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PowerEdge T710 Technical Guide ii
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December 2012 | Version 4.0

Dell
PowerEdge T710 Technical Guide iii
Table of Contents
1Product Comparison ...........................................................................................7
1.1 Overview ..................................................................................................7
1.1.1 Purposeful Design ..................................................................................7
1.1.2 Energy-Optimized Technology....................................................................7
1.1.3 Advanced Virtualization ...........................................................................7
1.1.4 Simplified Systems Management .................................................................7
1.2 Comparison ...............................................................................................8
2Key Technologies............................................................................................. 10
2.1 Overview ................................................................................................ 10
2.2Processor Information ................................................................................. 10
3System Overview ............................................................................................. 11
4Mechanical .................................................................................................... 14
4.1 Chassis Description..................................................................................... 14
4.2 Dimensions .............................................................................................. 14
4.3 Weight ................................................................................................... 14
4.4 Front Panel View and Features ...................................................................... 14
4.5 Back Panel View and Features ....................................................................... 15
4.6 Power Supply Indicators............................................................................... 16
4.7 Internal Chassis View .................................................................................. 17
4.8 Rails and Cable Management ......................................................................... 17
4.9 Fans ...................................................................................................... 17
4.10 LCD Control Panel...................................................................................... 18
4.11 Security.................................................................................................. 18
4.11.1 USB Key ............................................................................................ 19
4.12 Battery................................................................................................... 19
4.13 Field Replaceable Units (FRU)........................................................................ 19
4.14 User Accessible Jumpers, Sockets, and Connectors............................................... 19
5Power, Thermal, Acoustic .................................................................................. 20
5.1 Power Efficiencies ..................................................................................... 20
5.2 Power Supplies ......................................................................................... 20
5.3 Power Supply Specifications.......................................................................... 20
5.4 Power Supply Efficiency............................................................................... 21
5.5 Heat Dissipation ........................................................................................ 21
5.6 Environmental Specifications......................................................................... 22
5.7 Maximum Input Amps.................................................................................. 23
5.8 Energy Smart Enablement ............................................................................ 23
5.9 ENERGY STAR Compliance ............................................................................ 23
5.10 Acoustics ................................................................................................ 23
6Processors..................................................................................................... 25
6.1 Overview ................................................................................................ 25
6.2 Features ................................................................................................. 26
6.3 Supported Processors.................................................................................. 26
6.4 Processor Configurations.............................................................................. 27
6.4.1 Single Processor Configuration ................................................................. 27
6.4.2 Processor Power Voltage Regulation Modules (EVRD 11.1)................................. 27
6.5 Processor Installation.................................................................................. 27
7Memory ........................................................................................................ 28
7.1 Overview ................................................................................................ 28

