Intel BLKDQ965GFEKR Configuration guide

September 2006
Order Number: D56021-001US
The Intel®Desktop Board DQ965GF may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DQ965GF Specification Update.
Intel® Desktop Board
DQ965GF
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DQ965GF Technical Product
Specification.
September 2006
This product specification applies to only the standard Intel®Desktop Board DQ965GF with
BIOS identifier CO96510J.86A.
Changes to this specification will be published in the Intel Desktop Board DQ965GF Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT
INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel®desktop boards may contain design defects or errors known as errata, which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, the Intel logo, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries
in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2006, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DQ965GF. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DQ965GF and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
 NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DQ965GF Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#).
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1, 073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Overview........................................................................................ 12
1.1.1 Feature Summary ................................................................ 12
1.1.2 Manufacturing Options .......................................................... 13
1.1.3 Board Layout ....................................................................... 14
1.1.4 Block Diagram ..................................................................... 16
1.2 Online Support................................................................................ 17
1.3 Processor ....................................................................................... 17
1.4 System Memory .............................................................................. 18
1.4.1 Memory Configurations ......................................................... 20
1.5 Intel®Virtualization Technology (Intel®VT) ........................................ 26
1.6 Intel®vPro™ Technology Support...................................................... 27
1.7 Intel®Q965 Express Chipset............................................................. 28
1.7.1 Intel Q965 Graphics Subsystem.............................................. 28
1.7.2 USB ................................................................................... 30
1.7.3 Serial ATA Interfaces ............................................................ 31
1.7.4 Parallel IDE Interface ............................................................ 32
1.7.5 Real-Time Clock, CMOS SRAM, and Battery .............................. 32
1.8 Legacy I/O Controller....................................................................... 33
1.8.1 Serial Port Interface.............................................................. 33
1.8.2 Parallel Port Interface ........................................................... 33
1.8.3 Diskette Drive Interface ........................................................ 33
1.8.4 PS/2 Keyboard and Mouse Interface (Optional)......................... 33
1.9 Audio Subsystem............................................................................. 34
1.9.1 Audio Subsystem Software .................................................... 34
1.9.2 Audio Connectors and Headers ............................................... 35
1.10 LAN Subsystem............................................................................... 36
1.10.1 Intel®82566DM Gigabit Ethernet Controller ............................. 36
1.10.2 LAN Subsystem Software....................................................... 36
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 37
1.10.4 Intel®Active Management Technology (Intel®AMT) with
System Defense Feature........................................................ 37
1.10.5 Alert Standard Format (ASF) 2.0 Support................................. 38
1.11 Hardware Management Subsystem .................................................... 39
1.11.1 Hardware Monitoring and Fan Control...................................... 39
1.11.2 Fan Monitoring..................................................................... 39
1.11.3 Chassis Intrusion and Detection.............................................. 39
1.11.4 Thermal Monitoring .............................................................. 40
1.12 Power Management ......................................................................... 41
1.12.1 ACPI .................................................................................. 41
1.12.2 Hardware Support ................................................................ 43
1.13 Trusted Platform Module (TPM).......................................................... 48

Intel Desktop Board DQ965GF Technical Product Specification
vi
2Technical Reference
2.1 Memory Map................................................................................... 49
2.1.1 Addressable Memory............................................................. 49
2.2 DMA Channels................................................................................. 51
2.3 Fixed I/O Map ................................................................................. 52
2.4 PCI Configuration Space Map ............................................................ 53
2.5 Interrupts ...................................................................................... 54
2.6 PCI Interrupt Routing Map ................................................................ 55
2.7 Connectors and Headers................................................................... 56
2.7.1 Back Panel Connectors .......................................................... 57
2.7.2 Component-side Connectors and Headers ................................ 58
2.8 Jumper Block .................................................................................. 67
2.9 Mechanical Considerations ................................................................ 68
2.9.1 Form Factor......................................................................... 68
2.9.2 I/O Shield ........................................................................... 69
2.10 Electrical Considerations................................................................... 73
2.10.1 DC Loading.......................................................................... 73
2.10.2 Fan Header Current Capability................................................ 73
2.10.3 Add-in Board Considerations .................................................. 74
2.10.4 Power Supply Considerations ................................................. 74
2.11 Thermal Considerations.................................................................... 75
2.12 Reliability ....................................................................................... 77
2.13 Environmental ................................................................................ 78
3Overview of BIOS Features
3.1 Introduction ................................................................................... 79
3.2 BIOS Flash Memory Organization....................................................... 80
3.3 Resource Configuration .................................................................... 80
3.3.1 PCI Autoconfiguration ........................................................... 80
3.3.2 PCI IDE Support................................................................... 81
3.4 System Management BIOS (SMBIOS)................................................. 81
3.5 Legacy USB Support ........................................................................ 82
3.6 BIOS Updates ................................................................................. 82
3.6.1 Language Support ................................................................ 83
3.6.2 Custom Splash Screen .......................................................... 83
3.7 BIOS Recovery................................................................................ 83
3.8 Boot Options................................................................................... 84
3.8.1 CD-ROM Boot ...................................................................... 84
3.8.2 Network Boot....................................................................... 84
3.8.3 Booting Without Attached Devices........................................... 84
3.8.4 Changing the Default Boot Device During POST ........................ 84
3.9 Adjusting Boot Speed....................................................................... 85
3.9.1 Peripheral Selection and Configuration..................................... 85
3.9.2 BIOS Boot Optimizations ....................................................... 85
3.10 BIOS Security Features .................................................................... 86

