Intel BOXDQ67EPB3 User manual

Intel® Desktop Board
DQ67EP
Technical Product Specification
January 2011
Order Number: G15493-001US
The Intel®Desktop Board DQ67EP may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DQ67EP Specification Update.

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DQ67EP Technical Product
Specification
January 2011
This product specification applies to only the standard Intel®Desktop Board DQ67EP with BIOS
identifier SWQ6710H.86A.
Changes to this specification will be published in the Intel Desktop Board DQ67EP Specification
Update before being incorporated into a revision of this document.
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Copyright ©2011, Intel Corporation. All rights reserved.

Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
Intel®Desktop Board DQ67EP.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DQ67EP and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DQ67EP
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DQ67EP Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
TDP Thermal Design Power

v
Contents
1Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 Intel®Q67 Express Chipset............................................................... 15
1.6 System Memory .............................................................................. 15
1.6.1 Memory Configurations ......................................................... 16
1.7 Graphics Subsystem ........................................................................ 18
1.7.1 Integrated Graphics.............................................................. 18
1.7.2 PCI Express x16 Graphics ...................................................... 19
1.8 USB............................................................................................... 19
1.9 SATA Interfaces .............................................................................. 20
1.10 Legacy I/O Controller....................................................................... 21
1.10.1 Serial Port........................................................................... 21
1.11 Audio Subsystem............................................................................. 22
1.11.1 Audio Subsystem Software .................................................... 22
1.11.2 Audio Headers and Connectors ............................................... 22
1.12 LAN Subsystem............................................................................... 24
1.12.1 Intel®82579LM Gigabit Ethernet Controller.............................. 24
1.12.2 LAN Subsystem Software....................................................... 24
1.12.3 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.13 Real-Time Clock Subsystem .............................................................. 26
1.14 Thermal Monitoring.......................................................................... 27
1.15 Platform Management and Security.................................................... 28
1.15.1 Hardware Management Subsystem ......................................... 28
1.15.2 Hardware Monitoring............................................................. 28
1.15.3 Intel®vPro™ Technology....................................................... 29
1.16 Power Management ......................................................................... 33
1.16.1 ACPI................................................................................... 34
1.16.2 Hardware Support ................................................................ 37
2Technical Reference
2.1 Memory Resources .......................................................................... 41
2.1.1 Addressable Memory............................................................. 41
2.1.2 Memory Map........................................................................ 43
2.2 Connectors and Headers................................................................... 43
2.2.1 Back Panel Connectors .......................................................... 44
2.2.2 Component-side Connectors and Headers ................................ 45
2.3 BIOS Configuration Jumper Block....................................................... 54

Intel Desktop Board DQ67EP Technical Product Specification
vi
2.4 Intel®Management Engine BIOS Extension (Intel®MEBX)
Reset Header.................................................................................. 55
2.5 Mechanical Considerations ................................................................ 57
2.5.1 Form Factor......................................................................... 57
2.6 Electrical Considerations................................................................... 58
2.6.1 Power Supply Considerations ................................................. 58
2.6.2 Fan Header Current Capability................................................ 59
2.6.3 Add-in Board Considerations .................................................. 59
2.7 Thermal Considerations.................................................................... 60
2.8 Reliability ....................................................................................... 62
2.9 Environmental ................................................................................ 62
3Overview of BIOS Features
3.1 Introduction ................................................................................... 63
3.2 System Management BIOS (SMBIOS)................................................. 65
3.3 Legacy USB Support ........................................................................ 65
3.4 BIOS Updates ................................................................................. 66
3.4.1 Language Support ................................................................ 66
3.4.2 Custom Splash Screen .......................................................... 67
3.5 BIOS Recovery................................................................................ 67
3.6 Boot Options................................................................................... 68
3.6.1 Optical Drive Boot ................................................................ 68
3.6.2 Network Boot....................................................................... 68
3.6.3 Booting Without Attached Devices........................................... 68
3.6.4 Changing the Default Boot Device During POST ........................ 68
3.7 Hard Disk Drive Password Security Feature ......................................... 69
3.8 BIOS Security Features .................................................................... 70
4Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 73
4.2 BIOS Beep Codes ............................................................................ 73
4.3 Front-panel Power LED Blink Codes.................................................... 74
4.4 BIOS Error Messages ....................................................................... 74
4.5 Port 80h POST Codes ....................................................................... 75
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 81
5.1.1 Safety Standards.................................................................. 81
5.1.2 European Union Declaration of Conformity Statement................ 82
5.1.3 Product Ecology Statements................................................... 83
5.1.4 EMC Regulations .................................................................. 85
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 88
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 89
5.2 Battery Disposal Information............................................................. 90