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PowerEdge T710 Technical Guide iv
7.2 DIMM Slots............................................................................................... 28
7.3 DIMMs Supported ....................................................................................... 28
7.3.1 RDIMMS............................................................................................. 29
7.3.2 UDIMMs............................................................................................. 29
7.4 Memory Modes.......................................................................................... 29
7.5 Memory Population .................................................................................... 30
7.6 Memory Speed Limitations............................................................................ 31
7.7 Sparing................................................................................................... 31
7.8 Mirroring................................................................................................. 32
7.9 RAID ...................................................................................................... 32
8Chipset ........................................................................................................ 33
8.1 Overview ................................................................................................ 33
8.2 Intel Dual I/O Hub (IOH) .............................................................................. 33
8.3 Intel Quickpath Architecture (QPI) .................................................................. 33
8.4 PCI Express Generation 2 ............................................................................. 33
8.5 Intel Direct Media Interface (DMI) ................................................................... 33
8.6 Intel I/O Controller Hub 9 (ICH9) .................................................................... 33
8.7 Super I/O Controller ................................................................................... 34
9BIOS ............................................................................................................ 35
9.1 Overview ................................................................................................ 35
9.2 BIOS Settings and Defaults............................................................................ 35
9.3 Power Management Modes............................................................................ 35
9.3.1 OS Control......................................................................................... 35
9.3.2 Active Power Controller......................................................................... 35
9.3.3 Maximum Performance .......................................................................... 36
9.4 Supported ACPI States................................................................................. 36
10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 37
11 PCI Slots ....................................................................................................... 38
11.1 Overview ................................................................................................ 38
11.2 Express Card Specifications........................................................................... 38
11.3 Quantities and Priorities .............................................................................. 38
11.4 PCI Card Dimensions ................................................................................... 38
12 Storage ........................................................................................................ 39
12.1 Overview ................................................................................................ 39
12.2 Eight-Drive 3.5‖ Backplane ........................................................................... 39
12.3 Sixteen-Drive 2.5‖ Backplane ........................................................................ 39
12.4 Internal Hard Disk Drives.............................................................................. 39
12.4.1 Hard Disk Drive Carriers......................................................................... 40
12.4.2 Empty Drive Bays................................................................................. 40
12.5 RAID Configurations.................................................................................... 40
12.6 Internal Storage Controllers .......................................................................... 42
12.6.1 PERC H200......................................................................................... 43
12.6.2 PERC H700......................................................................................... 43
12.6.3 SAS 6/iR ........................................................................................... 43
12.6.4 PERC 6/i ........................................................................................... 43
12.7 Storage Card Support Matrix ......................................................................... 43
12.8 Optical Drives........................................................................................... 44
12.9 Tape Drives ............................................................................................. 44
13 Video........................................................................................................... 45
14 Rack Information............................................................................................. 46
14.1 Overview ................................................................................................ 46

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PowerEdge T710 Technical Guide v
14.2 Rails ...................................................................................................... 46
14.3 Cable Management Arm (CMA) ....................................................................... 47
14.4 Rack View ............................................................................................... 48
15 Operating Systems ........................................................................................... 49
16 Systems Management........................................................................................ 50
16.1 Overview ................................................................................................ 50
16.2 Server Management.................................................................................... 50
16.3 Embedded Server Management ...................................................................... 51
16.4 Dell Lifecycle Controller and Unified Server Configurator ....................................... 51
16.5 Integrated Dell Remote Access Controller.......................................................... 51
16.6 iDRAC Express........................................................................................... 52
16.7 iDRAC6 Enterprise...................................................................................... 52
16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media ............................................. 52
17 Peripherals.................................................................................................... 55
Appendix A. Statement of Volatility .......................................................................... 56
Appendix B. Certifications ..................................................................................... 60
Regulatory Certifications ............................................................................. 60B 1.
Product Safety Certifications......................................................................... 60B 2.
Electromagnetic Compatibility....................................................................... 61B 3.
Ergonomics, Acoustics and Hygienics ............................................................... 61B 4.
Appendix C. Additional Information and Options ........................................................... 62
Tables
Comparison of PowerEdge T710 to T410 and T610...............................................8Table 1.
Product Features Summary ........................................................................ 11Table 2.
Power Supply Status ................................................................................ 16Table 3.
Security Features.................................................................................... 18Table 4.
Power Supply Specifications ....................................................................... 21Table 5.
Power Supply Efficiency............................................................................ 21Table 6.
Environmental Specifications...................................................................... 22Table 7.
Formulas for Maximum Operating Temperature at Given Altitude .......................... 23Table 8.
Acoustical Performance (2.5‖ Hard Drive System) ............................................. 24Table 9.
Acoustical Performance (3.5‖ Hard Drive System) ............................................. 24Table 10.
Intel Xeon Processor Features..................................................................... 25Table 11.
Supported Processors ............................................................................... 26Table 12.
Maximum Configuration by DIMM Type........................................................... 28Table 13.
Memory Speed Limitations......................................................................... 31Table 14.
Supported Hard Drives.............................................................................. 39Table 15.
Factory RAID Configurations ....................................................................... 40Table 16.
Storage Card Support Matrix....................................................................... 43Table 17.
Graphics Video Modes .............................................................................. 45Table 18.
Supported Racks..................................................................................... 47Table 19.
Rail Adjustability Ranges and Depth ............................................................. 47Table 20.
Unified Server Configurator Features and Description......................................... 51Table 21.
Features List for Base Management Functionality, iDRAC, and vFlash Media .............. 53
Table 22.
Volatility Table ...................................................................................... 56Table 23.
Product Safety Certifications...................................................................... 60Table 24.
Electromagnetic Compatibility Certifications................................................... 61Table 25.
Ergonomics, Acoustics and Hygienics............................................................. 61Table 26.
Industry Standards .................................................................................. 62Table 27.

