Intel H61 Express User manual

USER'S MANUAL
Of
Intel H61 Express Chipset
Based
M/B for Intel LGA 1155 Processors
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
NO. G03-MIH61MD-F
Rev: 2.0
Release date: March, 2011

i
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in any
area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request of
the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact malfunction
and crackles due to constant thermal expansion and contraction from the welding
spots’ that connect components and PCB. Computer should go through an adaptive
phase before it boots when it is moved from a cold environment to a warmer one to
avoid condensation phenomenon. These water drops attached on PCB or the surface
of the components can bring about phenomena as minor as computer instability
resulted from corrosion and oxidation from components and PCB or as major as short
circuit that can burn the components. Suggest starting the computer until the
temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer. Using
the close case may decrease the life of other device because the higher temperature in
the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.

ii
CHAPTER 1 INTRODUCTION OF INTEL H61 MOTHERBOARDS
1-1 FEATURES OF MOTHERBOARD................................................................1
1-1.1 SPECIAL FEATURES OF MOTHERBOARD .................................1
1-2 ITEM CHECKLIST.........................................................................................2
1-3 SPECIFICATION...........................................................................................3
1-4 LAYOUT DIAGRAM......................................................................................4
CHAPTER 2 HARDWARE INSTALLATION
2-1 CPU INSTALLATION ..................................................................................6
2-2 MEMORY MODULE INSTALLATION...........................................................7
2-3 EXPANSION SLOTS.....................................................................................8
CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING
3-1 MOTHERBOARD INTERNAL CONNECTORS ............................................8
3-2 I/O BACK PANEL CONNECTORS...............................................................10
3-3 HEADERS .....................................................................................................11
3-4 JUMPER SETTING .......................................................................................13
CHAPTER 4 USEFUL HELP
4-1 HOW TO UPDATE BIOS ..............................................................................14
4-2 TROUBLE SHOOTING .................................................................................14
TABLE OF CONTENT

1
Chapter 1
Introduction of Intel H61 Motherboards
1-1 Features of Motherboard
The Intel H61 Express chipset based motherboard series are based on Intel H61
Express chipset technology which supports the innovative Intel LGA 1155 socket
Intel® Core™ i7, Intel® Core™ i5, Core™ i3.
The Intel H61 Express chipset based motherboard series comes with an integrated
DDRIII memory controller for dual channel DDRIII 1066 /DDRIII 1333 MHz system
memories which are expandable to 8 GB capacity.
The motherboard provides four serial ATA2 interfaces of 3.0 Gb / s data transfer rate
for four serial ATA devices.
Of the H61 Express chipset based motherboards, model MIH61M-DU3 and model
MIH61M-D series are integrated with gigabit LAN chip providing 10/100/1000Mbps
data transfer rate while model MIH61M-DS series are integrated with megabit PCI-E
LAN chip providing 10/100Mbps data transfer rate.
The H61 Express chipset based motherboard series are embedded 6-channel HD
CODEC fully compatible with Sound Blaster Pro®standards to offer you home cinema
quality and absolutely software compatibility.
The H61 Express chipset based motherboard series offer one PCI-Express2.0 x16
graphics slot and two PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity
for the I/O of peripherals.
Embedded USB controllers as well as capability of expanding to 8 of USB 2.0
functional ports delivering 480Mb/s bandwidth of rich connectivity and one USB3.0
port (optional for model MIH61M-DU3) delivering 5Gbp/s bandwidth of rich
connectivity, these motherboards meet the future USB demands which are also
equipped with hardware monitor function on system to monitor and protect your
system and maintain your non-stop business computing.
Some special features--- OC-CON/ Thunder Protection(optional)/ E.R.P. Standards
(Optional for model MIH61M-DU3/ MIH61M-DS series) provide extra protection to the
motherboard to extend product life and ensure system stability.
1-1-1 Special Features of motherboard
OC-CON solid capacitors-High-polymer Solid Electrolysis Aluminum Capacitors
CPU Vcore Input and Output of the motherboard adopts OC-CON solid capacitors to
make it possible for motherboard to work from 55 degrees Centigrade below zero to
125 degrees centigrade. OC-CON capacitors possess superior physical
characteristics to prolong product life ten times than corresponding motherboard
without capacitors every time working temperature increases 20 degrees. Life of
product of motherboard with solid capacitors declines only 10% of those without solid
capacitors as well under same conditions.