Contents
vii
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration ........................................... 17
4. Back Panel Audio Connector Options .................................................. 23
5. LAN Connector LED Locations............................................................ 25
6. Thermal Sensors and Fan Headers ..................................................... 27
7. Location of the Standby Power LED (Green) ........................................ 40
8. Detailed System Memory Address Map ............................................... 42
9. Back Panel Connectors ..................................................................... 44
10. Component-side Connectors and Headers ........................................... 45
11. Connection Diagram for Front Panel Header ........................................ 51
12. Connection Diagram for Front Panel USB Headers ................................ 53
13. Location of the Jumper Block............................................................. 54
14. Intel MEBX Reset Header.................................................................. 56
15. Board Dimensions ........................................................................... 57
16. Localized High Temperature Zones..................................................... 61
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 16
4. LAN Connector LED States ................................................................ 25
5. Effects of Pressing the Power Switch .................................................. 34
6. Power States and Targeted System Power........................................... 35
7. Wake-up Devices and Events ............................................................ 36
8. System Memory Map ....................................................................... 43
9. Component-side Connectors and Headers Shown in Figure 10................ 46
10. Serial Port Header ........................................................................... 47
11. S/PDIF Header ................................................................................ 47
12. Internal Mono Speaker Header .......................................................... 47
13. Front Panel Audio Header for Intel HD Audio........................................ 47
14. Front Panel Audio Header for AC ’97 Audio .......................................... 48
15. Front Panel USB Header ................................................................... 48
16. SATA Connectors............................................................................. 48
17. Chassis Intrusion Header.................................................................. 49
18. Processor and System Fan Headers.................................................... 49
19. Processor Core Power Connector........................................................ 50
20. Main Power Connector...................................................................... 50
21. Front Panel Header .......................................................................... 51
22. States for a One-Color Power LED...................................................... 52
23. Alternate Front Panel Power LED Header............................................. 52
24. BIOS Setup Configuration Jumper Settings.......................................... 55
25. Intel MEBX Reset Header Signals ....................................................... 56
26. Recommended Power Supply Current Values ....................................... 58
27. Fan Header Current Capability........................................................... 59

Intel Desktop Board DQ67EP Technical Product Specification
viii
28. Thermal Considerations for Components ............................................. 61
29. Environmental Specifications............................................................. 62
30. BIOS Setup Program Menu Bar.......................................................... 64
31. BIOS Setup Program Function Keys.................................................... 64
32. Acceptable Drives/Media Types for BIOS Recovery ............................... 67
33. Boot Device Menu Options ................................................................ 68
34. Master Key and User Hard Drive Password Functions ............................ 69
35. Supervisor and User Password Functions............................................. 71
36. BIOS Beep Codes ............................................................................ 73
37. Front-panel Power LED Blink Codes.................................................... 74
38. BIOS Error Messages ....................................................................... 74
39. Port 80h POST Code Ranges.............................................................. 75
40. Port 80h POST Codes ....................................................................... 76
41. Typical Port 80h POST Sequence........................................................ 80
42. Safety Standards............................................................................. 81
43. EMC Regulations ............................................................................. 85
44. Regulatory Compliance Marks............................................................ 89

9
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor •Intel®Core™ i7, Intel®Core™ i5, Intel®Core™ i3, and Intel®Pentium®
processors in an LGA1155 socket with up to 95 W TDP:
―Integrated graphics processing (processors with Intel®Graphics
Technology)
―External graphics interface controller
―Integrated memory controller
Note: Use of a 95 W TDP processor requires a custom thermal solution. See the Note on
page 14 for more information.
Chipset Intel®Q67 Express Chipset consisting of the Intel®Q67 Platform Controller
Hub (PCH)
Memory •Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
•Support for non-ECC memory
Graphics •Integrated graphics support for processors with Intel®Graphics Technology:
―DVI-I
―DVI-D
―DisplayPort*
•Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio •Intel®High Definition Audio:
―Realtek* ALC888S audio codec
―S/PDIF audio header
―DisplayPort Digital Audio
―Front panel audio header
―Mono speaker header
continued

