Intel BLKD945GCCR User manual

J
anuary 2007
Order Number: D80699-001US
The Intel®Desktop Board D945GCCR may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D945GCCR Specification Update.
Intel® Desktop Board
D945GCCR
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board D945GCCR Technical Product
Specification.
January 2007
This product specification applies to only the standard Intel Desktop Board D945GCCR with BIOS
identifier CR94510J.86A.
Changes to this specification will be published in the Intel Desktop Board D945GCCR
Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT
INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel®desktop boards may contain design defects or errors known as errata, which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, the Intel logo, Pentium, Intel Core 2 Duo, and Celeron are registered trademarks of Intel Corporation
or its subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2007, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board D945GCCR. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
D945GCCR and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D945GCCR
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
 NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board D945GCCR Technical Product Specification
iv
WARNING
Warnings indicate conditions which, if not observed, can cause personal injury.
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#).
(NxnX) When used in the description of a component, N indicates component type, xn are the
relative coordinates of its location on the Desktop Board D945GCCR, and X is the instance of
the particular part at that general location. For example, J5J1 is a connector, located at 5J.
It is the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbits/sec Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.4.1 Memory Configurations ......................................................... 18
1.5 Intel®945GC Chipset....................................................................... 21
1.5.1 Intel 945GC Graphics Subsystem............................................ 21
1.5.2 USB ................................................................................... 23
1.5.3 IDE Support ........................................................................ 24
1.5.4 Real-Time Clock, CMOS SRAM, and Battery .............................. 25
1.6 PCI Express* Connectors.................................................................. 25
1.7 Legacy I/O Controller....................................................................... 26
1.7.1 Serial Port ........................................................................... 26
1.7.2 Parallel Port......................................................................... 26
1.7.3 Diskette Drive Controller ....................................................... 26
1.7.4 Keyboard and Mouse Interface ............................................... 26
1.8 Audio Subsystem............................................................................. 27
1.8.1 Audio Subsystem Software .................................................... 27
1.8.2 Audio Connectors ................................................................. 27
1.8.3 6-Channel (5.1) Audio Subsystem........................................... 28
1.9 LAN Subsystem............................................................................... 29
1.9.1 LAN Subsystem Software....................................................... 29
1.9.2 Intel®82562G Physical Layer Interface Device ......................... 29
1.10 Hardware Management Subsystem .................................................... 31
1.10.1 Hardware Monitoring and Fan Control ASIC .............................. 31
1.10.2 Chassis Intrusion and Detection.............................................. 31
1.10.3 Fan Monitoring..................................................................... 31
1.10.4 Thermal Monitoring .............................................................. 32
1.11 Power Management ......................................................................... 33
1.11.1 ACPI .................................................................................. 33
1.11.2 Hardware Support ................................................................ 35
2Technical Reference
2.1 Memory Resources .......................................................................... 41
2.1.1 Addressable Memory............................................................. 41
2.1.2 Memory Map........................................................................ 43
2.2 DMA Channels................................................................................. 43
2.3 Fixed I/O Map ................................................................................. 44
2.4 PCI Configuration Space Map ............................................................ 45

