Intel Desktop Board D2700MUD User manual

Intel® Desktop Board
D2700MUD
Technical Product Specification
June 2012
Part Number: G34953-002
The Intel®Desktop Board D2700MUD may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board D2700MUD Specification Update.

ii
Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board D2700MUD Technical Product
Specification. December 2011
-002 Specification Clarification June 2012
This product specification applies to only the standard Intel®Desktop Board D2700MUD with
BIOS identifier MUCDT10N.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel®Desktop Boards may contain design defects or errors known as errata, which may cause the product
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, the Intel logo, and Intel Atom are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2011, 2012, Intel Corporation. All rights reserved.

iii
Board Identification Information
Basic Desktop Board D2700MUD Identification Information
AA Revision BIOS Revision Notes
G32419-502 MUCDT10N.86A.0047 1,2
G32419-503 MUCDT10N.86A.0067 1,2
G32419-504 MUCDT10N.86A.0067 1,2
G32419-600 MUCDT10N.86A.0067 1,2
G32419-601 MUCDT10N.86A.0067 1,2
G32419-602 MUCDT10N.86A.0069 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Intel®NM10 Express Chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
CG82NM10 B0 SLGXX
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel®Desktop Board D2700MUD.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
June 2012 Spec Clarification Added a Note to section 1.4 System Memory on page 18.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.

Intel Desktop Board D2700MUD Technical Product Specification
iv

v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board D2700MUD. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D2700MUD and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter
Description
1
A description of the hardware used on the board
2
A map of the resources of the board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board D2700MUD Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
TDP Thermal Design Power
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vii
Contents
1Product Description
1.1 Overview......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Online Support................................................................................. 16
1.3 Processor ........................................................................................ 16
1.3.1 Intel®D2700 Graphics Subsystem........................................... 17
1.4 System Memory ............................................................................... 18
1.5 Intel®NM10 Express Chipset.............................................................. 20
1.5.2 USB..................................................................................... 22
1.5.3 SATA Support....................................................................... 22
1.6 Real-Time Clock Subsystem............................................................... 23
1.7 Legacy I/O Controller........................................................................ 23
1.8 LAN Subsystem................................................................................ 24
1.8.1 LAN Subsystem Drivers.......................................................... 24
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.9 Audio Subsystem.............................................................................. 26
1.9.1 Audio Subsystem Software..................................................... 27
1.9.2 Audio Connectors and Headers................................................ 27
1.10 Hardware Management Subsystem..................................................... 28
1.10.1 Hardware Monitoring ............................................................. 28
1.10.2 Thermal Monitoring ............................................................... 29
1.11 Power Management .......................................................................... 30
1.11.1 ACPI.................................................................................... 30
1.11.2 Hardware Support ................................................................. 33
2Technical Reference
2.1 Memory Map.................................................................................... 37
2.1.1 Addressable Memory ............................................................. 37
2.2 Connectors and Headers.................................................................... 40
2.2.1 Back Panel ........................................................................... 41
2.2.2 Component-side Connectors and Headers................................. 43
2.3 BIOS Configuration Jumper Block ....................................................... 55
2.4 Mechanical Considerations ................................................................. 57
2.4.1 Form Factor.......................................................................... 57
2.5 Electrical Considerations.................................................................... 58
2.5.1 Fan Header Current Capability ................................................ 58
2.5.2 Add-in Board Considerations................................................... 58
2.6 Thermal Considerations..................................................................... 58
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 60

Intel Desktop Board D2700MUD Technical Product Specification
viii
2.7 Power Consumption .......................................................................... 63
2.7.1 Minimum Load Configuration................................................... 63
2.7.2 Maximum Load Configuration.................................................. 63
2.8 Reliability......................................................................................... 64
2.9 Environmental.................................................................................. 64
3Overview of BIOS Features
3.1 Introduction..................................................................................... 65
3.2 BIOS Flash Memory Organization........................................................ 66
3.3 Resource Configuration ..................................................................... 66
3.3.1 PCI* Autoconfiguration .......................................................... 66
3.4 System Management BIOS (SMBIOS) ................................................. 67
3.5 Legacy USB Support ......................................................................... 68
3.6 BIOS Updates .................................................................................. 69
3.6.1 BIOS Recovery...................................................................... 69
3.6.2 Custom Splash Screen ........................................................... 70
3.7 Boot Options.................................................................................... 70
3.7.1 Optical Drive Boot ................................................................. 70
3.7.2 Network Boot........................................................................ 70
3.7.3 Booting Without Attached Devices ........................................... 71
3.7.4 Changing the Default Boot Device During POST......................... 71
3.8 Adjusting Boot Speed........................................................................ 71
3.8.1 Peripheral Selection and Configuration ..................................... 71
3.8.2 BIOS Boot Optimizations........................................................ 72
3.9 BIOS Security Features ..................................................................... 73
4Board Status and Error Messages
4.1 BIOS Beep Codes ............................................................................. 75
4.2 Front-panel Power LED Blink Codes..................................................... 76
4.3 BIOS Error Messages ........................................................................ 76
4.4 Port 80h POST Codes ........................................................................ 77
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance...................................................................... 83
5.1.1 Safety Standards................................................................... 83
5.1.2 European Union Declaration of Conformity Statement ................ 84
5.1.3 Product Ecology Statements ................................................... 85
5.1.4 EMC Regulations ................................................................... 87
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 90
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 91
5.2 Battery Disposal Information.............................................................. 92

