Intel DH61HO Reference guide

Intel®Desktop Board
DH61HO
Classic Series MicroATX Form Factor
PRODUCT BRIEF
Classic Series

2
Supports the 2nd and 3rd-generation Intel®
core™ processors in the LGA1155 package
The Intel® Desktop Board DH61HO is based on
the Intel® H61 Express Chipset and supports
2nd and 3rd generation Intel® Core™ processors,
including the Intel® Core™ i7 and Intel® Core™
i5 processors and other Intel® processors in
the LGA1155 package at a maximum 65W TDP.
The 2nd Generation Intel core processors fea-
ture optimized Intel® Turbo Boost Technology
1
and enhanced Intel® Hyper-threading Technol-
ogy2, which provide smarter performance and
a seamless visual experience.
Intel® Desktop Board DH61HO
The boxed Intel® Desktop Board
DH61HO solution includes:
• ATX 2.2 compliant I/O shield
• SATA cable
• Board and back panel I/O layout
stickers
• Intel® Express Installer driver
and software DVD
Make your PC your favorite spot for work
and entertainment.
• Supports DirectX* 10, which enhances your
gaming experience.
• Great network connectivity with integrated
10/100/1000 Network Connection.
• Gain exibility with the integrated VGA
output
• Expandability support with PCI Express ×16,
and ×1 connectors
• Rich sound quality of Intel® High Denition
Audio2 with 5.1-channel surround sound.
Capability Software included
Utilities • Intel® Core Utilities Bundle
3
• Intel® Desktop Utilities
Productivity • Laplink* PCmover* Express
Antivirus • Eset Smart Security 4 (1 year license)*
Classic Series

7.48” (19cm)
8.86” (22.5cm)
1
4
3
5
5
10
6
6
78
9
9
11
2
6 Six-channelIntel®HighDenitionAudio
6:
Audio subsystem with three analog audio
outputs (5.1 + 2 independent multi-streaming)
7 PCI Express* 3.0 ×16 graphics connector:
Delivers up to 8 GB/s bandwidth when used
with a compatible processor
8 Two PCI Express* ×1 connectors
9 10 Eight USB 2.0 ports: Four back panel
ports and four additional ports via
internal headers
11 MicroATX form factor (8.86¨
× 7.48¨)
3
Intel® Desktop Board DH61HO
Features and Benets
1 Supports the 2nd and 3rd-generation
Intel® Core™ processors, including the
Intel® core™ i7, the Intel® Core™ i5 pro-
cessors and other Intel® processors in
the LGA1155 package at a maximum
65W TDP for exceptional performance
2 Intel® H61 Express Chipset PCH
3 Dual-Channel DDR3 with two connec-
tors for 1333
4/1066/800 MHz
memory support (16 GB
5max)
4 Two SATA ports (3.0 Gb/s): Facilitate
high-speed storage and data transfers
at up to 3.0 Gb/s for each of four two
ports
5 Integrated 10/100/1000 Network
Connection
Classic Series

