Intel DH61BF Configuration guide

Intel® Desktop Board
DH61BF
Technical Product Specification
July 2013
Part Number: G83040-003
The Intel®Desktop Board DH61BF may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DH61BF Specification Update.

ii
Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DH61BF Technical Product
Specification December 2012
-002 Specification Clarification May 2013
-003
Specification Clarification
July 2013
This product specification applies to only the standard Intel®Desktop Board DH61BF with BIOS
identifier BFH6110H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
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DEATH MAY OCCUR.
All Intel®desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
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or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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* Other names and brands may be claimed as the property of others.
Copyright 2012, 2013, Intel Corporation. All rights reserved.

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Board Identification Information
Basic Desktop Board DH61BF Identification Information
AA Revision
BIOS Revision
Notes
G81311-101
BFH6110H.86A.0007
1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The H61 chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
82H61 B3 SLJ4B
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that
apply to the Intel®Desktop Board DH61BF.
Specification Changes or Clarifications
Date
Type of Change
Description of Changes or Clarifications
May 2013
Spec Clarifications
Added ENERGY STAR Note to Section 5.1.5.
July 2013 Spec Clarification Deleted references to ENERGY STAR.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://www.intel.com/content/www/us/en/motherboards/desktop-
motherboards/motherboards.html?wapkw=desktop+boards for the latest
documentation.

Intel Desktop Board DH61BF Technical Product Specification
iv

v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
Intel®Desktop Board DH61BF.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DH61BF and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1
A description of the hardware used on the Intel Desktop Board DH61BF
2
A map of the resources of the Intel Desktop Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DH61BF Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s
Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vii
Contents
Revision History
Board Identification Information..................................................................iii
Errata ......................................................................................................iii
Preface
Intended Audience..................................................................................... v
What This Document Contains..................................................................... v
Typographical Conventions ......................................................................... v
1Product Description
1.1 Overview......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support................................................................................. 16
1.3 Processor ........................................................................................ 16
1.4 Intel®H61 Express Chipset................................................................ 17
1.5 System Memory ............................................................................... 17
1.5.1 Memory Configurations .......................................................... 18
1.6 Graphics Subsystem ......................................................................... 19
1.6.1 Integrated Graphics............................................................... 19
1.7 USB ................................................................................................ 20
1.8 SATA Interfaces ............................................................................... 20
1.9 Legacy I/O Controller........................................................................ 20
1.9.1 Serial Port ............................................................................ 21
1.10 Audio Subsystem.............................................................................. 21
1.10.1 Audio Subsystem Software..................................................... 21
1.10.2 Audio Headers and Connectors................................................ 22
1.11 LAN Subsystem................................................................................ 23
1.11.1 Realtek RTL8111E Gigabit Ethernet Controller........................... 23
1.11.2 LAN Subsystem Software ....................................................... 23
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.12 Real-Time Clock Subsystem............................................................... 25
1.13 Thermal Monitoring........................................................................... 26
1.14 Platform Management and Security..................................................... 27
1.14.1 Hardware Management Subsystem.......................................... 27
1.14.2 Hardware Monitoring ............................................................. 27
1.15 Power Management .......................................................................... 28
1.15.1 ACPI..................................................................................... 28
1.15.2 Hardware Support ................................................................. 31

Intel Desktop Board DH61BF Technical Product Specification
viii
2Technical Reference
2.1 Memory Resources ........................................................................... 35
2.1.1 Addressable Memory.............................................................. 35
2.1.2 Memory Map......................................................................... 37
2.2 Connectors and Headers.................................................................... 37
2.2.1 Back Panel Connectors........................................................... 38
2.2.2 Component-side Connectors and Headers................................. 39
2.3 BIOS Configuration Jumper Block ....................................................... 47
2.4 Mechanical Considerations................................................................. 48
2.4.1 Form Factor.......................................................................... 48
2.5 Electrical Considerations.................................................................... 49
2.5.1 Power Supply Considerations .................................................. 49
2.5.2 Fan Header Current Capability ................................................ 50
2.5.3 Add-in Board Considerations................................................... 50
2.6 Thermal Considerations..................................................................... 51
2.7 Reliability ........................................................................................ 53
2.8 Environmental.................................................................................. 53
3Overview of BIOS Features
3.1 Introduction..................................................................................... 55
3.2 System Management BIOS (SMBIOS) ................................................. 57
3.3 Legacy USB Support ......................................................................... 57
3.4 BIOS Updates .................................................................................. 58
3.4.1 Language Support................................................................. 58
3.4.2 Custom Splash Screen ........................................................... 59
3.5 BIOS Recovery................................................................................. 59
3.6 Boot Options.................................................................................... 60
3.6.1 Optical Drive Boot ................................................................. 60
3.6.2 Network Boot........................................................................ 60
3.6.3 Booting Without Attached Devices........................................... 60
3.6.4 Changing the Default Boot Device During POST......................... 60
4Error Messages and Beep Codes
4.1 BIOS Beep Codes ............................................................................. 61
4.2 Front-panel Power LED Blink Codes..................................................... 61
4.3 BIOS Error Messages ........................................................................ 62
4.4 Port 80h POST Codes........................................................................ 62
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance...................................................................... 69
5.1.1 Safety Standards................................................................... 69
5.1.2 European Union Declaration of Conformity Statement................ 70
5.1.3 Product Ecology Statements ................................................... 71
5.1.4 EMC Regulations ................................................................... 73
5.1.5 e-Standby and ErP Compliance ............................................... 76
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 77
5.2 Battery Disposal Information.............................................................. 78