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PowerEdge T710 Technical Guide vi
Figures
Chassis Dimensions.................................................................................. 14Figure 1.
Front View (Tower Configuration) ................................................................ 15Figure 2.
Front View (Rack Configuration) .................................................................. 15Figure 3.
Back View ............................................................................................ 16Figure 4.
Internal Chassis View ............................................................................... 17Figure 5.
LCD Control Panel................................................................................... 18Figure 6.
Memory Channel Organization .................................................................... 30Figure 7.
Dell 2.5‖ Hard Drive Carrier ....................................................................... 40Figure 8.
ReadyRails Sliding Rails with Optional CMA ..................................................... 46Figure 9.
2U Threaded Rack Adapter Brackets Kit ...................................................... 47Figure 10.
T710 Mounted in the C1 Sliding Rails.......................................................... 48
Figure 11.
T710 CMA Mounted on the Left Side........................................................... 48Figure 12.

7
1Product Comparison
1.1 Overview
The Dell™ PowerEdge™ T710 provides outstanding performance, availability, and value in a 2S tower
server for large enterprises and organizations, remote workgroups, and growing businesses.
The T710 features the extensive performance range of Intel®Xeon®processors, DDR3 memory,
excellent I/O bandwidth, internal storage expandability of up to 16 hard drives, and optional
redundant power supplies.
The T710 was developed with a purposeful design—high, balanced performance; extensive
expandability for growth; energy-optimized technologies, advanced virtualization capabilities, and
simplified systems management.
1.1.1 Purposeful Design
The PowerEdge T710 takes advantage of Dell‘s outstanding system commonality and reliability.
Consistent component layout and purposeful placement of interface ports and power supplies enable
easy installation and redeployment. The PowerEdge T710 purposeful design provides a standard LCD
screen positioned by the front of the bezel for ease of monitoring.
Robust, metal hard drive carriers and organized cabling are designed to improve component access
and airflow across the server. Designed for easy rack installation, the PowerEdge T710 offers an all-
steel cable management arm to help eliminate creep.
1.1.2 Energy-Optimized Technology
Energy efficiency is designed at the system level on the PowerEdge T710 to help reduce power
consumption while increasing performance capacity. Improvements include enhanced power supply
units, an efficient fan design, and policy-driven power management.
Energy Smart 90%+ efficient power supply units are provided on the PowerEdge T710. A robust fan
cage design with a single pull fan module helps improve airflow and enable fast, easy maintenance.
Power Management features include power capping, power inventory, and power budgeting to best
manage power in your specific environment.
1.1.3 Advanced Virtualization
Featuring IntelXeon processors 5500 series, embedded hypervisors, and expanded memory and I/O,
Dell servers offer better overall system performance and virtual machine-per-server capacity than
ever before.
Dell provides a smart path to virtualization that is grounded in choice and defined by industry
standards. Choose your hypervisor from market leaders such as VMware and Microsoft, enabling
virtualization with a few mouse clicks.
1.1.4 Simplified Systems Management
The next-generation of Dell OpenManage™ suite of management tools is designed to provide efficient
operations and standards-based commands designed to integrate with existing systems for effective
control.
Dell Management Console (DMC) helps simplify operations and create stability by shrinking
infrastructure management to one console. This console delivers a single view and a common data

