Intel DH77DF User manual
Intel® Desktop Board
DH77DF
Technical Product Specification
April 2012
Part Number: G54939-001
The Intel Desktop Board DH77DF may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DH77DF Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DH77DF Technical Product
Specification
April 2012
This product specification applies to only the standard Intel®Desktop Board with BIOS identifier
KCH7710H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
All Intel®desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, 3rd generation Intel Core processor family, and 2nd generation Intel Core processor family are
trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright ©2012, Intel Corporation. All rights reserved.
iii
Board Identification Information
Basic Desktop Board DH77DF Identification Information
AA Revision BIOS Revision Notes
G40293 KCH7710H.86A.0069 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The H77 processor used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
Intel H77 Express Chipset C1 SLJ88
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
Intel Desktop Board DH77DF Technical Product Specification
iv
v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel®Desktop
Board DH77DF.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DH77DF and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DH77DF
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board DH77DF Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vii
Contents
1Product Description
1.1Overview........................................................................................ 11
1.1.1Feature Summary ................................................................ 11
1.1.2Board Layout (Top) .............................................................. 13
1.1.3Board Layout (Bottom) ......................................................... 15
1.1.4Block Diagram ..................................................................... 16
1.2Online Support................................................................................ 17
1.3Processor ....................................................................................... 17
1.3.1Graphics Subsystem ............................................................. 18
1.4System Memory
.............................................................................. 20
1.4.1Memory Configurations ......................................................... 21
1.5Intel®H77 Express Chipset............................................................... 23
1.5.1Direct Media Interface (DMI).................................................. 23
1.5.2Display Interfaces ................................................................ 23
1.5.3USB ................................................................................... 26
1.5.4SATA Interfaces ................................................................... 27
1.6Real-Time Clock Subsystem .............................................................. 29
1.7Legacy I/O Controller....................................................................... 29
1.7.1Consumer Infrared (CIR)....................................................... 29
1.8Audio Subsystem ............................................................................ 30
1.8.1Audio Subsystem Software .................................................... 30
1.8.2Audio Subsystem Components ............................................... 31
1.9LAN Subsystem............................................................................... 32
1.9.1Intel®82579V Gigabit Ethernet Controller................................ 32
1.9.2LAN Subsystem Software ...................................................... 33
1.9.3RJ-45 LAN Connector with Integrated LEDs .............................. 33
1.10Hardware Management Subsystem .................................................... 34
1.10.1Hardware Monitoring ............................................................ 34
1.10.2Fan Monitoring..................................................................... 34
1.10.3Chassis Intrusion and Detection ............................................. 34
1.10.4Thermal Monitoring .............................................................. 35
1.11Power Management ......................................................................... 36
1.11.1ACPI................................................................................... 36
1.11.2Hardware Support ................................................................ 38
2Technical Reference
2.1Memory Resources .......................................................................... 43
2.1.1Addressable Memory............................................................. 43
2.1.2Memory Map........................................................................ 45
2.2Connectors and Headers................................................................... 45
2.2.1Back Panel Connectors.......................................................... 46
2.2.2Component-side Connectors and Headers (Top)........................ 47
2.2.3Component-side Connectors and Headers (Bottom)................... 49
Intel Desktop Board DH77DF Technical Product Specification
viii
2.3Jumper Block.................................................................................. 59
2.4Mechanical Considerations
................................................................ 61
2.4.1Form Factor......................................................................... 61
2.5Electrical Considerations................................................................... 62
2.5.1Power Supply Considerations ................................................. 62
2.5.2Power Supervisor ................................................................. 63
2.5.3Fan Header Current Capability................................................ 63
2.5.4Add-in Board Considerations
.................................................. 63
2.6Thermal Considerations
.................................................................... 64
2.7Reliability ....................................................................................... 67
2.8Environmental ................................................................................ 67
3Overview of BIOS Features
3.1Introduction ................................................................................... 69
3.2BIOS Flash Memory Organization....................................................... 70
3.3Resource Configuration .................................................................... 70
3.3.1PCI Express Autoconfiguration................................................ 70