2
Thunder Protection (Optional)
LAN chips of optional motherboards are integrated with thunder protection IC.
Thunder-lightning protection can effectively ensure PC security in the thundering and
rainy season. Please note that do not use PC when it is thundering and lightning.
E.R.P. Standards—(Energy Using Product Standards)
Model MIH61M-DU3/ MIH61M-DS series are in compliance with E.R.P. Standards
and support ACPI S3 Function.The full name of E.R.P. Standards is Energy Using
Product Standards, obviously technology utilized to low power consumption. ERP is a
technology with remarkable power saving function.
1-2 Item Checklist
5Intel H61 Chipset based motherboard
5DVD for motherboard utilities
5User’s Manual
5SATA Cable(s)
5I/O back panel shield

3
1-3 Specification
Spec Description
Design zU-ATX PCB size:24.5cmx18.0cm
Chipset zIntel H61 Express Chipset
CPU Socket zsupports the innovative Intel LGA 1155 socket Intel®
Core™ i7, Core™ i5, Core™ i3 Processor
Memory Slot
zDDRIII module slot x 2
zSupport 2pcs DDRIII 1066/DDRIII 1333 memory modules
expandable to 8 GB
zSupport dual channel function
Expansion Slots z1pcs PCI-Express 2.0 x16 by16 lane slot
z2pcs PCI-Express 2.0 x1 slots
Serial ATA2 zThe Intel H61chipset supports four internal Serial ATA ports for four SATA devices providing 3.0 Gb/sec data
transfer rate
LAN chip
zIntegrated gigabit PCI-E LAN chip that supports Fast
Ethernet LAN function of providing 10/100/1000Mbps data
transfer rate (for MIH61M-DU3 and MIH61M-D series
motherboard)
zIntegrated megabit PCI-E LAN chip that supports Fast
Ethernet LAN function of providing 10/100Mbps data
transfer rate (for MIH61M-DS series motherboard)
HD Audio Chip z6-CHHD Audio Codec integrated
zAudio driver and utility included
BIOS zAMI 32MB SMT Flash ROM
Multi I/O
zCoaxial S/PDIF_OUT connector x1
zVGA Connector x1
zDVI Connector x1
zPS/2 keyboard connector x1
zUSB 2.0 port x4 and header x2
zUSB 3.0 port x1 (Optional for model MIH61M-DU3)
zRJ-45 LAN connector x1
zAudio connector x1 (6-CH Audio)
zFront Panel Audio Header x1
zSerial Port headerx1
zHDMI-SPDIF header x1
zLPC_CON header x1
zFront panel header x1
zPWELED header x1
zSpeaker header x1

4
1-4 Layout Diagram
MIH61M-DU3 Series Motherboard:
CPU Socket
ATX Power Conn.
CPU FAN1 Header
USB 3.0 Port
USB Headers
SYSFAN1 Header
ATX 12V
Power Connector
RJ-45 LAN Port
Line-IN
MIC-IN
PS/2 Keyboard Port
VGA Port
DDRIII Slot x 2
USB 3.0
Port
JBAT Serial-ATAII Connecto
r
(SATA 1, 2, 3, 4)
Audio Connector
COM Header
Line-OUT
KB/MS Power on (JP1)
DVI Port
Intel H61 Chipset
PCI Express 2.0x1 slots
Gigabit LAN Chip
VGA Port
Coaxial
SPDIF_OUT Port
USB 2.0 Ports
Coaxial
SPDIF_OUT Port USB 2.0 Ports
DVI Port
USB 2.0 ports
over PS/2 KB port
RJ-45 over
USB 2.0
p
orts
Front Panel Audio Header
6-CH HD Audio Chip
PCI Express2.0 x16 by 16 Lane slot
HDMI-SPDIF Header
LPC_CON Header
Front Panel Header
Power LED Header S
p
eaker Heade
r

