
Europe
 Nemko certified to EN 60950 International 
 Nemko certified to IEC 60950 
 (CB report with CB certificate)
EMC regulations (tested in representative chassis)
United States
 FCC Part 15, Class B 
 FCC Part 15, Class B open-chassis (cover off) testing
Canada
 ICES-003, Class B
Europe
 EMC directive 89/336/EEC; EN 55022:1998 
 Class B; EN 55024:1998
Australia/New Zealand
 AS/NZS 3548, Class B
Taiwan
 CNS 13438, Class B International 
 CISPR 22:1997, Class B
Power requirements vary. Complies with US CRF via 
EN55022 +6 db in system configurations with an 
open chassis and EU Directive 89/336/EEC and use via 
EN55022 and EN50082-1 in a representative chassis.
Lead-Free: The symbol is used to identify 
electrical and electronic assemblies and com-
ponents in which the lead (Pb) concentration 
level in any of the raw materials and the end product 
 is not greater than 0.1% by weight (1000 ppm). This 
symbol is also used to indicate conformance to lead-
free requirements and definitions adopted under 
the European Union’s Restriction on Hazardous 
Substances (RoHS) directive, 2002/95/EC.
For ordering information, visit 
www.intel.com
For the most current product information, 
visit www.intel.com/go/idb 
or http://ark.intel.com
For specific CPU compatibility, visit 
http://processormatch.intel.com
PROCESSOR 
Processor Support 
•Intel®Core™i7andIntel®Core™i5processorsinthe 
 LGA1156 package 
•Intel®TurboBoostTechnology3
•Intel®Hyper-ThreadingTechnology4
•IntegratedMemoryControllerwithsupportforup 
 to 16 GB5of system memory DDR3 1600+1/ 1333 / 
 1066 MHz SDRAM 
•Intel®FastMemoryAccess 
•SupportsIntel®64architecture7
CHIPSET
New Intel® P55 Express Chipset
•Intel®82P55PlatformControllerHub(PCH) 
•Intel®MatrixStorageTechnology(RAID0,1,5,10) 
•EightonboardSATAports 
•TwoeSATA(3.0Gb/s)portsonthebackpanel 
 provided by a Marvell* 88SE6145 controller
USB 2.0
Integrated Intel® PCH controller
•EightHi-SpeedUSB2.0portsviabackpanel 
•Fouradditionalportsviatwointernalheaders 
•Oneonboardportviainternalheader
System BIOS
•16MbFlashEEPROMwithIntel®PlatformInnovation 
 Framework for EFI Plug and Play, IDE drive auto- 
 configure 
•Advancedconfigurationandpowerinterface 
 V3.0b, DMI 2.5 
Intel® Rapid BIOS Boot
•Intel®RapidBIOSBoot 
•Intel®ExpressBIOSupdatesupport:BIOSupdate 
 via new F7 function key
 1
 DDR3 1600 or higher memory support requires compatible Intel® XMP-enabled memory or advanced knowledge of BIOS and memory tuning; individual results may vary. Altering PC memory frequency and/or  
voltage may (i) reduce system stability and use life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) 
cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or voltages, will be t for  
any particular purpose. Check with memory manufacturer for warranty and additional details. For specic supported memory for this motherboard, please visit www.intel.com/go/idb for more details.
 2 Intel® Desktop Control Center is only compatible with Intel® Desktop Boards based on the Intel® X38 Express Chipset and newer. Auto-tuning capabilities may not be available for all Extreme Series motherboards.  
 3 Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall 
system conguration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information.
  4  Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance will vary 
depending on the specic hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading. 
 5 System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much 
as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system conguration and operating system.
 6 Intel® High Denition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending 
on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm
 7 64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not 
operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software congurations. See http://developer.intel.com/technology/
intel64/index.htm for more information.
   INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS 
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS 
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR 
INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
   Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specications and product descriptions at any time, without notice.
   All products, dates, and gures specied are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
 Actual Intel® Desktop Board may differ from the image shown.
   Intel, the Intel logo, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
 * Other names and brands may be claimed as the property of others.
   Copyright © 2009 Intel Corporation. All rights reserved. 0709/AC/MS/PDF   322330-001US
Intel® Desktop Board DP55KG Extreme Series 
Technical Specications
Hardware Management Features
•Processorfanspeedcontrol 
•Systemchassisfanspeedcontrol 
•Voltageandtemperaturesensing 
•Fansensorinputsusedtomonitorfanactivity 
•PowermanagementsupportforACPI3.0b
Intel® PRO 10/100/1000 Network Connection
•Newlow-powerdesigncanmeetEnergyStar*5.0 
 specifications
Expansion Capabilities
•OnePCIExpress*2.0x16slot,switchabletotwo 
 PCIExpress2.0x8slots 
•OnePCIExpress2.0x4slot 
•TwoPCIExpress2.0x1slots 
•TwoPCIslots
Audio
•10-channelIntel®HighDefinitionAudio6codec 
•8-channelviathebackpanel 
•2-channelviathefrontpanel 
•Backpanelsupportforbothinputandoutput 
 via optical cable 
•OneinternalheaderforS/PDIFoutputforHDMI* 
 support
SYSTEM MEMORY
Memory Capacity
•Four240-pinDIMMconnectorssupportingupto 
 two double-sided DIMMs 
•Maximumsystemmemoryupto16GB5using 4 GB 
 double-sided DIMMs
Memory Types
•DDR31600/1333/1066SDRAMmemorysupport 
•Non-ECCMemory
Memory Modes
•Dual-orsingle-channeloperationsupport
Memory Voltage
•1.35Vlowvoltage 
•1.5VstandardJEDECvoltage 
•SupportforIntel®XMPextendedvoltageprofiles
JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
•Singleconfigurationjumperdesign 
•JumperaccessforBIOSmaintenancemode
Front-Panel Connectors
•Reset,HDLED,PowerLEDs,poweron/off 
•Twofront-panelHi-SpeedUSB2.0headers 
•Front-panelaudioheader 
•OneIEEE1394aheader
MECHANICAL
Board Style
•ATX
Board Size
•9.6”x11.6”(24.38cmx29.46cm)
Baseboard Power Requirements
•ATX12V
ENVIRONMENT
Operating Temperature
•0°Cto+55°C
Storage Temperature
•-20°Cto+70°C
REGULATIONS AND SAFETY STANDARDS
United States and Canada
 UL 1950, Third edition—CAN/CSA C22.2 
 No. 950-95 with recognized U.S. and Canadian 
 component marks