Intersil ISL78171EVAL1Z User manual

1
ISL78171EVAL1Z Evaluation Board User Guide
Description
This quick start guide pertains to the ISL78171EVAL1Z
Evaluation Board. This board is populated with 60 LEDs in
6P10S (six parallel strings, each string consisting of 10 LEDs in
series) configuration to simplify evaluation and testing. The
device can function with or without an I2C controller. If it is
required to use I2C control for the ISL78171EVAL1Z board, use
a generic I2C interface adapter (not supplied with the
evaluation board kit) for the purpose of communication.
Please note that the slave address on the ISL78171 is
hexadecimal 58. Please refer to the quick setup guides for
jumper settings and power-up instructions.
Specifications
This board has been configured and optimized for the following
operating conditions:
• Input voltage: 4.5V to 26.5V
• Output voltage: 32V typical and 40V max
• LED string current 20mA typical
PCB Details
Board dimension = 5.525x2.550inch
Number of layers = 2
Type = FR4
Copper thickness = 2oz
Key Features
• Integrated 40V boost converter
• 6 Precision current sinks, up to 50mA each
• Current matching ±0.7% typical
• Dimming modes: DC, internal PWM, direct PWM,
DC + Int/Dir PWM
• Typical dimming ratio exceeding 60,000:1 for DC + Int/Dir
PWM
• Phase shift control for internal PWM dimming
• 600kHz/800kHz/1.2MHz I2C selectable switching
frequency
• Dynamic headroom control
References
ISL78171 Datasheet
Ordering Information
PART NUMBER DESCRIPTION
ISL78171EVAL1Z ISL78171 Evaluation Board
FIGURE 1. ISL78171EVAL1Z FRONT SIDE
User Guide 035
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas LLC 2015. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
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Recommended Equipment
The following equipment is recommended to perform testing:
• 0V to 30V power supply with 5A source current capability
• Digital Multimeters (DMMs)
• 500MHz quad-trace oscilloscope
• Signal generator for PWM pins
Quick Setup Guide (Non I2C)
1. Ensure that the circuit is correctly connected to the supply.
2. Connect the VIN+ supply to both J1 = BOOST-VIN and
TP9=VIN_IN.
3. OPEN: Jumpers JP1, JP9, J9, J10, J12, J13, J15, J16, J18, J19,
J21, J22, J24, J25, J26, J27 and J28.
4. CLOSE: Jumpers JP1A:1-2, JP2A:2-3, JP3A:2-3, JP4A:2-3,
JP5A:2-3, J6, J8, J11, J14, J17, J20, J29, J30 and J31.
5. Apply 200Hz, 0-5V, 50% duty, square wave to TP13.
6. Measure the voltage between J4 and J5. IT should read ~32V
7. Note that the 6P10S LED strings are ON.
8. Apply 5V to TP13 and trim RA1 to set the LED current in CH0
to measure 20mA using a DMM in series with J8.
9. Apply a square wave of 200Hz, 5V and vary the duty from 0%
to 100% and check that the LED varies from OFF to 100%
brightness.
10. Check that the current in J8 in step 9 varies from ~0mA to
20mA. Test complete turn OFF supplies.
Quick Setup Guide (I2C)
1. Ensure that the circuit is correctly connected to the supply.
2. Connect the VIN+ supply to both J1 = BOOST-VIN and
TP9=VIN_IN.
3. OPEN: Jumpers JP1, JP9, J9, J10, J12, J13, J15, J16, J18, J19,
J21, J22, J24, J25, J26, J27, J28 and J29.
4. CLOSE: Jumper JP1A:1-2, JP2A:2-3, JP3A:2-3, JP4A:1-2,
JP5A:1-2, J6, J8, J11, J14, J17, J20, J30 and J31.
5. Connect an I2C controller bus to either J7 or J39.
6. Set device address to 0x58.
7. IC enable is shorted to VIN by connecting jumper JP2A:2-3, so
that the EN is driven by TP9.
8. VLOGIC level for I2C can be generated from VDC by
connecting jumper JP3A:2-3. VLOGIC can be driven from TP7
(VLOGIC) by shorting jumper JP3A:1-2.
9. The configuration of VIN (JP1A), EN (JP2A) and VLOGIC (JP3A)
can be quickly found by referring to the table printed on the
bottom of the evaluation board, as shown in Figure 6 on
page 7.
10. There are 4 different operation modes for ISL78171. The
setting for each mode is shown on the other table printed on
the bottom of the evaluation board, as shown in Figure 6 on
page 7.
11. For I2C/SMBUS and DPST mode, connect the I2C interface
board to the ISL78171EVAL1Z board.
12. For I2C/SMBUS and DPST mode, in order to enable the board,
write a hex 58 for slave address and write a hex 05 to register
01.
13. For DPST mode I2C dimming, write hex 01 to register 01 (see
data sheet for more details).
14. For DPST mode with PWM dimming, write hex 03 to register
01. This will allow PWM dimming in DPST mode.
15. The LED current can be programmed by varying POT RA1
using Equation 1:
The measured current divided by six is the LED current per
channel. For example, 120mA measured current will correspond
to 20mA/channel.
16. The PWM dimming frequency can be adjusted by varying pot
RA2 using Equation 2:
TABLE 1. LED STRINGS CONFIGURATIONS WITH DIFFERENT JUMPER
SETTINGS
LED CONFIGUATRION 6P10S 6P9S 6P8S
J6 Short
J8
Short
J11
J14
J17
JJ20
J30
J10
Open Short Open
J13
J16
J19
J22
J24
J9
Open Open Short
J12
J15
J18
J21
J23
(EQ. 1)
ILE D 410.5 RA1 R16
+410.5 R13 ==
(EQ. 2)
FPWM 6.66 107RA2 R12
+=