5
MIH61M-D / MIH61M-DS Series Motherboard:
* Note: Model MIH61M-D is integrated with gigabit LAN chip. Model MIH61M-DS is integrated with
megabit LAN chip. Other Specifications of these two models are the same.
CPU Socket
ATX Power Conn.
CPU FAN1 Header
USB Headers
SYSFAN1 Header
ATX 12V
Power Connector
RJ-45 LAN Port
Line-IN
MIC-IN
PS/2 Keyboard Port
VGA Port
DDRIII Slot x 2
JBAT Serial-ATAII Connecto
r
(SATA 1, 2, 3, 4)
Audio Connector
COM Header
Line-OUT
KB/MS Power on (JP1)
DVI Port
Intel H61 Chipset
PCI Express 2.0x1 slots
LAN Chip
VGA Port
Coaxial
SPDIF_OUT Port
USB 2.0 Ports
Coaxial
SPDIF_OUT Port USB 2.0 Ports
DVI Port
USB 2.0 ports
over PS/2 KB port
RJ-45 over
USB 2.0
p
orts
Front Panel Audio Header
6-CH HD Audio Chip
PCI Express2.0 x16 by 16 Lane slot
HDMI-SPDIF Header
LPC_CON Header
Front Panel Header
Power LED Header S
p
eaker Heade
r

6
Chapter 2
Hardware Installation
WARNING! Turn off your power when adding or removing expansion cards or
other system components. Failure to do so may cause severe
damage to both your motherboard and expansion cards.
2-1 CPU Installation
This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,
referred to as the LGA 1155 socket.
The CPU that comes with the motherboard should have a cooling FAN attached to
prevent overheating. If this is not the case, then purchase a correct cooling FAN
before you turn on your system.
NOTED! Be sure that there is sufficient air circulation across the processor’s
heat sink and CPU cooling FAN is working correctly, otherwise it
may cause the processor and motherboard overheat and damage,
you may install an auxiliary cooling FAN, if necessary.
To install a CPU, first turn off your system and remove its cover. Locate the LGA
1155 socket and open it by first pulling the level sideways away from the socket then
upward to a 135-degree angle. Insert the CPU with the correct orientation as shown
below. The notched corner should point toward the end of the level. Because the
CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation
as shown.
When you install the CPU into the LGA 1155 socket, there’s no force required CPU
insertion; then presses the level to locate position slightly without any extra force.
Pin-1 Indicator
Ali
g
nment ke
y

7
2-2 Memory Module Installation
This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES
(DIMM) socket for DDR III memory expansion available to maximum memory volume
of 8 GB DDRIII SDRAM.
Valid Memory Configurations
Bank 240-Pin DIMM PCS Maximum Capacity
DIMM1 DDR III 1066/ DDR III1333 X1 4GB
DIMM2 DDR III 1066/ DDR III1333 X1 4GB
Total System Memory (Max 4GB) 2 8GB
Recommend DIMM Module Combination ：
1. One DDRIII Memory Module ----Plug in DIMMM1.
2. Two DDRIII Memory Modules---Plug in DIMM1 & DIMM2 for Dual channel function
Dual channel Limited!
1. Dual channel function only supports when 2 DIMM Modules plug in either both DIMM1
& DIMM2.
2. Memory modules plugged in the same color DIMM must be of the same type, same
size, and same frequency for dual channel function.
Install DDR SDRAM modules to your motherboard is not difficult, you can refer to
figure below to see how to install DDRIII 1066/DDRIII 1333 SDRAM module.
DIMM2(BANK2+BANK3) DIMM1(BANK0+BANK1)
DIMM1 & DIMM2: Dual Channel
NOTICE! When you install DIMM module fully into the DIMM socket the eject
tab should be locked into the DIMM module very firmly and fit into its
indention on both sides.
Installation Tips：
Open the two plastic clips of memory slots then push down the module
vertically into the slot. See to it that the hole of the module fit into the notch of
the slot;
The two plastic clips will automatically close if the memory module is fitted in a
proper way.