PROCESSOR
Processor Support
• Intel® Core™ i7 and Intel® Core™ i5 2nd and 3rd generation
processors and other Intel® processors in the LGA1155
package at maximum 65W TDP
• Supports Intel® 64 architecture
7
CHIPSET
Intel® H61 Express Chipset
• Intel® 82H61 Platform Controller Hub (PCH)
PERIPHERAL CONNECTIVITY
• Two SATA (3.0 Gb/s) ports
• Integrated 10/100/1000 Network Connection
• Eight Hi-Speed USB 2.0 ports (four back panel ports
and four additional ports via internal headers)
SYSTEM BIOS
• 32 Mb Flash EEPROM with Intel® Platform Innovation
Framework for EFI Plug and Play
• Advanced conguration and power interface V3.0b,
SMBIOS2.5
• Intel® Express BIOS update support
SYSTEM MEMORY
Memory Capacity
• Two 240-pin DIMM connectors supporting up to two
double-sided DIMMs (16 GB
5 max)
Memory Types
• DDR3 1333
4 /1066/800 SDRAM memory support
• Non-ECC Memory
Memory Modes
• Dual- or single-channel operation support
HARDWARE MANAGEMENT FEATURES
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• ACPI-compliant power management control
EXPANSION CAPABILITIES
• Two PCI Express* ×1 bus add-in card connectors
• One PCI Express 3.0 ×16 graphics connector
HEADERS
• One serial port header
AUDIO
• Six-channel Intel® High Denition Audio6codec
JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
• Single conguration jumper design
• Jumper access for BIOS maintenance mode
Front-Panel Connectors
• Reset, HDD LED, Power LEDs, power on/off
• Front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header
MECHANICAL
Board Style
• MicroATX 2.2-compliant
Board Size
• 8.86” × 7.48” (22.5 cm × 19 cm)
Baseboard Power Requirements
• ATX 12 V
ENVIRONMENT
Operating Temperature
• 0° C to +55° C
Storage Temperature
• -20° C to +70° C
REGULATIONS AND SAFETY STANDARDS
United States and Canada
CSA/UL 60950-1, First Edition (Binational Standard)
Europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1
International
IEC 60950-1
EMC REGULATIONS (tested in representative chassis)
United States
FCC 47 CFR Part 15, Subpart B
Canada
ICES-003 Class B
Europe
(EMC Directive 2004/108/EC)
EN 55022 and EN 55024
Australia / New Zealand
EN 55022 Class B
Japan
VCCI V-3, V-4 Class B
South Korea
KN-22 and KN-24
Taiwan
CNS 13438 Class B
International
CISPR 22 Class B
ENVIRONMENTAL COMPLIANCE
Europe
Europe RoHS (Directive 2002/95/EC)
China
China RoHS (MII Order # 39)
1. Intel® Turbo Boost Technology – maximum single-core turbo frequency (GHz). Intel
turbo Boost Technology requires a PC with a processor with Intel Turbo boost
Technology capability. Intel Turbo Boost Technology performance varies depend-
ing on hardware, software, and overall system conguration. Check with your PC
manufacturer on whether your system delivers Intel Turbo Boost Technology. See
www.intel.com/technology/tuboboost for more information.
2. Intel® Hyper-Threading Technology requires a computer system with a processor
supporting HT Technology and an HT Technology-enabled chipset, BIOS, and op-
erating system. Performance will vary depending on the specic hardware and
software you use. See www.intel.com/info/hyperthreading for more information.
3. The Intel® Core Utilities bundle includes Intel® Integrator Assistant, Intel® Integrator
Toolkit, Intel® Express Installer and Intel® Express Bios Update.
4. WARNING: Altering PC memory frequency, voltage and/or latency may: (i) reduce
system stability and useful life of the system, memory and processor; (ii) cause
the processor and other system components to fail; (iii) cause reductions in system
performance; (iv) cause additional heat or other damage; and (v) affect system
data integrity. Intel has not tested, and does not warranty, the operation of the
memory beyond its specications. Intel assumes no responsibility that the mem ory,
including if used with altered clock frequencies and/or voltages, will be t for any
particular purpose. Check with memory manufacturer for warranty and additional
details.
5. System resources and hardware (such as PCI and PCI Express*) require physical
memory address locations that can reduce available addressable system memory.
This could result in a reduction of as much as 1 GB or more of physical addressable
memory being available to the operating system and applications, depending on
the system conguration and operating system.
6. Intel® High Denition Audio requires a system with an appropriate Intel® chipset
and a motherboard with an appropriate codec and the necessary drivers installed.
System sound quality will vary depending on actual implementation, controller,
codec, drivers, and speakers. For more information about Intel® HD Audio, refer to
www.intel.com/design/chipsets/hdaudio.htm.
7. 64-bit computing on Intel® architecture requires a computer system with a proces-
sor, chipset, BIOS, operating system, device drivers, and applications enabled for
Intel® 64 architecture. Processors will not operate (including 32-bit operation)
without an Intel 64 architecture-enabled BIOS. Performance will vary depending
on your hardware and software congurations. See http://developer.intel.com/
technology/ intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO
ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS
INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT,
OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining
applications. Intel may make changes to specications and product descriptions at
any time, without notice.
All products, dates, and gures specied are preliminary based on current expec-
tations, and are subject to change without notice. Availability in different channels
may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, Pentium, and Celeron are trademarks of Intel
Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
** Supports 95 W Thermal Design Power, Intel® Core™ Processors. For information,
visit http://processormatch.intel.com
Copyright © 2012 Intel Corporation. All rights reserved. 0110/TC/MS/PDF 323292-001US
Intel® Desktop Board DH61HO
Technical Specications
Classic Series