Dell
PowerEdge T710 Technical Guide 8
source into the entire infrastructure management. Built on Symantec™ Management Platform, it has
an easily extensible, modular foundation that can provide basic hardware management or more
advanced functions, such as asset and security management. Dell Management Console is designed to
reduce or eliminate manual processes, enabling you to save time and money for more strategic
technology usage.
Secure and efficient, the Dell Lifecycle Controller delivers ―Instant On‖ integrated manageability
through a single access point. The Unified Server Configurator (USC) interface enables persistent
access to the tool because it is embedded and integrated into the system for significant flexibility
and capabilities. The Lifecycle Controller is a one-stop shop for deploying operating systems with
built-in driver installations, BIOS and firmware update and rollback, hardware configuration, and
diagnostics.
1.2 Comparison
Comparison of PowerEdge T710 to T410 and T610Table 1.
Feature
T410
T610
T710
Processor
Intel®Xeon®processor
5500 and 5600 series
Intel®Xeon®processor
5500 and 5600 series
Intel®Xeon®processor
5500 and 5600 series
Sockets
2
2
2
Cores
4 or 6
4 or 6
4 or 6
L2/L3 Cache
4MB, 8MB, and 12MB
4MB, 8MB, and 12MB
4MB, 8MB, and 12MB
Chipset
Intel®5500
Intel®5520
Intel®5520
Front Side Bus
6.4 GT/s QuickPath
Interconnect (QPI) links
6.4 GT/s QuickPath
Interconnect (QPI) links
6.4 GT/s QuickPath
Interconnect (QPI) links
DIMMs
8 x DDR3
12 x DDR3
18 x DDR3
Min/Max RAM
1GB/128GB
1GB/192GB
1GB/192GB
Drive Bays
Optional hot-plug
6 x 2.5‖ or
6 x 3.5‖
Hot-plug
8 x 2.5‖ or
8 x 3.5‖
Hot-plug
16 x 2.5‖ or
8 x 3.5‖
Hard Drive Types
SATA SSD, SAS, nearline
SAS, SATA
SAS SSD, SATA SSD, SAS,
nearline SAS, SATA
SAS SSD, SATA SSD, SAS,
nearline SAS, SATA
External Drive
Bays
2 x 5.25‖
2 x 5.25‖
2 x 5.25‖
Embedded Hard
Drive Controller
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i,
PERC S100, PERC S300
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i,
PERC S100, PERC S300
PERC H200, PERC H700,
SAS 6/iR, PERC 6/i,
PERC S100, PERC S300