Contents
ix
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram.................................................................................. 15
3. Memory Channel and SO-DIMM Configuration ...................................... 19
4. LAN Connector LED Locations............................................................. 25
5. Back Panel Audio Connectors ............................................................. 27
6. Thermal Sensors and Fan Header ....................................................... 29
7. Location of the Standby Power Indicator LED ....................................... 35
8. Detailed System Memory Address Map................................................ 38
9. Back Panel Connectors ...................................................................... 41
10. I/O Shield Reference Diagram............................................................ 42
11. Component-side Connectors and Headers............................................ 43
12. Connection Diagram for Front Panel Header......................................... 52
13. Connection Diagram for Front Panel USB Header .................................. 54
14. Connection Diagram for Front Panel USB Header with Intel Z-USB
Solid-State Drive or Compatible Device Support ................................... 54
15. Location of the BIOS Configuration Jumper Block.................................. 55
16. Board Dimensions............................................................................. 57
17. Localized High Temperature Zones ..................................................... 59
18. Fan Location Guide for Chassis Selection (Chassis Orientation is Not
Restricted)....................................................................................... 62
Tables
1. Feature Summary............................................................................. 11
2. Board Components Shown in Figure 1................................................. 14
3. Supported Memory Configurations...................................................... 18
4. LAN Connector LED States................................................................. 25
5. Audio Jack Support........................................................................... 26
6. Effects of Pressing the Power Switch ................................................... 30
7. Power States and Targeted System Power ........................................... 31
8. Wake-up Devices and Events ............................................................. 32
9. System Memory Map ........................................................................ 39
10. Component-side Connectors and Headers Shown in Figure 11................ 44
11. TPM Header ..................................................................................... 45
12. Serial Port Headers........................................................................... 45
13. LVDS Data Connector........................................................................ 46
14. LVDS Panel Voltage Selection Jumper.................................................. 47
15. FPD Brightness Connector.................................................................. 47
16. LVDS Inverter Power Voltage Selection Jumper .................................... 47
17. System Fan Header .......................................................................... 48
18. SATA Connectors.............................................................................. 48
19. Front Panel Wireless Activity LED Header............................................. 48
20. Front Panel Audio Header for Intel HD Audio........................................ 48
21. Front Panel Audio Header for AC ’97 Audio........................................... 48

Intel Desktop Board D2700MUD Technical Product Specification
x
22. Front Panel USB Header .................................................................... 49
23. Front Panel USB Header with Intel Z-U130 USB Solid-State Drive or
Compatible Device Support................................................................ 49
24. Power Connector .............................................................................. 51
25. Front Panel Header ........................................................................... 52
26. States for a One-Color Power LED....................................................... 53
27. BIOS Configuration Jumper Settings ................................................... 56
28. Fan Header Current Capability............................................................ 58
29. Thermal Considerations for Components.............................................. 60
30. Minimum Load Configuration Current and Power Results........................ 63
31. Maximum Load Configuration Current and Power Results....................... 64
32. Intel Desktop Board D2700MUD Environmental Specifications ................ 64
33. BIOS Setup Program Menu Bar........................................................... 66
34. BIOS Setup Program Function Keys .................................................... 66
35. AcceptableDrives/Media Types for BIOS Recovery................................. 69
36. Boot Device Menu Options................................................................. 71
37. Supervisor and User Password Functions ............................................. 73
38. BIOS Beep Codes ............................................................................. 75
39. Front-panel Power LED Blink Codes..................................................... 76
40. BIOS Error Messages ........................................................................ 76
41. Port 80h POST Code Ranges .............................................................. 77
42. Port 80h POST Codes ........................................................................ 78
43. Typical Port 80h POST Sequence ........................................................ 81
44. Safety Standards.............................................................................. 83
45. EMC Regulations............................................................................... 87
46. ENERGY STAR Requirements.............................................................. 90
47. Regulatory Compliance Marks ............................................................ 91