Intel Desktop Board D2700DC User manual

Intel® Desktop Board
D2700DC
Technical Product Specification
June 2012
Part Number: G34959-002
The Intel®Desktop Board D2700DC may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board D2700DC Specification Update.

ii
Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board D2700DC Technical Product
Specification. December 2011
-002 Specification Clarification June 2012
This product specification applies to only the standard Intel®Desktop Board D2700DC with BIOS
identifier MUCDT10N.86A.
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to deviate from published specifications. Current characterized errata are available on request.
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Copyright © 2011, 2012, Intel Corporation. All rights reserved.

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Board Identification Information
Basic Desktop Board D2700DC Identification Information
AA Revision BIOS Revision Notes
G32420-503 MUCDT10N.86A.0047 1,2
G32420-504 MUCDT10N.86A.0067 1,2
G32420-600 MUCDT10N.86A.0067 1,2
G32420-601 MUCDT10N.86A.0067 1,2
G32420-602 MUCDT10N.86A.0069 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Intel®NM10 Express Chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
CG82NM10 B0 SLGXX
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel®Desktop Board D2700DC.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
June 2012 Spec Clarification Added a Note to section 1.4 System Memory on page 18.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.

Intel Desktop Board D2700DC Technical Product Specification
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Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board D2700DC. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D2700DC and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter
Description
1
A description of the hardware used on the board
2
A map of the resources of the board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board D2700DC Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vii
Contents
1Product Description
1.1 Overview......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Intel®D2700 Graphics Subsystem........................................... 17
1.4 System Memory ............................................................................... 18
1.5 Intel®NM10 Express Chipset.............................................................. 20
1.5.2 USB..................................................................................... 21
1.5.3 SATA Support....................................................................... 21
1.6 Real-Time Clock Subsystem............................................................... 22
1.7 Legacy I/O Controller........................................................................ 22
1.8 LAN Subsystem................................................................................ 23
1.8.1 LAN Subsystem Drivers.......................................................... 23
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.9 Audio Subsystem.............................................................................. 25
1.9.1 Audio Subsystem Software..................................................... 26
1.9.2 Audio Connectors and Headers................................................ 26
1.10 Hardware Management Subsystem..................................................... 27
1.10.1 Hardware Monitoring ............................................................. 27
1.10.2 Thermal Monitoring ............................................................... 28
1.11 Power Management .......................................................................... 29
1.11.1 ACPI.................................................................................... 29
1.11.2 Hardware Support ................................................................. 32
2Technical Reference
2.1 Memory Map.................................................................................... 35
2.1.1 Addressable Memory ............................................................. 35
2.2 Connectors and Headers.................................................................... 38
2.2.1 Back Panel ........................................................................... 39
2.2.2 Component-side Connectors and Headers................................. 41
2.3 BIOS Configuration Jumper Block ....................................................... 50
2.4 Mechanical Considerations ................................................................. 52
2.4.1 Form Factor.......................................................................... 52
2.5 Electrical Considerations.................................................................... 53
2.5.1 Fan Header Current Capability ................................................ 53
2.5.2 Add-in Board Considerations................................................... 53
2.6 Thermal Considerations..................................................................... 53
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 55