Intel Desktop Board D945GCCR Technical Product Specification
vi
2.5 Interrupts ...................................................................................... 46
2.6 PCI Conventional Interrupt Routing Map ............................................. 47
2.7 Connectors and Headers................................................................... 48
2.7.1 Back Panel Connectors .......................................................... 49
2.7.2 Component-side Connectors and Headers ................................ 50
2.8 Jumper Block .................................................................................. 58
2.9 Mechanical Considerations ................................................................ 60
2.9.1 Form Factor......................................................................... 60
2.9.2 I/O Shield ........................................................................... 61
2.10 Electrical Considerations................................................................... 62
2.10.1 DC Loading.......................................................................... 62
2.10.2 Add-in Board Considerations .................................................. 62
2.10.3 Fan Header Current Capability................................................ 63
2.10.4 Power Supply Considerations ................................................. 63
2.11 Thermal Considerations.................................................................... 64
2.12 Reliability ....................................................................................... 66
2.13 Environmental ................................................................................ 67
3Overview of BIOS Features
3.1 Introduction ................................................................................... 69
3.2 BIOS Flash Memory Organization....................................................... 70
3.3 Resource Configuration .................................................................... 70
3.3.1 PCI Autoconfiguration ........................................................... 70
3.3.2 PCI IDE Support................................................................... 71
3.4 System Management BIOS (SMBIOS)................................................. 71
3.5 BIOS Updates ................................................................................. 72
3.5.1 Language Support ................................................................ 72
3.5.2 Custom Splash Screen .......................................................... 72
3.6 Legacy USB Support ........................................................................ 73
3.7 Boot Options................................................................................... 73
3.7.1 CD-ROM Boot ...................................................................... 73
3.7.2 Network Boot....................................................................... 73
3.7.3 Booting Without Attached Devices........................................... 74
3.7.4 Changing the Default Boot Device During POST ........................ 74
3.8 Adjusting Boot Speed....................................................................... 75
3.8.1 Peripheral Selection and Configuration..................................... 75
3.8.2 BIOS Boot Optimizations ....................................................... 75
3.9 BIOS Security Features .................................................................... 76
4Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 77
4.2 BIOS Beep Codes ............................................................................ 77
4.3 BIOS Error Messages ....................................................................... 77
4.4 Port 80h POST Codes ....................................................................... 78

Contents
vii
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 83
5.1.1 Safety Regulations................................................................ 83
5.1.2 European Union Declaration of Conformity Statement................ 84
5.1.3 Product Ecology Statements................................................... 85
5.1.4 EMC Regulations .................................................................. 89
5.1.5 Product Certification Markings (Board Level)............................. 90
5.2 Battery Disposal Information............................................................. 91
Figures
1. Board Components .......................................................................... 12
2. Block Diagram ................................................................................ 14
3. Memory Channel and DIMM Configuration ........................................... 18
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 19
5. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 19
6. Single Channel (Asymmetric) Mode Configuration with Two DIMMs ......... 20
7. Front/Back Panel Audio Connector Options .......................................... 28
8. LAN Connector LED Locations............................................................ 30
9. Thermal Sensors and Fan Headers ..................................................... 32
10. Location of the Standby Power Indicator LED....................................... 39
11. Detailed System Memory Address Map ............................................... 42
12. Back Panel Connectors ..................................................................... 49
13. Component-side Connectors and Headers ........................................... 50
14. Connection Diagram for Front Panel Header ........................................ 55
15. Connection Diagram for Front Panel USB Headers ................................ 57
16. Location of the Jumper Block............................................................. 58
17. Board Dimensions ........................................................................... 60
18. I/O Shield Dimensions...................................................................... 61
19. Localized High Temperature Zones..................................................... 65
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. Memory Operating Frequencies ......................................................... 17
5. LAN Connector LED States ................................................................ 30
6. Effects of Pressing the Power Switch .................................................. 33
7. Power States and Targeted System Power........................................... 34
8. Wake-up Devices and Events ............................................................ 35
9. System Memory Map ....................................................................... 43
10. DMA Channels................................................................................. 43
11. I/O Map ......................................................................................... 44
12. PCI Configuration Space Map ............................................................ 45
13. Interrupts ...................................................................................... 46
14. PCI Interrupt Routing Map ................................................................ 47