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PowerEdge T710 Technical Guide 9
Feature
T410
T610
T710
Optional Storage
Controller
Non-RAID:
SAS 5/E
LSI 2032 (for tape
backup unit only)
6Gbps SAS HBA
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup
unit only)
6Gbps SAS HBA
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
Non-RAID:
SAS 5/E
LSI 2032 (for tape backup
unit only)
6Gbps SAS HBA
RAID:
SAS 6/iR
PERC H200
PERC 6/i
PERC H700
PERC 6/E
PERC H800
Availability
Optional hot-plug hard
drives
Optional hot-plug
redundant power
ECC memory
Memory mirroring
Quad-pack LED or LCD
diagnostic
Hot-plug hard drives
Optional hot-plug
redundant power
Hot-plug redundant
cooling
ECC memory
Memory mirroring
LCD diagnostic
One dual-port embedded
NIC with TOE
Hot-plug hard drives
Optional hot-plug
redundant power
Hot-plug redundant
cooling
ECC memory
Memory mirroring
LCD diagnostic
Two dual-port embedded
NICs with TOE
Server
Management
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™
Optional: iDRAC6
Express, iDRAC6
Enterprise, vFlash media
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™,
iDRAC6 Express
Optional: iDRAC6
Enterprise, vFlash media
Baseboard Management
Controller (BMC), IPMI
2.0, Dell OpenManage™,
iDRAC6 Express
Optional: iDRAC6
Enterprise, vFlash media
I/O Slots
4 PCIe x8 (x4 routing)
1 PCIe x16 (x8 routing)
2 PCIe x8
3 PCIe x4 Gen 2
1 PCIe x16
4 PCIe x8
1 PCIe x4
NIC/LOM
Broadcom®BCM5716
2 x GbE
Optional: various NICs
available
Broadcom®BCM5709c
2 x GbE with TOE
Optional: various NICs
available
Broadcom®BCM5709c
4 x GbE with TOE
Optional: various NICs
available
USB
2 front, 4 back,
1 internal
2 front, 6 back,
1 internal
2 front, 6 back,
1 internal
Power Supplies
Non-redundant 525W or
Optional hot-plug
redundant
2 x 580W
Hot-plug redundant
2 x 570W (Energy Smart)
or
2 x 870W (high-output)
Hot-plug redundant
2 x 1100W
Fans
Non hot-plug, non-
redundant
Optional hot-plug
redundant
Hot-plug redundant

Dell
PowerEdge T710 Technical Guide 10
2Key Technologies
2.1 Overview
Key technologies of the Dell™ PowerEdge™ T710 include two quad-core or six-core Intel®Xeon®
processors 5500 and 5600 series with QuickPath Interconnect (QPI), DDR3 memory, Intel 5520 I/O
Hub (IOH), dual-port Gigabit Ethernet controller with TOE, PCI Express Generation 2, internal SD
Module, and iDRAC6 Express or optional iDRAC6 Enterprise.
2.2 Processor Information
The Intel Xeon processors 5500 and 5600 series are designed specifically for servers and workstation
applications. The processor features quad-core and six-core processing to maximize performance and
performance/watt for demanding workloads. The processors also feature the Intel Core™
micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and
operating systems. Refer to section 6 for more details.

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PowerEdge T710 Technical Guide 11
3System Overview
Table 2 summarizes the features for the Dell™ PowerEdge™ T710. For the latest information on
supported features for the PowerEdge T710, visit Dell.com.
Product Features SummaryTable 2.
Feature
Technical Specification
Form Factor
Tower or rack (5U height in rack orientation)
Processors
Latest quad-core or six-core Intel®Xeon®processors 5500 and 5600 series
Processor Sockets
2
Front Side Bus or
HyperTransport
Intel QuickPath Interconnect (QPI)
Cache
4MB and 8MB
Chipset
Intel 5520 Chipset
Memory1
Up to 192GB (18 DIMM slots): 1GB/2GB/4GB/8GB/16GB DDR3 800MT/s, 1066MT/s or
1333MT/s
I/O Slots
1 PCIe x16
4 PCIe x8
1 PCIe x4
(all PCIe Gen2slots)
RAID Controller
Internal:
PERC H200 (6Gb/s)
PERC H700 (6Gb/s) (non-volatile battery-
backed cache: 512MB, 1GB)
SAS 6/iR
PERC 6/i (battery-backed cache: 256MB)
PERC S100 (software based)
PERC S300 (software based)
External:
PERC H800 (6Gb/s) (non-volatile battery-
backed cache: 512MB, 1GB)
SAS 6/iR
PERC 6/E (battery-backed cache: 256MB,
512MB)
External HBAs (non-RAID):
6Gbps SAS HBA
SAS 5/E HBA
LSI2032 PCIe SCSI HBA
Drive Bays
16 x 2.5‖ hot-plug hard drives or
8 x 3.5‖ hot-plug hard drives
2 x 5.25‖ drive bays for DVD-ROM, DVD+/-RW, or tape backup unit (TBU)
Maximum Internal
Storage
Up to 32TB
Hard Drives1
2.5‖ SAS SSD, SATA SSD, SAS (15K, 10K),
nearline SAS (7.2K), SATA (7.2K)
3.5‖ SAS (15K, 7.2K), nearline SAS (7.2K),
SATA (7.2K)