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PCB Layout Recommendation
The PCB layout is very important for normal functioning of the
ISL78171, to ensure the system works with low EMI. The main
power loop is composed of the input capacitor, boost inductor,
the output capacitor, the LX pin and the PGND pin. It is necessary
to make the power loop as small as possible and the connecting
traces among them should be direct, short and wide. The
switching node of the boost converter (LX pins) and the traces
connected to the node are noisy, so keep the low level signals
away from these noisy traces. The input capacitor should be
placed as close as possible to the VIN and GND pins. The ground
of input and output capacitors should be connected as close as
possible. The heat of the IC is mainly dissipated through the
thermal pad. Maximizing the copper area connected to the
thermal pad is preferable. In addition, a solid ground plane is
helpful for better EMI performance. It is recommended to add at
least 6 vias ground connection within the pad for the best
thermal conduction. Keep the PGND plane and AGND plane
separate and connect them at the thermal pad.
EMI Considerations
The LX node switches at the VIN potential so its capacitance to
GND should be made minimized. This is achieved by keeping the
LX copper island as small as possible and by opening the copper
GND area directly below it. This prevents injection of the
switching frequency noise directly into the GND, and reduces the
conducted EMI for the system. The evaluation board also has an
input LC filter option on it ie., L2/L2A and C23. These
components are not populated on the PCB but can be soldered in
for the purpose of EMI evaluation if needed. The snubber R3and
C21 helps to reduce the peak voltage seen on the LX pin.
FIGURE 2. ISL78171 BLOCK DIAGRAM
40V, 6 x 50mA*
GENERATOR
VIN
COMP
+
-
+
-
CH0
CH5
VIN = 4.5V TO 26.5V
FET
DRIVER
REG
ISL78171
RAMP
COMP
IMAX ILIMIT
PWM/OC/SC
PWM BRIGHTNESS CONTROL
DEVICE CONTROL
FAULT/STATUS
IDENTIFICATION
REGISTERS
HIGHEST VF
STRING
DETECT
DC BRIGHTNESS CONTROL
VDC
SENSOR
FPWM
LED PWM
CONTROL
PGND
CONFIGURATION
+
-
AGND
REFERENCE
SMBCLK/SCL
SMBDAT/SDA
GM
AMP
+
-
+
-
LOGIC
OVP
LX
OSC AND  = 0
DC
OC, SC
DETECT
FAULT/STATUS
REGISTER
TEMP
FAULT/STATUS
REGISTER
PWM
RSET
+
-
OC, SC
DETECT
SMBUS/I2C
INTERFACE
EN
*VIN > 12V
AND PWM
CONTROL
LOGIC
OVP
FAULT
L=15uHDIODE, 60V, 3A
SCHOTTKY
FAULT/STATUS
REGISTER

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ISL78171EVAL1Z Layout
FIGURE 3. SILKSCREEN TOP

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FIGURE 4. TOP LAYER
ISL78171EVAL1Z Layout (Continued)
THIS TRACE IS A SHIELD DRAIN CONNECTION

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FIGURE 5. BOTTOM LAYER
ISL78171EVAL1Z Layout (Continued)

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FIGURE 6. SILKSCREEN BOTTOM
ISL78171EVAL1Z Layout (Continued)