Intel Desktop Board D945GCCR Technical Product Specification
viii
15. Component-side Connectors and Headers Shown in Figure 13................ 51
16. Front Panel Audio Header ................................................................. 52
17. Chassis Intrusion Header.................................................................. 52
18. Serial ATA Connectors...................................................................... 52
19. Processor Fan Header ...................................................................... 52
20. Front and Rear Chassis Fan Headers .................................................. 52
21. Main Power Connector...................................................................... 53
22. Processor Core Power Connector........................................................ 53
23. Auxiliary Front Panel Power/Sleep LED Header..................................... 54
24. Front Panel Header .......................................................................... 55
25. States for a One-Color Power LED...................................................... 56
26. States for a Two-Color Power LED...................................................... 56
27. BIOS Setup Configuration Jumper Settings.......................................... 59
28. DC Loading Characteristics ............................................................... 62
29. Fan Header Current Capability........................................................... 63
30. Thermal Considerations for Components ............................................. 66
31. Environmental Specifications............................................................. 67
32. BIOS Setup Program Menu Bar.......................................................... 70
33. BIOS Setup Program Function Keys.................................................... 70
34. Boot Device Menu Options ................................................................ 74
35. Supervisor and User Password Functions............................................. 76
36. Beep Codes .................................................................................... 77
37. BIOS Error Messages ....................................................................... 77
38. Port 80h POST Code Ranges.............................................................. 78
39. Port 80h POST Codes ....................................................................... 79
40. Typical Port 80h POST Sequence........................................................ 82
41. Safety Regulations........................................................................... 83
42. Lead-Free Board Markings ................................................................ 88
43. EMC Regulations ............................................................................. 89
44. Product Certification Markings ........................................................... 90

9
1Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.5 Intel®945GC Chipset....................................................................... 21
1.6 PCI Express* Connectors.................................................................. 25
1.7 Legacy I/O Controller....................................................................... 26
1.8 Audio Subsystem............................................................................. 27
1.9 LAN Subsystem............................................................................... 29
1.10 Hardware Management Subsystem .................................................... 31
1.11 Power Management ......................................................................... 33

Intel Desktop Board D945GCCR Technical Product Specification
10
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor microATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Processor Support for the following:
•Intel®Core™2 Duo processor in an LGA775 socket with a 800 MHz system bus
•Intel®Pentium®D processor in an LGA775 socket with an 800 or 533 MHz
system bus
•Intel®Pentium®4 processor in an LGA775 socket with an 800 or 533 MHz
system bus
•Intel®Celeron®D processor in an LGA775 socket with a 533 MHz system bus
Memory •Two 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR2 533 or DDR2 400 MHz DIMMs
•Support for up to 4 GB of system memory
Chipset Intel®945GC Chipset, consisting of:
•Intel®82945GC Graphics Memory Controller Hub (GMCH)
•Intel®82801GB I/O Controller Hub (ICH7)
Video Intel® GMA950 onboard graphics subsystem
Audio 6-channel (5.1) audio subsystem with three analog audio outputs using the
Realtek* ALC883 audio codec
Legacy I/O Control SMSC* 5127 legacy I/O controller for diskette drive, serial, parallel, and PS/2*
ports
USB Support for USB 2.0 devices
Peripheral
Interfaces
•Eight USB ports
•One serial port
•One parallel port
•Four Serial ATA interfaces
•One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
•One diskette drive interface
•PS/2 keyboard and mouse ports
LAN Support 10/100 Mbits/sec LAN subsystem using the Intel®82562G Platform LAN Connect
(PLC) device
BIOS •Intel®BIOS (resident in the SPI Flash device)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Expansion
Capabilities
•Two PCI* Conventional bus connectors
•One PCI Express* x1 bus add-in card connector
•One PCI Express x16 bus add-in card connector
continued

Product Description
11
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
•Support for PCI Local Bus Specification Revision 2.3
•Support for PCI Express Revision 1.0a
•Suspend to RAM support
•Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
Hardware Monitor
Subsystem
•Hardware monitoring and fan control through the SMSC 5127 I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Three fan headers
•Three fan sense inputs used to monitor fan activity
•Fan speed control
For information about Refer to
Available configurations for the board Section 1.2, page 15

Intel Desktop Board D945GCCR Technical Product Specification
12
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Figure 1. Board Components
Table 2 lists the components identified in Figure 1.