Contents
vii
4Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 87
4.2 BIOS Beep Codes ............................................................................ 87
4.3 BIOS Error Messages ....................................................................... 87
4.4 Port 80h POST Codes ....................................................................... 88
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 93
5.1.1 Safety Regulations................................................................ 93
5.1.2 European Union Declaration of Conformity Statement................ 94
5.1.3 Product Ecology Statements................................................... 96
5.1.4 EMC Regulations .................................................................. 99
5.1.5 Product Certification Markings (Board Level)............................100
5.2 Battery Disposal Information............................................................101
Figures
1. Major Board Components.................................................................. 14
2. Block Diagram ................................................................................ 16
3. Memory Channel Configuration and DIMM Configuration........................ 21
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 22
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 22
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... 23
7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 24
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 24
9. Flex Mode Configuration with Two DIMMs............................................ 25
10. Front/Back Panel Audio Connector Options .......................................... 35
11. LAN Connector LED Locations............................................................ 37
12. Thermal Sensors and Fan Headers ..................................................... 40
13. Location of the Onboard Power Indicator LEDs ..................................... 47
14. Detailed System Memory Address Map ............................................... 50
15. Back Panel Connectors ..................................................................... 57
16. Component-side Connectors and Headers ........................................... 58
17. Connection Diagram for Front Panel Header ........................................ 64
18. Connection Diagram for Front Panel USB Headers ................................ 66
19. Connection Diagram for IEEE-1394a Header........................................ 66
20. Location of the Jumper Block............................................................. 67
21. Board Dimensions ........................................................................... 68
22. I/O Shield Dimensions for Boards with IEEE-1394a and
PS/2 Connectors ............................................................................. 70
23. I/O Shield Dimensions for Boards without PS/2 Connectors ................... 71
24. I/O Shield Dimensions for Boards without IEEE-1394a and
PS/2 Connectors ............................................................................. 72
25. Localized High Temperature Zones..................................................... 76

Intel Desktop Board DQ965GF Technical Product Specification
viii
Tables
1. Feature Summary............................................................................ 12
2. Manufacturing Options ..................................................................... 13
3. Board Components Shown in Figure 1 ................................................ 15
4. Supported Memory Configurations ..................................................... 18
5. Memory Operating Frequencies ......................................................... 19
6. Audio Jack Retasking Support ........................................................... 34
7. LAN Connector LED States ................................................................ 37
8. Effects of Pressing the Power Switch .................................................. 41
9. Power States and Targeted System Power........................................... 42
10. Wake-up Devices and Events ............................................................ 43
11. System Memory Map ....................................................................... 51
12. DMA Channels................................................................................. 51
13. I/O Map ......................................................................................... 52
14. PCI Configuration Space Map ............................................................ 53
15. Interrupts ...................................................................................... 54
16. PCI Interrupt Routing Map ................................................................ 55
17. Component-side Connectors and Headers Shown in Figure 16................ 59
18. High Definition Audio Link Header ...................................................... 60
19. Serial ATA Connectors...................................................................... 60
20. Chassis Intrusion Header.................................................................. 60
21. Serial Port Header ........................................................................... 60
22. Front and Rear Chassis Fan Headers .................................................. 60
23. Processor Fan Header ...................................................................... 61
24. Front Panel Audio Header ................................................................. 61
25. Processor Core Power Connector........................................................ 63
26. Main Power Connector...................................................................... 63
27. Front Panel Header .......................................................................... 64
28. States for a One-Color Power LED...................................................... 65
29. States for a Two-Color Power LED...................................................... 65
30. Auxiliary Front Panel Power LED Header.............................................. 65
31. BIOS Setup Configuration Jumper Settings.......................................... 67
32. Compatible I/O shields ..................................................................... 69
33. DC Loading Characteristics ............................................................... 73
34. Fan Header Current Capability........................................................... 73
35. Thermal Considerations for Components ............................................. 77
36. Desktop Board DQ965GF Environmental Specifications.......................... 78
37. BIOS Setup Program Menu Bar.......................................................... 80
38. BIOS Setup Program Function Keys.................................................... 80
39. Acceptable Drives/Media Types for BIOS Recovery ............................... 83
40. Boot Device Menu Options ................................................................ 84
41. Supervisor and User Password Functions............................................. 86
42. Beep Codes .................................................................................... 87
43. BIOS Error Messages ....................................................................... 87
44. Port 80h POST Code Ranges.............................................................. 88
45. Port 80h POST Codes ....................................................................... 89
46. Typical Port 80h POST Sequence........................................................ 92

Contents
ix
47. Safety Regulations........................................................................... 93
48. Lead-Free Board Markings ................................................................ 98
49. EMC Regulations ............................................................................. 99
50. Product Certification Markings ..........................................................100

Intel Desktop Board DQ965GF Technical Product Specification
x