Intel Desktop Board D2700DC Technical Product Specification
viii
2.7 Power Consumption .......................................................................... 58
2.7.1 Minimum Load Configuration................................................... 58
2.7.2 Maximum Load Configuration.................................................. 58
2.8 Reliability......................................................................................... 59
2.9 Environmental.................................................................................. 59
3Overview of BIOS Features
3.1 Introduction..................................................................................... 61
3.2 BIOS Flash Memory Organization........................................................ 62
3.3 Resource Configuration ..................................................................... 62
3.3.1 PCI* Autoconfiguration .......................................................... 62
3.4 System Management BIOS (SMBIOS) ................................................. 63
3.5 Legacy USB Support ......................................................................... 64
3.6 BIOS Updates .................................................................................. 65
3.6.1 BIOS Recovery...................................................................... 65
3.6.2 Custom Splash Screen ........................................................... 66
3.7 Boot Options.................................................................................... 66
3.7.1 Optical Drive Boot ................................................................. 66
3.7.2 Network Boot........................................................................ 66
3.7.3 Booting Without Attached Devices........................................... 67
3.7.4 Changing the Default Boot Device During POST......................... 67
3.8 BIOS Security Features ..................................................................... 68
4Board Status and Error Messages
4.1 BIOS Beep Codes ............................................................................. 69
4.2 Front-panel Power LED Blink Codes..................................................... 70
4.3 BIOS Error Messages ........................................................................ 70
4.4 Port 80h POST Codes ........................................................................ 71
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance...................................................................... 77
5.1.1 Safety Standards................................................................... 77
5.1.2 European Union Declaration of Conformity Statement ................ 78
5.1.3 Product Ecology Statements ................................................... 79
5.1.4 EMC Regulations ................................................................... 81
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 84
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 85
5.2 Battery Disposal Information.............................................................. 86

Contents
ix
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram.................................................................................. 15
3. Memory Channel and SO-DIMM Configuration ...................................... 19
4. LAN Connector LED Locations............................................................. 24
5. Back Panel Audio Connectors ............................................................. 26
6. Thermal Sensors and Fan Header ....................................................... 28
7. Location of the Standby Power Indicator LED ....................................... 34
8. Detailed System Memory Address Map................................................ 36
9. Back Panel Connectors ...................................................................... 39
10. I/O Shield Reference Diagram............................................................ 40
11. Component-side Connectors and Headers............................................ 41
12. Connection Diagram for Front Panel Header......................................... 47
13. Connection Diagram for Front Panel USB Header .................................. 49
14. Connection Diagram for Front Panel USB Header with Intel Z-USB
Solid-State Drive or Compatible Device Support ................................... 49
15. Location of the BIOS Configuration Jumper Block.................................. 50
16. Board Dimensions............................................................................. 52
17. Localized High Temperature Zones ..................................................... 54
18. Fan Location Guide for Chassis Selection (Chassis Orientation is Not
Restricted)....................................................................................... 57
Tables
1. Specification Changes or Clarifications...................................................iii
2. Feature Summary............................................................................. 11
3. Board Components Shown in Figure 1................................................. 14
4. Supported Memory Configurations1..................................................... 18
5. LAN Connector LED States................................................................. 24
6. Audio Jack Support........................................................................... 25
7. Effects of Pressing the Power Switch ................................................... 29
8. Power States and Targeted System Power ........................................... 30
9. Wake-up Devices and Events ............................................................. 31
10. System Memory Map ........................................................................ 37
11. Component-side Connectors and Headers Shown in Figure 11................ 42
12. System Fan Header .......................................................................... 43
13. SATA Connectors.............................................................................. 43
14. Front Panel Wireless Activity LED Header............................................. 43
15. Front Panel Audio Header for Intel HD Audio........................................ 43
16. Front Panel Audio Header for AC ’97 Audio........................................... 43
17. Front Panel USB Header .................................................................... 44
18. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or
Compatible Device Support................................................................ 44
19. Power Connector .............................................................................. 46
20. Front Panel Header ........................................................................... 47