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PowerEdge T710 Technical Guide 12
Feature
Technical Specification
Communications
Dual embedded Broadcom®NetXtreme II™ 5709c Gigabit Ethernet NIC with failover
and load balancing (4 total ports). TOE (TCPIP Offload Engine) supported on
Microsoft®Windows Server®2003, SP1 or higher with Scalable Networking Pack
Intel®Ethernet X520 DA2 Dual-Port 10 Gigabit Server Adapter
Optional 1GBe and 10GBe add-in NICs:
Broadcom®NetXtreme II®57711 Dual Port Direct Attach 10Gb Ethernet PCI-Express
Network Interface Card with TOE and iSCSI Offload
Intel®Gigabit ET Dual Port Server Adapter and Intel®Gigabit ET Quad Port Server
Adapter
Dual Port 10GB Enhanced Intel®Ethernet Server Adapter X520-DA2 (FCoE Ready for
Future Enablement)
Brocade®CNA dual-port adapter; Emulex®CNA iSCSI HBA stand up adapter
OCE10102-IX-D
Optional Add-in HBAs:
Brocade®FC4 and 8 GB HBAs
Power Supply
Two redundant hot-plug 1100W
Availability
DDR3 memory; hot-plug hard drives; optional hot-plug redundant power supplies;
hot-plug redundant cooling; dual embedded NICs with failover and load balancing
support (4 total ports); optional PERC 6/i integrated daughtercard controller with
battery-backed cache; toolless chassis; fibre and SAS cluster support; validated for
Dell/EMC SAN
Video
Integrated Matrox®G200
Remote Management
iDRAC6 Express, optional iDRAC6 Enterprise
Systems Management
Dell™ OpenManage™ suite of systems management solutions
Rack Support
ReadyRails™ sliding rails with optional cable management arm for 4-post racks
(optional adapter brackets required for threaded hole racks)

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PowerEdge T710 Technical Guide 13
Feature
Technical Specification
Operating Systems
Microsoft®Windows Server®2012
Microsoft Windows®Small Business Server 2011
Microsoft Windows Small Business Server 2008
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V®)
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2)
Microsoft Windows HPC Server 2008
Novell®SUSE®Linux Enterprise Server
Red Hat®Enterprise Linux®
Optional Embedded Hypervisors:
Citrix®Xenserver®
VMware®vSphere®including ESX™and ESXi™
Red Hat Enterprise Virtualization®
For more information on the specific versions and additions, visit
Dell.com/OSsupport.
Featured Database
Applications
Microsoft SQL Server®solutions (see Dell.com/SQL)
Oracle®database solutions (see Dell.com/Oracle)
1GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.

Dell
PowerEdge T710 Technical Guide 14
4Mechanical
4.1 Chassis Description
The Dell™ PowerEdge™ T710 system uses a tower or rack-mount 5U chassis. It is classified by Dell as a
rackable tower, meaning it is optimized for tower operation.
4.2 Dimensions
Xa
Xb
Ya
Yb
Yc
Za
(with
bezel)
Za
(without
bezel)
Zb*
Zc
217.9mm
304.4mm
431.3mm
466.3mm
471.3mm
37mm
35mm
659.6mm
694.8mm
*Note: Zb goes to the nominal rear wall external surface where the motherboard I/O connectors reside.
Chassis DimensionsFigure 1.
4.3 Weight
The maximum configuration weight of the PowerEdge T710 is 35.3 kg (78 lb).
4.4 Front Panel View and Features
Figure 2 and Figure 3 show the front views of the PowerEdge T710.