Contents
ix
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram.................................................................................. 15
3. Memory Channel and DIMM Configuration............................................ 19
4. Back Panel Audio Connector Options ................................................... 22
5. LAN Connector LED Locations............................................................. 24
6. Thermal Sensors and Fan Headers...................................................... 26
7. Detailed System Memory Address Map................................................ 36
8. Back Panel Connectors...................................................................... 38
9. Component-side Connectors and Headers............................................ 39
10. Connection Diagram for Front Panel Header......................................... 44
11. Connection Diagram for the Front Panel USB Header............................. 46
12. Location of the Jumper Block ............................................................. 47
13. Board Dimensions............................................................................. 48
14. Localized High Temperature Zones ..................................................... 52
Tables
1. Feature Summary............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Supported Memory Configurations...................................................... 18
4. Audio Jack Support........................................................................... 21
5. LAN Connector LED States................................................................. 24
6. Effects of Pressing the Power Switch................................................... 28
7. Power States and Targeted System Power ........................................... 29
8. Wake-up Devices and Events ............................................................. 30
9. System Memory Map......................................................................... 37
10. Component-side Connectors and Headers Shown in Figure 9.................. 40
11. Serial Port Header ............................................................................ 41
12. Front Panel Audio Header for Intel HD Audio........................................ 41
13. Front Panel Audio Header for AC ’97 Audio........................................... 41
14. Front Panel USB Header .................................................................... 41
15. SATA Connectors.............................................................................. 42
16. Fan Headers .................................................................................... 42
17. Processor Core Power Connector ........................................................ 43
18. Main Power Connector....................................................................... 43
19. Front Panel Header ........................................................................... 44
20. States for a One-Color Power LED....................................................... 45
21. BIOS Setup Configuration Jumper Settings .......................................... 47
22. Recommended Power Supply Current Values........................................ 49
23. Fan Header Current Capability............................................................ 50
24. Thermal Considerations for Components.............................................. 52
25. Environmental Specifications.............................................................. 53
26. BIOS Setup Program Menu Bar........................................................... 56
27. BIOS Setup Program Function Keys .................................................... 56
28. Acceptable Drives/Media Types for BIOS Recovery................................ 59
29. Boot Device Menu Options ................................................................. 60

Intel Desktop Board DH61BF Technical Product Specification
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30. BIOS Beep Codes ............................................................................. 61
31. Front-panel Power LED Blink Codes..................................................... 61
32. BIOS Error Messages ........................................................................ 62
33. Port 80h POST Code Ranges .............................................................. 62
34. Port 80h POST Codes........................................................................ 63
35. Typical Port 80h POST Sequence ........................................................ 67
36. Safety Standards.............................................................................. 69
37. EMC Regulations............................................................................... 73
38. Regulatory Compliance Marks ............................................................ 77

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1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
MicroATX (8.85 inches by 7.45 inches [225 millimeters by 190 millimeters])
Processor
•3rd generation Intel®Core processor family and 2nd generation Intel®Core
processor family processors with up to 95 W TDP in an LGA1155 socket
―PCI Express* 3.0 x16 graphics interface
―Integrated graphics processing (processors with Intel®Graphics
Technology)
―External graphics interface controller
―Integrated memory controller with dual channel DDR3 memory support
Chipset
Intel®H61 Express Chipset consisting of the Intel®H61 Platform Controller
Hub (PCH)
Memory
•Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
•Support for non-ECC memory
Graphics
•Integrated graphics support for processors with Intel®Graphics Technology
―VGA
―DVI-D
•Support for PCI Express 3.0 x16 add-in graphics cards
Note: PCI Express 3.0 is only supported by 3rd generation Intel Core
processor family processors
Audio
•Intel®High Definition Audio:
―Realtek* ALC662VC audio codec
―Front panel audio header for Intel HD Audio and AC ’97 Audio support
continued