Intel Desktop Board D2700DC Technical Product Specification
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21. States for a One-Color Power LED....................................................... 48
22. BIOS Configuration Jumper Settings ................................................... 51
23. Fan Header Current Capability............................................................ 53
24. Thermal Considerations for Components.............................................. 55
25. Minimum Load Configuration Current and Power Results........................ 58
26. Maximum Load Configuration Current and Power Results....................... 59
27. Intel Desktop Board D2700DC Environmental Specifications................... 59
28. BIOS Setup Program Menu Bar........................................................... 62
29. BIOS Setup Program Function Keys .................................................... 62
30. Acceptable Drives/Media Types for BIOS Recovery................................ 65
31. Boot Device Menu Options................................................................. 67
32. Supervisor and User Password Functions ............................................. 68
33. BIOS Beep Codes ............................................................................. 69
34. Front-panel Power LED Blink Codes..................................................... 70
35. BIOS Error Messages ........................................................................ 70
36. Port 80h POST Code Ranges .............................................................. 71
37. Port 80h POST Codes ........................................................................ 72
38. Typical Port 80h POST Sequence ........................................................ 75
39. Safety Standards.............................................................................. 77
40. EMC Regulations............................................................................... 81
41. ENERGY STAR Requirements.............................................................. 84
42. Regulatory Compliance Marks ............................................................ 85

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1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of Intel Desktop Board D2700DC.
Table 2. Feature Summary
Form Factor Mini-ITX, (6.7 inches by 6.7 inches [170 millimeters by 170 millimeters])
compatible with microATX
Processor Passively-cooled, soldered-down Dual-Core Intel®Atom™ processor with
integrated graphics and integrated memory controller
Memory •Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-
DIMM) sockets
•Support for DDR3 1066 MHz, DDR3 1333 MHz, and DDR3 1600 MHz
SO-DIMMs
Note: DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz
•Support for up to 4 GB of system memory on a single SO-DIMM
Chipset Passively cooled, Intel®NM10 Express Chipset
Audio Multi-streaming 5.1 (6-channel) audio subsystem support based on the Realtek*
ALC662 high definition audio codec
Graphics Onboard Intel®graphics subsystem with support for:
―High Definition Multimedia Interface* (HDMI*)
―DVI-D
•External graphics support provided through the Conventional PCI bus
connector
Legacy I/O Control Winbond W83627DHG-P based Legacy I/O controller for hardware management
Peripheral
Interfaces
•
Seven USB 2.0 ports:
―Four back panel ports
―Two ports are implemented with a dual port internal header for front panel
cabling
―One port is implemented with an internal header (brown-colored) that
supports an Intel®Z-U130 USB Solid-State Drive or compatible device
•Two Serial ATA (SATA) 3.0 Gb/s connectors (supporting IDE and AHCI mode)
LAN Support 10/100/1000 Mb/s Ethernet LAN subsystem using an Intel®82574L Gigabit
Ethernet Controller
continued

Intel Desktop Board D2700DC Technical Product Specification
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Table 2. Feature Summary (continued)
BIOS •Intel
®
BIOS (resident in the SPI Flash device)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and SMBIOS
Instantly Available
PC Technology
•
Suspend to RAM support
•Wake on PCI, PCI Express*, front panel, USB ports, and LAN
Expansion
Capabilities
•
One Conventional PCI bus connector (with riser card support for up to two PCI
cards)
•One PCI Express Full-/Half-Mini Card slot
Hardware Monitor
Subsystem
•Hardware monitoring through the Windbond I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•One fan header
•One fan sense input used to monitor fan activity
•Fan speed control

Product Description
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1.1.2 Board Layout
Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 3 lists the components identified in Figure 1.

Intel Desktop Board D2700DC Technical Product Specification
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Table 3. Board Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Back panel connectors
B Standby power LED
C Processor core power connector (2 x 12)
D Intel Atom processor
E SO-DIMM channel A socket, DIMM 1
F SO-DIMM channel A socket, DIMM 0
G Intel NM10 Express Chipset
H SATA connectors
I System fan header
J Front panel header
K BIOS setup configuration jumper block
L Battery
M Front panel USB 2.0 header
N Front Panel Wireless Activity LED header
O Piezo/monotonic speaker header
P PCI Express Full-/Half-Mini Card slot
Q Conventional PCI bus add-in card connector
R Front panel audio header
S Front panel USB header (supports Intel Z-U130 USB Solid-
State Drive or compatible device (brown-colored)

Product Description
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1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram

Intel Desktop Board D2700DC Technical Product Specification
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1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D2700DC http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board D2700DC http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.3 Processor
The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with
integrated graphics and integrated memory controller.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
Power supply connectors Section 2.2.2.3, page 46

Product Description
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1.3.1 Intel®D2700 Graphics Subsystem
1.3.1.1 Intel®Graphics Media Accelerator 3650 Graphics
Controller (Intel®GMA)
The Intel®GMA 3650 graphics controller features the following:
•640 MHz core frequency
•High quality texture engine
DX9.3* and OpenGL* 3.0 compliant
Hardware Pixel Shader 4.1
Vertex Shader Model 4.1
•Video
Blu-Ray 2.0
H.264 & VC1 hardware decoder
PAVP 1.1c
HDCP 1.3
•Display
Supports HDMI and DVI displays up to 1920 x 1200 at 60 Hz refresh (WUXGA)
Dual independent display support
For information about Refer to
Obtaining graphics software and utilities Section 1.2, page 16
1.3.1.2 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multi-
channel digital audio on a single cable. . The maximum supported resolution is 1920 x
1200 (WUXGA). The HDMI port is compliant with the HDMI 1.3a specification
The HDMI port is enabled for POST whenever a monitor is attached

Intel Desktop Board D2700DC Technical Product Specification
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1.4 System Memory
The board has two 204-pin DDR3 SO-DIMM sockets and supports the following
memory features:
•DDR3 SDRAM SO-DIMMs with gold-plated contacts
•Unbuffered, single-sided or double-sided DIMMs
•4 GB maximum total system memory
•Minimum total system memory: 256 MB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR3 1066 MHz, DDR3 1333 MHz, DDR3 1600 MHz SO-DIMMs
(DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz)
NOTES
•Due to passively-cooled thermal constraints, system memory must have an
operating temperature rating of 85 oC.
The board is designed to be passively cooled in a properly ventilated
chassis. Chassis venting locations are recommended above the system
memory area for maximum heat dissipation effectiveness.
•If you are installing only one SO-DIMM, it must be installed in the bottom
socket (SO-DIMM 1).
•To be fully compliant with all applicable DDR3 SDRAM memory
specifications, the board should be populated with SO-DIMMs that support
the Serial Presence Detect (SPD) data structure. This allows the BIOS to
read the SPD data and program the chipset to accurately configure memory
settings for optimum performance. If non-SPD memory is installed,
performance and reliability may be impacted or the SO-DIMMs may not
function under the determined frequency.
Table 4 lists the supported SO-DIMM configurations.
Table 4. Supported Memory Configurations1
Raw Card
Version SO-DIMM Capacity DRAM Device Technology DRAM Organization # of DRAM Devices
B 1 GB 1 Gb 128 M x 8 8
2 GB 2 Gb 256 M x 8 8
F 2 GB 1 Gb 128 M x 8 16
4 GB22 Gb 256 M x 8 16
Notes:
1. System memory configurations are based on availability and are subject to change.
2. Support for one 4 GB SO-DIMM installed in slot 1. Slot 0 must be left empty.

Product Description
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Figure 3 illustrates the memory channel and SO-DIMM configuration.
Figure 3. Memory Channel and SO-DIMM Configuration

Intel Desktop Board D2700DC Technical Product Specification
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1.5 Intel®NM10 Express Chipset
The Intel NM10 Express Chipset provides interfaces to the processor and the USB,
SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel NM10 Express Chipset is a
centralized controller for the board’s I/O paths.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5.1.1 Video Memory Allocation
Video memory is allocated from the total available system memory for the efficient
balancing of 2-D/3-D graphics performance and overall system performance. Dynamic
allocation of system memory to video memory is as follows:
•256 MB total RAM results in 32 MB video RAM
•512 MB total RAM results in 64 MB video RAM
•1 GB total RAM results in 128 MB video RAM
•2 GB total RAM results in 224 MB video RAM
1.5.1.2 Digital Visual Interface (DVI-D)
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI-D port is compliant with the
DVI 1.0 specification.