3.4System Management BIOS (SMBIOS)................................................. 71
3.5Legacy USB Support ........................................................................ 71
3.6BIOS Updates ................................................................................. 72
3.6.1Language Support
................................................................ 72
3.6.2Custom Splash Screen .......................................................... 73
3.7BIOS Recovery................................................................................ 73
3.8Boot Options................................................................................... 74
3.8.1Optical Drive Boot ................................................................ 74
3.8.2Network Boot....................................................................... 74
3.8.3Booting Without Attached Devices .......................................... 74
3.8.4Changing the Default Boot Device During POST ........................ 74
3.9Adjusting Boot Speed....................................................................... 75
3.9.1Peripheral Selection and Configuration .................................... 75
3.9.2BIOS Boot Optimizations ....................................................... 75
3.10BIOS Security Features .................................................................... 76
3.11BIOS Performance Features .............................................................. 77
4Error Messages and Beep Codes
4.1Speaker ......................................................................................... 79
4.2BIOS Beep Codes ............................................................................ 79
4.3Front-panel Power LED Blink Codes.................................................... 80
4.4BIOS Error Messages ....................................................................... 80
4.5Port 80h POST Codes ....................................................................... 81
5Regulatory Compliance and Battery Disposal Information
5.1Regulatory Compliance..................................................................... 87
5.1.1Safety Standards ................................................................. 87
5.1.2European Union Declaration of Conformity Statement................ 88
5.1.3Product Ecology Statements .................................................. 89
5.1.4China RoHS
......................................................................... 92
Contents
ix
5.1.5EMC Regulations .................................................................. 93
5.1.6ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 95
5.1.7Regulatory Compliance Marks (Board Level)............................. 96
5.2Battery Disposal Information............................................................. 97
Figures
1. Major Board Components ................................................................. 13
2. Major Board Components (Bottom) .................................................... 15
3. Block Diagram ................................................................................ 16
4. Memory Channel and DIMM Configuration........................................... 22
5. Back Panel Audio Connectors ............................................................ 31
6. LAN Connector LED Locations............................................................ 33
7. Thermal Sensors and Fan Headers ..................................................... 35
8. Location of the Standby Power LED .................................................... 42
9. Detailed System Memory Address Map ............................................... 44
10. Back Panel Connectors ..................................................................... 46
11. Component-side Connectors and Headers ........................................... 47
12. Major Board Components (Bottom) .................................................... 49
13. Connection Diagram for Front Panel Header ........................................ 56
14. Connection Diagram for Front Panel USB 2.0 Headers........................... 58
15. Location of the Jumper Block ............................................................ 59
16. Board Dimensions ........................................................................... 61
17. Localized High Temperature Zones..................................................... 65
18. Intel Desktop Board DH77DF China RoHS Material Self
Declaration Table ............................................................................ 92
Tables
1. Feature Summary............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Components Shown in Figure 2 ......................................................... 15
4. Supported Memory Configurations ..................................................... 20
5. DVI Port Status Conditions................................................................ 24
6. HDMI Port Status Conditions ............................................................. 24
7. DisplayPort Status Conditions............................................................ 25
8. Audio Formats Supported by the HDMI and DisplayPort Interfaces.......... 25
9. Audio Jack Support.......................................................................... 30
10. LAN Connector LED States ................................................................ 33
11. Effects of Pressing the Power Switch .................................................. 36
12. Power States and Targeted System Power .......................................... 37
13. Wake-up Devices and Events ............................................................ 38
14. System Memory Map ....................................................................... 45
15. Component-side Connectors and Headers Shown in Figure 11................ 48
16. Components Shown in Figure 2 ......................................................... 49
17. Front Panel Audio Header for Intel HD Audio ....................................... 50
18. Front Panel Audio Header for AC ’97 Audio
.......................................... 50
Intel Desktop Board DH77DF Technical Product Specification
x
19. Front Panel USB 2.0 Headers ............................................................ 50
20. Front Panel USB 3.0 Connector.......................................................... 51
21. SATA Connectors............................................................................. 51
22. S/PDIF Header ................................................................................ 51
23. Chassis Intrusion Header.................................................................. 52
24. Processor and System (4-Pin) Fan Headers ........................................ 52