Intel Desktop Board DH61BF Technical Product Specification
12
Table 1. Feature Summary (continued)
Peripheral
Interfaces
•Eight USB ports:
―Four USB 2.0 ports are implemented with stacked back panel connectors
―Four USB 2.0 front panel ports are implemented through two dual-port
internal headers
•Four SATA interfaces through the Intel H61 Express Chipset
•One serial port header
•PS/2* keyboard/mouse ports on back panel
Legacy I/O Control
•ITE* 8728F Super I/O controller for hardware management and serial port and
PS/2 support
BIOS
•Intel®BIOS resident in the SPI Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
•Support for PCI Express
•Suspend to RAM support
•Wake on PCI Express, LAN, front panel, serial, PS/2, and USB ports
LAN Support Gigabit (10/100/1000 Mb/s) LAN subsystem using the Realtek* RTL8111E Gigabit
Ethernet Controller
Expansion
Capabilities
•One PCI Express 3.0 x16 add-in card connector
•Two PCI Express 2.0 x1 add-in card connectors
Note: PCI Express 3.0 is only supported by 3rd generation Intel Core processor
family processors
Hardware Monitor
Subsystem
•Hardware monitoring through the ITE Super I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Two fan headers
•Two fan sense inputs used to monitor fan activity
•Fan speed control

Product Description
13
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DH61BF.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.

Intel Desktop Board DH61BF Technical Product Specification
14
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A PCI Express 2.0 x1 bus add-in card connector
B PCI Express 2.0 x1 bus add-in card connector
C PCI Express 3.0 x16 bus add-in card connector
D Rear chassis fan header
E Back panel connectors
F 12 V processor core voltage connector (2 X 2)
G LGA1155 processor socket
H Processor fan header
I DIMM 1 (Channel A DIMM 1)
J DIMM 2 (Channel B DIMM 1)
K Main power connector (2 x 12)
L Battery
M BIOS setup configuration jumper block
N SATA connectors
O Front panel header
P Front panel USB 2.0 header
Q Intel H61 Express Chipset
R Front panel USB 2.0 header
S Serial port header
T Front panel audio header

Product Description
15
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram

Intel Desktop Board DH61BF Technical Product Specification
16
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH61BF http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DH61BF http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.3 Processor
The board is designed to support 3rd generation Intel Core processor family and 2nd
generation Intel Core processor family processors.
Other processors may be supported in the future. This board is designed to support
processors with a maximum TDP of 95 W. See the Intel web site listed below for the
most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 49 for information on power supply requirements for this board.

Product Description
17
1.4 Intel® H61 Express Chipset
The Intel H61 Express Chipset consisting of the Intel H61 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, audio, network,
display, and PCI Express. The PCH is a centralized controller for the board’s I/O paths.
For information about
Refer to
The Intel H61 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5 System Memory
The board has two DIMM sockets and supports the following memory features:
•Two independent memory channels with interleaved mode support
•Supports 1.5 V DIMM memory voltage
•Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8
organization
•16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 35 for information on the total amount of addressable
memory.
•Minimum total system memory: 1 GB using 1 Gb x8 module
•Serial Presence Detect
•DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.

Intel Desktop Board DH61BF Technical Product Specification
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Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
Configuration (Note) SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
512 MB SS 1 Gb 64 M x16/empty 4
1024 MB SS 1 Gb 128 M x8/empty 8
1024 MB SS 2 Gb 128 M x16/empty 4
2048 MB DS 1 Gb 128 M x8/128 M x8 16
2048 MB SS 2 Gb 128 M x16/empty 8
4096 MB DS 2 Gb 256 M x8/256 M x8 16
4096 MB SS 4 Gb 512 M x8/empty 8
8192 MB
DS
4 Gb
512 M x8/512 M x8
16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.5.1 Memory Configurations
The 3rd generation Intel Core processor family and 2nd generation Intel Core processor
family processors support the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about…
Refer to:
Memory Configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm

Product Description
19
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
1.6 Graphics Subsystem
The board supports system graphics through either Intel Graphics Technology or a
PCI Express 3.0 x16 add-in graphics card.
1.6.1 Integrated Graphics
The board supports integrated graphics through the Intel®Flexible Display Interface
(Intel®FDI) for processors with Intel Graphics Technology.
1.6.1.1 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a
monitor is attached, regardless of the DVI-D connector status.
1.6.1.2 Digital Visual Interface (DVI-D)
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 1920 x 1200 at 60 Hz refresh. The DVI-D port is compliant with the DVI 1.0
specification.

Intel Desktop Board DH61BF Technical Product Specification
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1.7 USB
The board supports up to eight USB 2.0 ports. The port arrangement is as follows:
•Four USB 2.0 ports are implemented with stacked back panel connectors
•Four USB 2.0 front panel ports are implemented through two dual-port internal
headers
All eight USB ports are high-speed, full-speed, and low-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 8, page 38
The location of the front panel USB header Figure 9, page 39
1.8 SATA Interfaces
The board provides four 3.0 Gb/s SATA connectors, which support one device per
connector.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard bus
resource steering is used. Native mode is the preferred mode for configurations using
the Windows* XP, Windows Vista*, and Windows 7 operating systems.
For more information, see: http://www.serialata.org/.
For information about
Refer to
The location of the SATA connectors Figure 9, page 39
1.9 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
•One serial port header
•PS/2-style keyboard/mouse interfaces on the back panel
•Serial IRQ interface compatible with serialized IRQ support for PCI bus systems
•Intelligent power management, including a programmable wake-up event interface
•PCI bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.