Intel Desktop Board DQ67EP Technical Product Specification
10
Table 1. Feature Summary (continued)
Peripheral
Interfaces
•Twelve USB ports:
―Two USB 3.0 ports are implemented with stacked back panel
connectors (blue)
―Four USB 2.0 ports are implemented with stacked back panel
connectors (black)
―Six USB 2.0 front panel ports are implemented through three dual-port
internal headers
•Six SATA interfaces through the Intel Q67 Express Chipset with Intel®Rapid
Storage Technology RAID support:
―Two internal SATA 6 Gb/s ports (blue)
―Two internal SATA 3 Gb/s ports (black)
―Two backpanel eSATA 3 Gb/s ports (red)
•One serial port header
Legacy I/O Control •Nuvoton* W83677HG-i Super I/O controller for hardware management and
serial port support
BIOS •Intel®BIOS resident in the SPI Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
•Support for PCI* Local Bus Specification Revision 2.2
•Support for PCI Express*
•Suspend to RAM support
•Wake on PCI, PCI Express, LAN, front panel, serial, and USB ports
LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel®82579LM Gigabit
Ethernet Controller
Expansion
Capabilities
•One PCI Express 2.0 x16 add-in card connector
•One PCI Express x1 Half-Mini add-in card connector
Hardware Monitor
Subsystem
•Hardware monitoring through the Nuvoton I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•All fan headers use PWM control
•One 4-pin header for the processor fan
•4-wire and 3-wire (linear) fan speed control support for the system fan
•Support for Platform Environmental Control Interface (PECI)
Intel® vPro™
Technology
•Intel® Advanced Management Technology (Intel®AMT) 7.0
•Intel® Trusted Execution Technology (Intel® TXT)
•Intel®Fast Call for Help (Intel®FCFH)
•Intel®Virtualization Technology (Intel®VT)
•Intel®Virtualization for Directed I/O (Intel®VT-d)
•KVM Remote Control
NOTE
Nuvoton parts may be labeled as Winbond* on the board.

Product Description
11
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DQ67EP.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.

Intel Desktop Board DQ67EP Technical Product Specification
12
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Back panel connectors
B Battery
C Serial port header
D 12 V internal power connector (ATX12V)
E Intel Q67 Express Chipset
F SATA connectors
G Front panel USB 2.0 header
H PCI Express Half-Mini card connector
I Main power connector (2 x 12)
J Standby power LED
K System fan header
L Front panel USB 2.0 header
M Piezoelectric Speaker
N Front panel USB 2.0 header
O Front panel header
P Alternate front panel power LED header
Q Intel Fast Call for Help (Intel FCFH) header
R Low Pin Count (LPC) Debug connector
S Chassis intrusion header
T BIOS setup configuration jumper block
U DDR3 DIMM 2 socket
V DDR3 DIMM 1 socket
W LGA1155 processor socket
X PCI Express x16 add-in card connector
Y Processor fan header
Z Intel®Management Engine BIOS Extension (Intel®MEBX) Reset header
AA S/PDIF header
BB Internal mono speaker header
CC Front panel audio header

Product Description
13
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram

Intel Desktop Board DQ67EP Technical Product Specification
14
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
•No floppy drive connector
•No PS/2 connector
•No Parallel ATA (PATA) IDE drive connector
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DQ67EP http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DQ67EP
http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, and
Intel Pentium processors in an LGA1155 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum TDP of 95 W. See the Intel web site listed below for the
most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
Use of a 95 W TDP processor requires a custom thermal solution. Pairing a mini-ITX
chassis and a 95 W TDP processor with the supplied standard Intel thermal solution
may not meet thermal requirements. Verify that your thermal solution and chassis
will meet the necessary thermal requirements. Failing to do so will cause the
processor to throttle, significantly decreasing system performance.

Product Description
15
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 58 for information on power supply requirements for this board.
1.5 Intel®Q67 Express Chipset
The Intel Q67 Express Chipset consisting of the Intel Q67 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network,
display, Conventional PCI, and PCI Express. The PCH is a centralized controller for the
board’s I/O paths.
For information about Refer to
The Intel Q67 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6 System Memory
The board has two DIMM sockets and supports the following memory features:
•Two independent memory channels with interleaved mode support
•Supports 1.2 V – 1.8 V DIMM memory voltage
•Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8
organization
•16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
•Minimum total system memory: 1 GB using 1 Gb x8 module
•Serial Presence Detect
•DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.