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PowerEdge T710 Technical Guide 15
Front View (Tower Configuration)Figure 2.
Front View (Rack Configuration)Figure 3.
See the Front-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge T710 Hardware Owner’s Manual on Support.Dell.com for more information.
4.5 Back Panel View and Features
Figure 4 shows the back view of the PowerEdge T710.

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PowerEdge T710 Technical Guide 16
Back ViewFigure 4.
See the Back-Panel Features and Indicators section in the About Your System chapter of the
PowerEdge T710 Hardware Owner’s Manual on Support.Dell.com for more information.
4.6 Power Supply Indicators
The PowerEdge T710 redundant power supplies have one status bi-color LED: green for AC power
present and amber for a fault as detailed in Table 3.
Power Supply StatusTable 3.
LED
Power Supply Status
AC Power is not present
AC Power is present
Fault of any kind is detected
DC Power is applied to the system
↔
Redundant power supply mismatch
(when hot-plugged/swapped)
See the Power Indicator Codes section in the About Your System chapter of the PowerEdge T710
Hardware Owner’s Manual on Support.Dell.com for more information.

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PowerEdge T710 Technical Guide 17
4.7 Internal Chassis View
Figure 5 shows the internal view of the PowerEdge T710 server.
Internal Chassis ViewFigure 5.
4.8 Rails and Cable Management
ReadyRailsTM Sliding Rails for 4-post racks support the following:
Toolless installation in 19‖ EIA-310-E compliant square or unthreaded round hole 4-post racks
including all generations of Dell racks
Tooled installation in 19‖ EIA-310-E compliant threaded hole 4-post racks (requires the 2U
Threaded Rack Adapter Brackets Kit)
Full extension of the system out of the rack to allow serviceability of key internal components
Optional cable management arm (CMA); optional adapter brackets required for threaded hole
racks
See section 14 for more details.
4.9 Fans
Two or four 92 mm single-rotor fans are mounted in the back of the cooling shroud. Each fan has a
single-wire harness that plugs into the planar fan connectors. In a non-redundant configuration, two
fans must be installed towards the back of the chassis.
The iDRAC6 controls and monitors the speed of the fans. A fan speed fault or over-temperature
condition results in a notification by iDRAC6.
The T710 power supply units have integrated fans that cool the units. The fans are located in the
front section of the server. The system requires a blank module in place of an empty power supply
slot.

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PowerEdge T710 Technical Guide 18
All system fans are pulse-width modulated (PWM) fans. The T710 supports optional redundant
cooling.
4.10 LCD Control Panel
The LCD control panel is located on the front of the system chassis to provide user access to buttons,
display, and I/O interfaces. See Figure 6. The control panel includes the following features:
ACPI-compliant power button with an integrated green power LED (controlled by iDRAC6)
128x20 pixel LCD with controls:
oTwo navigation buttons
oSelect button
oSystem ID button
Non-maskable Interrupt (NMI) button (recessed)
Ambient temperature sensor
LCD Control PanelFigure 6.
For more information on the LCD panel, see the LCD Panel Features section in the About Your System
chapter in the PowerEdge T710 Hardware Owner’s Manual on Support.Dell.com.
4.11 Security
The PowerEdge T710 supports the security features listed in Table 4. For additional information
regarding the following security features, see the PowerEdge T710 Hardware Owner’s Manual on
Support.Dell.com.
Security FeaturesTable 4.
Feature
Description
Cover Latch
A tooled latch with lock on the side cover secures it to the chassis
Bezel
A metal bezel mounted to the front of the chassis with a lock to protect
unauthorized access to remove or install an optional tape backup unit,
optical disk drives, or hot-plug hard drives. System status on the LCD control
panel is visible even when the bezel is installed.
Hard Drive
The front bezel of the system contains a lock which secures the system hard
drives.
TPM
The Trusted Platform Module (TPM) is used to generate and store keys,
protect and authenticate passwords, and create and store digital
certificates. The TPM can also be used to store Microsoft®BitLocker™ keys
for hard drive encryption features in Microsoft Windows Server®2008. TPM is
enabled through a BIOS option.