Product Description
13
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1
Description
A Front panel audio header
B PCI Conventional bus add-in card connector #2
C PCI Conventional bus add-in card connector #1
D PCI Express x1 bus add-in card connector
E PCI Express x16 bus add-in card connector
F Back panel connectors
G Processor core power connector
H Processor fan header
I Rear chassis fan header
J LGA775 processor socket
K Intel 82945GC GMCH
L DIMM socket
M DIMM socket
N Chassis intrusion header
O Main Power connector
P Diskette drive connector
Q Parallel ATE IDE connector
R Intel 82801GB I/O Controller Hub (ICH7)
S Front chassis fan header
T Serial ATA connectors [4]
U Front panel header
V Speaker
W Front panel USB headers [2]
X BIOS Setup configuration jumper block
Y Battery
Z Auxiliary front panel power LED header

Intel Desktop Board D945GCCR Technical Product Specification
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram

Product Description
15
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel®Desktop Board D945GCCR
under “Desktop Board Products” or
“Desktop Board Support”
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
Available configurations for the
Desktop Board D945GCCR
http://developer.intel.com/design/motherbd/cr/cr_available.htm
Processor data sheets http://www.intel.com/design/litcentr
ICH7 addressing http://developer.intel.com/products/chipsets
Custom splash screens http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
Supported video modes http://www.intel.com/design/motherbd/cr/cr_documentation.htm
1.3 Processor
The board is designed to support the following processors:
•Intel Core 2 Duo processor in an LGA775 socket with a 800 MHz system bus
•Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz
system bus
•Intel Pentium 4 processor in an LGA775 processor socket with an 800 or 533 MHz
system bus
•Intel Celeron D processor in an LGA775 processor socket with a 533 MHz
system bus
See the Intel web site listed below for the most up-to-date list of supported
processors.
For information about… Refer to:
Supported processors http://www.intel.com/design/motherbd/cr/cr_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can
damage the board, the processor, and the power supply.
# INTEGRATOR’S NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.7.2.1, page 53

Intel Desktop Board D945GCCR Technical Product Specification
16
1.4 System Memory
The board has two DIMM sockets and supports the following memory features:
•1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
•2 GB maximum total system memory. Refer to Section 2.1.1 on page 41 for
information on the total amount of addressable memory.
•Minimum total system memory: 128 MB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR2 533 or DDR2 400 MHz SDRAM DIMMs
NOTES
•Remove the PCI Express x16 video card before installing or upgrading memory to
avoid interference with the memory retention mechanism.
•To be fully compliant with all applicable DDR SDRAM memory specifications, the
board should be populated with DIMMs that support the Serial Presence Detect
(SPD) data structure. This allows the BIOS to read the SPD data and program the
chipset to accurately configure memory settings for optimum performance. If non-
SPD memory is installed, the BIOS will attempt to correctly configure the memory
settings, but performance and reliability may be impacted or the DIMMs may not
function under the determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM Capacity Configuration SDRAM Density
SDRAM Organization
Front-side/Back-side
Number of
SDRAM Devices
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM)
and “SS” refers to single-sided memory modules (containing one row of SDRAM).

Product Description
17
 NOTE
Regardless of the DIMM type used, the memory frequency will either be equal to or
less than the processor system bus frequency. For example, if DDR2 400 memory is
used with a 533 MHz system bus frequency processor, the memory will operate at
400 MHz. Table 4 lists the resulting operating memory frequencies based on the
combination of DIMMs and processors.
Table 4. Memory Operating Frequencies
DIMM Type Processor system bus frequency Resulting memory frequency
DDR2 400 533 MHz 400 MHz
DDR2 400 800 MHz 400 MHz
DDR2 533 533 MHz 533 MHz
DDR2 533 800 MHz 533 MHz

Intel Desktop Board D945GCCR Technical Product Specification
18
1.4.1 Memory Configurations
The Intel 82945GC GMCH supports two types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration

Product Description
19
1.4.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the
DIMM sockets are populated with identical DIMMs.
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
1.4.1.2 Single Channel (Asymmetric) Mode Configurations
 NOTE
Dual channel (Interleaved) mode configurations provide the highest memory
throughput.
Figure 5 shows a single channel configuration using one DIMM. In this example, only
the Channel A is populated. Channel B is not populated.
Figure 5. Single Channel (Asymmetric) Mode Configuration with One DIMM

Intel Desktop Board D945GCCR Technical Product Specification
20
Figure 6 shows a single channel configuration using two DIMMs. In this example, the
capacity of the DIMM in Channel A does not equal the capacity of the DIMM in
Channel B.
Figure 6. Single Channel (Asymmetric) Mode Configuration with Two DIMMs