35℃
Storage & Transportaon
Temperature -40℃-60℃
Operang Humidity 20％-80％ relave humidity
Storage & Transportaon
Humidity 20％-93％(40℃) relave humidity
2.3 Compatible Peripherals – AOC Cables
Table 2-2
Vendor Vendor PN Specifications
Gigalight GSS-MDO100-003C 10G SFP+ AOC, 3m, orange
Gigalight GSS-MDO100-005C 10G SFP+ AOC, 5m, orange
Gigalight GSS-MDO100-007C 10G SFP+ AOC, 7m, orange
Gigalight GSS-MDO100-010C 10G SFP+ AOC, 10m, orange
Finisar FCBG110SD1C03 10G SFP+ AOC, 3m, black
Finisar FCBG110SD1C05 10G SFP+ AOC, 5m, black
Finisar FCBG110SD1C07 10G SFP+ AOC, 7m, black
Finisar FCBG110SD1C10 10G SFP+ AOC, 10m, black
Avago AFBR-2CAR03Z 10G SFP+ AOC, 3m, orange
Avago AFBR-2CAR05Z 10G SFP+ AOC, 5m, orange
Avago AFBR-2CAR07Z 10G SFP+ AOC, 7m, orange
Avago AFBR-2CAR10Z 10G SFP+ AOC, 10m, orange

9
Product Specications
2.4 Power Efficiency
Table 2-3
Efficiency
Level
Efficiency PF
Rated
Power @10%
Load @20% Load @50% Load @100% Load @50% Load
Platinum
90%94% 91% 0.98550W
90% 94% 91% 0.98800W
90%94% 91% 0.981300W
90% 94% 91% 0.981600W
90% 94% 91% 0.982000W
90% 94% 96%91% 0.98800W
90% 94% 96%91% 0.981300W
Table 2-4
EU Regulation 2019/424
Server configurations
High-end performance
configuration
Low-end performance
configuration
(h) idle state power 105.8W88.5W
(i) list of all components for additional idle
power allowances, if any (additional PSU, HDDs
or SSDs, additional memory, additional buffered
DDR channels, additional I/O devices);
(j) maximum power, expressed in Watts and
rounded to the first decimal place; 604.9W 186.6W
(k) declared operating condition class, as
detailed in Table 6; A2 A2
(l) idle state power (Watts) at the higher
boundary temperature of the declared
operating condition class;
140.9W 115.4W
(m) the active state efficiency and the
performance in active state of the server; 34 16.9
Titanium
See Below See Below

10
Table 2-5
(i) List of components for additional power allowance
High-end
performance
configuration
Low-end
performance
configuration
CPU Performance 1 socket: 10 × Perf CPU W 95.55W13.23W
2 socket: 7 × Perf CPU W
Additional PSU 10 W per PSU 10W 10W
HDD or SSD 5.0 W per HDD or SSD 10W 10W
Additional memory 0.18 W per GB 137.52W 33.84W
Additional buffered DDR channel 4.0 W per buffered DDR channel 16W 16W
Additional I/O devices
< 1 Gb/s: No Allowance
0 0
= 1 Gb/s: 2.0 W/Active Port
> 1 Gb/s and < 10 Gb/s: 4.0 W/Active Port
≥ 10 Gb/s and < 25Gb/s: 15.0 W/Active Port
≥ 25 Gb/s and < 50Gb/s: 20.0 W/Active Port
≥ 50 Gb/s 26.0 W/Active Port
Total additional idle state power allowed 307.07W121.07W

11
Component Identication
3 Component Identification
3.1 Front Panel Components
●2.5” ×24 Drive Bays
Figure 3-1
Table 3-1
Item Descripon
1Front control panel buons and LEDs
2Quick release lever
3 Drive bays
4VGA port
5 USB3.0 port
6USB2.0 + LCD port
2.5” × 24 drive sequence diagram
Figure 3-2
●3.5” × 12 Drive Bays
Figure 3-3

12
Table 3-2
Item Descripon
1Front control panel buons and LEDs
2Quick release lever
3 Drive bays
4VGA port
5 USB3.0 port
6USB2.0 + LCD port
3.5” × 12 drive sequence diagram
Figure 3-4
●2.5” × 25 Drive Bays
9
Component Identication
3 Component Identification
3.1 Front Panel Components
●2.5” ×24 HDD Bays
Item Descripon
1Front control panel buons and LEDs
2Quick release lever
3 HDD bays
4VGA port
5USB3.0 port
6USB2.0 + LCD port
2.5” × 24 HDD sequence diagram
● 3.5” × 12 HDD Bays
Figure 3-5
Table 3-3
Item Descripon
1Front control panel buons and LEDs
2Quick release lever
3 Drive bays
4VGA port
5 USB3.0 port
6USB2.0 + LCD port
●2.5” × 25 drive sequence diagram
0
5
10
15
20
1
6
11
16
21
2
7
12
17
22
3
8
13
18
23
4
9
14
19
24
Figure 3-6

13
Component Identication
●Front Control Panel Buttons and LEDs
Figure 3-7
Table 3-4
Item Descripon Status & Interpretaon
1Power buon
Steady green: Power on state
Steady orange: Standby state
Long press 4s to force a shutdown
2UID│RST buon Turn on/o UID (blue)
Long press 6s to force a reset
3System failure LED
O: Normal
Steady red: A failure occurs
Flashing red: A warning occurs
4Memory failure LED
O: Normal
Steady red: A failure occurs
Flashing red: A warning occurs
5 Fan failure LED
O: Normal
Steady red: Fail to read the speed
Flashing red: Speed reading is abnormal
6Power failure LED
O: Normal
Steady red: A power failure occurs
Flashing red: Power state is abnormal
7System overheat LED O: Normal
Steady red: CPU/Memory overheats
8 Network status LED
Steady/Flashing green: Network connected
O: No network connecon
*Note: It indicates only the PHY card’s working status

14
●Drive Tray LEDs
Figure 3-8
Table 3-5
Item Descripon Status & Interpretaon
1Acvity status LED Steady green: Normal
Flashing green: Read and write acvity
2Fault alarm LED
Steady red: A failure occurs
Steady blue: Disk posioning
Steady purple: RAID rebuilding
3.2 Rear Panel Components
Figure 3-9