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PowerEdge T710 Technical Guide 19
Power Off Security
The control panel is designed so the power switch cannot be accidentally
activated. The lock on the bezel secures the switch behind the bezel. In
addition, there is a setting in the CMOS setup that disables the power button
function.
Intrusion Alert
A switch mounted on the inside of the chassis on the cooling shroud, is used
to detect chassis intrusion. When the cover is opened, the switch circuit
closes to indicate intrusion.
Secure Mode
BIOS has the ability to enter a secure boot mode through Setup. This mode
includes the option to lock out the power and NMI switches on the control
panel or set up a system password. For more information, see System and
Setup Password Features section in the About Your System chapter in the
PowerEdge T710 Hardware Owner’s Manual on Support.Dell.com.
4.11.1 USB Key
The port on the motherboard is for an optional USB key and is located inside the chassis. Some
possible applications of the USB key are listed as follows:
User custom boot and pre-boot OS for ease of deployment or diskless environments
USB license keys for software applications like eToken™ or Sentinel Hardware Keys
Storage of custom logs or scratch pads for portable user defined information (not hot-
pluggable)
4.12 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH chip.
4.13 Field Replaceable Units (FRU)
The planar contains a serial EEPROM to store FRU information including Dell part number, part
revision level, and serial number. The backplane storage enclosure processor (SEP) and the power
supply microcontroller are also used to store FRU data.
4.14 User Accessible Jumpers, Sockets, and Connectors
See the Jumpers and Connectors chapter in the PowerEdge T710 Hardware Owner’s Manual on
Support.Dell.com.

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PowerEdge T710 Technical Guide 20
5Power, Thermal, Acoustic
5.1 Power Efficiencies
The Dell™ PowerEdge™ T710 achieves a high-level of power efficiency by implementing the following
features:
User-selectable power cap (subsystems throttle to maintain the specified power cap)
Improved power budgeting
Larger heat-sinks for processors and IOH
Accurate inlet temperature
Power-supply and voltage-regulator (VR) efficiency improvements
Use of switching regulators instead of linear regulators
Closed-loop thermal throttling
Increased rear venting and 3D venting
Pulse-width modulated (PWM) fans with an increased number of fan zones and configuration-
dependent fan speeds
Use of DDR3 memory (lower voltage compared to DDR2, UDIMM)
Processor VR dynamic phase shedding
Memory VR static phase shedding
Random time interval for system start
Ability for an entire rack to power on without exceeding the available power
BIOS Power/Performance options page
BIOS-based processor P-state manager (power management in a virtualized environment)
Active Power Controller (BIOS-based CPU P-state manager)
Ability to power down or throttle memory
Option to disable a processor core
Ability to turn off embedded NICs or PCIe lanes when not being used
Option to run PCIe at Gen1 speeds instead of Gen2
5.2 Power Supplies
The base redundant T710 system consists of two hot-plug 1100W power supplies in a 1+1
configuration.
The power supplies connect directly to the planar. There is a power cable to connect between the
planar and the backplane. The T710 power supplies have embedded cooling fans.
Field replaceable unit (FRU) data is stored in the memory of the power supply microcontroller.
Additionally, the power supply firmware can be updated by the iDRAC over the PMBus.
Power is soft-switched, allowing power cycling using a switch on the front of the system enclosure or
by software control (through server management functions).
In a single power supply configuration, the power supply is installed in PS1 location and a power
supply blank (metal cover) is installed in PS2 location for proper system cooling.
5.3 Power Supply Specifications
The T710 power supply is rated at 1100W. It operates on input voltages ranging from 90-264V, auto-
switching to the sensed line level.