25. Back Panel CIR Emitter (Output) Header............................................. 52
26. Front Panel CIR Receiver (Input) Header ............................................ 52
27. PCI Express Full-/Half-Mini Card Connector ......................................... 53
28. LPC Debug Connector ...................................................................... 54
29. HTPC Header .................................................................................. 54
30. Processor Core Power Connector........................................................ 55
31. Main Power Connector...................................................................... 55
32. Front Panel Header .......................................................................... 56
33. States for a One-Color Power LED...................................................... 57
34. States for a Two-Color Power LED...................................................... 57
35. Alternate Front Panel Power/Sleep LED Header
.................................... 57
36. BIOS Setup Configuration Jumper Settings.......................................... 60
37. Recommended Power Supply Current Values (High Power) .................... 62
38. Recommended Power Supply Current Values (Low Power)..................... 62
39. Fan Header Current Capability........................................................... 63
40. Thermal Considerations for Components............................................. 66
41. Tcontrol Values for Components ........................................................ 66
42. Environmental Specifications............................................................. 67
43. BIOS Setup Program Menu Bar.......................................................... 70
44. BIOS Setup Program Function Keys ................................................... 70
45. Acceptable Drives/Media Types for BIOS Recovery ............................... 73
46. Boot Device Menu Options ................................................................ 74
47. Supervisor and User Password Functions ............................................ 76
48. BIOS Beep Codes ............................................................................ 79
49. Front-panel Power LED Blink Codes
.................................................... 80
50. BIOS Error Messages ....................................................................... 80
51. Port 80h POST Code Ranges ............................................................. 81
52. Port 80h POST Codes ....................................................................... 82
53. Typical Port 80h POST Sequence ....................................................... 86
54. Safety Standards............................................................................. 87
55. EMC Regulations ............................................................................. 93
56. Regulatory Compliance Marks ........................................................... 96
11
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor Mini ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor •3rd generation Intel®Core processor family and 2nd generation Intel®Core
processor family processors with up to 95 W TDP in an LGA1155 socket
―One PCI Express* x16 graphics interface
―Integrated memory controller with dual channel DDR3 memory support
―Integrated graphics processing (processors with Intel®HD Graphics)
―External graphics interface controller
Memory •Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
•Support for non-ECC memory
•Support for 1.5 V (standard voltage) and 1.35 V (low voltage) JEDEC memory
•Support for XMP memory
Note: DDR3 1600 MHz DIMMs are only supported by 3rd generation Intel Core
processor family processors
Chipset Intel®H77 Express Chipset consisting of the Intel®H77 Express Platform
Controller Hub (PCH)
Graphics •Integrated graphics support for processors with Intel HD Graphics:
―High Definition Multimedia Interface* (HDMI*) v1.4a
―DVI-I v1.0
―DisplayPort* v1.1a
•Support for a PCI Express* 3.0 x16 add-in graphics card
Note: PCI Express 3.0 is only supported by 3rd generation Intel Core
processor family processors
Audio •8-channel (7.1 + 2) Intel®High Definition (Intel®HD) Audio via the Realtek*
ALC898 audio codec including:
―Front panel audio header with support for Intel HD Audio and AC ’97 Audio
―Five analog audio jacks on the back panel
―Onboard S/PDIF out header and back panel optical S/PDIF out connector
•8-channel (7.1) Intel HD Audio via the High Definition Multimedia Interface*
(HDMI*)
continued
Intel Desktop Board DH77DF Technical Product Specification
12
Table 1. Feature Summary (continued)
Peripheral
Interfaces
•Four USB 3.0 ports:
―Two USB 3.0 ports are implemented with stacked back panel connectors
(blue)
―Two front panel USB 3.0 ports are implemented through one internal
connector (blue)
•Ten USB 2.0 ports:
―Four ports are implemented with stacked back panel connectors (two black
and two orange high current charging ports)
―Two front panel high current charging ports are implemented through one
internal header (orange)
―Two front panel ports are implemented through one internal header (black)
―Two ports are implemented in the PCI Express Full-/Half–Mini Card slot
•Six Serial ATA (SATA) ports:
―Two SATA 6.0 Gb/s interfaces through the Intel H77 Express Chipset with
Intel®Rapid Storage Technology RAID support (blue)
―Two internal SATA 3.0 Gb/s interfaces through the Intel H77 Express
Chipset with Intel Rapid Storage Technology RAID support (black)
―One internal mSATA port (PCI Express Full-/Half-Mini Card slot)
―One back panel eSATA port (red)
Expansion
Capabilities
•One PCI Express 3.0 x16 add-in card connector
•One PCI Express Full-/Half-Mini Card slot with support for mSATA
Note: PCI Express 3.0 is only supported by 3rd generation Intel Core
processor family processors
BIOS •Intel®BIOS resident in the SPI Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
•Support for PCI Express* Revision 3.0
•Suspend to RAM support
•Wake on PCI Express, LAN, front panel, Consumer Infrared (CIR), and USB
ports
LAN Support Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel®82579V Gigabit
Ethernet Controller
Legacy I/O Control Nuvoton NCT67760 I/O controller for CIR and hardware management support
Hardware Monitor
Subsystem
•Hardware monitoring through the Nuvoton I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Two fan headers
•Two fan sense inputs used to monitor fan activity
•Fan speed control
Product Description
13
1.1.2 Board Layout (Top)
Figure 1 shows the location of the major components on the top-side of the Intel
Desktop Board DH77DF.