Intel Desktop Board DQ67EP Technical Product Specification
16
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
Configuration
(Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
1024 MB SS 1 Gbit 1 Gb x8/empty 8
2048 MB DS 1 Gbit 1 Gb x8/1 Gb x8 16
2048 MB SS 2 Gbit 2 Gb x8/empty 8
4096 MB DS 2 Gbit 2 Gb x8/2 Gb x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.6.1 Memory Configurations
The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors support the
following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm

Product Description
17
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration

Intel Desktop Board DQ67EP Technical Product Specification
18
1.7 Graphics Subsystem
The board supports system graphics through either Intel Graphics Technology or a
PCI Express 2.0 x16 add-in graphics card.
1.7.1 Integrated Graphics
The board supports integrated graphics through the Intel®Flexible Display Interface
(Intel®FDI) for processors with Intel Graphics Technology.
NOTE
If using a processor with integrated graphics, the board will support only two of the
integrated graphics interfaces simultaneously: DisplayPort, DVI-I, DVI-D.
NOTE
The board will support up to two integrated graphics interfaces plus one PCI Express
Graphics card simultaneously with required changes to the BIOS setup.
1.7.1.1 DisplayPort*
DisplayPort is a digital communication interface that utilizes differential signaling to
achieve a high bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays. DisplayPort is suitable for display
connections between consumer electronics devices such as high definition optical disc
players, set top boxes, and TV displays. DisplayPort output can also be converted to
High-Definition Multimedia Interface* (HDMI*) using a DisplayPort-HDMI converter.
DisplayPort’s maximum supported display resolution is 2560 x 1600 at 60 Hz refresh
with a 16:10 aspect ratio (WQXGA). DisplayPort 1.1 adds support for High Bandwidth
Digital Content Protection (HDCP) version 1.3. HDCP support enables viewing of
protected content from Blu-ray Disc* and HD-DVD optical media over DisplayPort 1.1
connections.
For information about Refer to
DisplayPort technology http://www.displayport.org
1.7.1.2 Digital Visual Interface (DVI)
The DVI-I port supports both digital and analog DVI displays. The maximum
supported resolution is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI port is
compliant with the DVI 1.0 specification. DVI analog output can also be converted to
VGA using a DVI-VGA converter.
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI-D port is compliant with the
DVI 1.0 specification.

Product Description
19
1.7.2 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an
LGA1155 socket support discrete add in graphics cards through the PCI Express 2.0
x16 graphics connector:
•Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is
8 GB/s in each direction, simultaneously, when operating in x16 mode.
•Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is
4 GB/s in each direction, simultaneously, when operating in x16 mode.
For information about Refer to
PCI Express technology http://www.pcisig.com
1.8 USB
The board supports up to ten USB 2.0 ports and two USB 3.0 ports.
The Intel Q67 Express Chipset provides the USB controller for the 2.0 ports. The two
USB 3.0 ports are provided by the NEC* UPD720200 controller. The port arrangement
is as follows:
•Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
•Four USB 2.0 ports are implemented with stacked back panel connectors (black)
•Six USB 2.0 front panel ports implemented through three internal headers
All 12 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports
are super-speed capable.
NOTES
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
In order to use supported USB 3.0 features, you must first install the USB 3.0 drivers.
Operating system installation may be interrupted if keyboard and mouse devices are
connected to the SuperSpeed USB 3.0 ports (blue) during installation due to the lack
of native USB 3.0 driver support from the operating system.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 44
The location of the front panel USB headers Figure 10, page 45
Obtaining USB 3.0 software and drivers Section 1.3, page 14

Intel Desktop Board DQ67EP Technical Product Specification
20
1.9 SATA Interfaces
The board provides six SATA connectors through the PCH, which support one device
per connector:
•Two internal SATA 6 Gb/s ports (blue)
•Two internal SATA 3 Gb/s ports (black)
•Two backpanel eSATA 3 Gb/s ports for external connectivity (red)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6 Gb/s for two ports and 3 Gb/s for four ports. A point-to-point interface is used for
host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP, Windows Vista*, and Windows 7* operating
systems.
For more information, see: http://www.serialata.org/.
For information about Refer to
The location of the SATA connectors Figure 10, page 45
1.9.1.1 Serial ATA RAID
The board supports the Intel Rapid Storage Technology (Intel RST) which provides the
following RAID (Redundant Array of Independent Drives) levels:
•RAID 0 - data striping
•RAID 1 - data mirroring
•RAID 0+1 (or RAID 10) - data striping and mirroring
•RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS. Also,
during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.