Figure 1. Major Board Components
Intel Desktop Board DH77DF Technical Product Specification
14
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1
Description
A Back panel connectors
B Battery
C Intel H77 Express Chipset
D BIOS configuration jumper block
E IEEE 1394a front panel header (blue)
F SATA 3.0 Gb/s connectors (black)
G SATA 6.0 Gb/s connectors (blue)
H Front panel header
I Front panel USB 2.0 header
J Front panel USB 3.0 connector (blue)
K Alternate front panel power LED header
L Standby power LED
M Main power connector (2 x 12)
N Front panel USB 2.0 high current charging header (orange)
O PCI Express Full-/Half-Mini Card slot
P Piezoelectric speaker
Q LGA1155 processor socket
R DIMM 2 (Channel B DIMM 1)
S DIMM 1 (Channel A DIMM 1)
T Processor fan header
U Consumer IR transmitter (output) header (white)
V Home Theater PC (HTPC) header (white)
W Consumer IR receiver (input) header (white)
X S/PDIF out header (yellow)
Y PCI Express x16 bus add-in card connector
Z 12 V processor core voltage connector (2 x 2)
AA Chassis intrusion header
BB System fan header
CC Front panel audio header (yellow)
Product Description
15
1.1.3 Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of the board.
Figure 2. Major Board Components (Bottom)
Table 3. Components Shown in Figure 2
Item/callout from
Figure 2
Description
A Low Pin Count (LPC) Debug connector
Intel Desktop Board DH77DF Technical Product Specification
16
1.1.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
Figure 3. Block Diagram
Product Description
17
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH77DF http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DH77DF
http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.3 Processor
The board supports 3rd generation Intel Core processor family and 2nd generation Intel
Core processor family processors.
Other processors may be supported in the future. This board supports processors with
a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed
below are only supported when falling within the wattage requirements of Intel
Desktop Board DH77DF. See the Intel web site listed below for the most up-to-date
list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 62 for information on power supply requirements for this board.
NOTE
Use of a 95 W TDP processor requires a custom thermal solution. Pairing a mini-ITX
chassis and a 95 W TDP processor with the supplied standard Intel thermal solution
may not meet thermal requirements. Verify that your thermal solution and chassis will
meet the necessary thermal requirements. Failing to do so will cause the processor to
throttle, significantly decreasing system performance.
Intel Desktop Board DH77DF Technical Product Specification
18
1.3.1 Graphics Subsystem
The board supports graphics through either the processor Intel HD Graphics or a PCI
Express x16 add-in graphics card.
1.3.1.1 Processor Graphics
The board supports integrated graphics through the Intel®Flexible Display Interface
(Intel®FDI) for processors with Intel HD Graphics.
NOTE
If using a processor with integrated graphics, the board will support only two of the
integrated graphics interfaces simultaneously: DisplayPort, DVI-I, HDMI. Also, during
the Power On Self Test (POST), the board will not output to the DisplayPort if DVI-I or
HDMI is used concurrently with DisplayPort.
1.3.1.1.1 Intel®High Definition (Intel®HD) Graphics
The Intel HD graphics controller features the following:
•3D Features
⎯DirectX* 11 (2nd generation Intel Core processor family processors support
CS4.0 only) support
⎯OpenGL* 3.0 support
⎯Shader Model 4.0
•Video
⎯High-Definition content at up to 1080p resolution
⎯Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
⎯Intel®HD Graphics with Advanced Hardware Video Transcoding (Intel®Quick
Sync Video)
Note: Intel Quick Sync is enabled with the appropriate software application
⎯Blu-ray* S3D via HDMI 1.4a
⎯Dynamic Video Memory Technology (DVMT) 5.0 support
⎯Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
Product Description
19
1.3.1.2 PCI Express x16 Graphics
3rd generation Intel Core processor family processors support PCI Express 3.0, 2.x,
and 1.x and 2nd generation Intel Core processor family processors support PCI
Express 2.x and 1.x:
•PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
1 GB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a total bandwidth of
32 GB/s.
•PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
500 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direction, simultaneously, for a total bandwidth of
16 GB/s.
•PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
250 MB/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direction, simultaneously, for a total bandwidth of
8 GB/s.
For information about Refer to
PCI Express technology http://www.pcisig.com
Intel Desktop Board DH77DF Technical Product Specification
20
1.4 System Memory
The board has two DIMM sockets and supports the following memory features:
•1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
•1.35 V Low Voltage DDR3 DIMMs (JEDEC specification)
•Two independent memory channels with interleaved mode support
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
•16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 43 for information on the total amount of addressable
memory.
•Minimum recommended total system memory: 1 GB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
Note: DDR3 1600 MHz DIMMs are only supported by 3rd generation Intel Core
processor family processors
•XMP version 1.3 performance profile support for memory speeds up to 1600 MHz
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Error! Reference source not found. lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
Configuration (Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
1024 MB SS 1 Gbit 128 M x8/empty 8
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 256 M x8/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
/CS-025414.htm
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