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ISL78171EVAL1Z Evaluation Board Schematic
FIGURE 7. SCHEMATIC (PAGE 1)
RELEASED BY:
DRAW N BY:
SHEET
HRDWR ID
DATE:
DATE:
DATE:
TESTER
FILENAME:
MASK#
O
DATE:ENGINEER:
TITLE:
UPDATED BY:
05/04/2015
ISL78171
EVALUATION BOARD
THEJU BERNARD
~/ISL78171/ISL78171EVAL1ZA
1
SCHEMATIC
TIM KLEMANN
AGND
PGND
PGND
PMBUS DONGLE
STANDARD
CONNECTOR FOR
JP1
JP1A
JP2A
JP3A
JP4A
JP5A
JP29
JP9
BOOST_VIN
CH0
CH1
CH2
CH3
CH4
CH5
EN
EN_IN
FAULT
FPWM
PWM
PWM
RSET
RSET
SCL_IC
SCL_S
SCL_S
SDA_IC
SDA_S
SDA_S
VDC
VDC
VIN
VIN_IN
VLOGIC
VOUT
E
E
E
E
E
OUT
OUT
IN
IN
IN
IN
IN
IN
IN
IN
IN
OUT
10
9
4
1
6
5
3
2
7
8
J7
22-05-3101
1 2
4.99
R3
TP8
TP7
1 2
TP9
J3
220PF
C21
J2
/SDA
/SCL
ISL78171IRZ
U1
1
FAULT
2
VIN
3
EN
4
VDC
5
PWM
6
SMBDAT
7
SMBCLK
8
FPWM
9
AGND
10
CH0
11
CH1
12
CH2
13
CH3
14
CH4
15
CH5
16
OVP
17
RSET
18
COMP
19
PGND
20
LX
21
EP
J1
J39-1
1
3
390PF
C20
2
XAL6060-153ME
L1
15UH
4
L1A
DNP
12
TP11
TP10
10K
R2
DNP
R9
C8
0.033UF
R4
4.99
R16
4.99K
0
R10
TP14
1M
RA1
C23
OPEN
D1
PMEG6030EP
12
C22
OPEN
R14
0
XAL6060-153ME
L2
15UH
DNP
L2A
J31A
1 2
R13
DNP
1M
RA2
C10
OPEN
C7 1UF
100PF
C9
C3
4.7UF
0.10UF
C19
4.7UF
C1
R7 4.7K
2.21K
R12
C4
4.7UF
TP12
R2A
10K 357K
R1
4.7UF
C17
C5
4.7UF
R6 4.7K
4.7UF
C6
C2
0.10UF
C18
OPEN
J5
TP13
J4
FDS4435BZ_F085
Q1

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FIGURE 8. SCHEMATIC (PAGE 2)
ISL78171EVAL1Z Evaluation Board Schematic (Continued)
RELEASED BY:
DRAW N BY: DATE:
DATE:
DATE:
T
FILENA
UPDATED BY:
TIM KLEMANN 05/05
J9
J10
J8 J11
J12
J13 J16
J15
J14
J19
J18
J17 J20
J21
J22
J23
J24
J30
J25
J26
J27
J28
J6
CH0
CH1
CH2
CH3
CH4
CH5
VOUT
OUT
OUT
OUT
OUT
OUT
OUT
IN
D19
D60
D25
D9
12
12
D45
12
12
1000PF
C14
D39
12
D18
D59
TP1
D24
D8
12
D44
12
12
TP5
D38
D7
12
D17
D58
1000PF
C11
D23
12
D43
D31
12
1000PF
C15
D37
D6
D51
D16
D57
TP2
D22
12
D42
D30
TP6
D36
D5
D50
D15
D56
C12
1000PF
12
12
12
D29
C16
1000PF
D35
D4
D49
D14
D55
12
12
12
D28
1 2
D34
D3
D48
D13
D54
TP3
12
D21
12
D27
D11
D33
D2
D47
D12
D53
1000PF
C13
D41
D20
D61
D26
D10
D32
12
D46
12
D52
TP4
D40

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Bill of Materials
MANUFACTURER PART QTY UNITS
REFERENCE
DESIGNATOR DESCRIPTION MANUFACTURER
ISL78171EVAL1ZREVAPCB 1 ea PWB-PCB, ISL78171EVAL1Z, REVA, ROHS IMAGINEERING INC
06031A101JAT2A 1 ea C9 CAP, SMD, 0603, 100pF, 100V, 5%, NP0, ROHS AVX
06033A391FAT2A 1 ea C20 CAP, SMD, 0603, 390pF, 25V, 1%, C0G, ROHS AVX
C0603C33K3RACAUTO 1 ea C8 CAP-AEC-Q200, SMD, 0603, 0.033µF, 25V, 10%,
X7R, ROHS
KEMET
CGA3E2X7R1H104K080AA 2 ea C2, C19 CAP-AEC-Q200, SMD, 0603, 0.1µF, 50V, 10%,
X7R, ROHS
TDK
CGA5L3X7R1H475K160AE 2 ea C1, C17 CAP-AEC-Q200, SMD, 1206, 4.7µF, 50V, 10%,
X7R, ROHS
TDK
CGA6M3X7S2A475K200AE 4 ea C3-C6 CAP-AEC-Q200, SMD, 1210, 4.7µF, 100V, 10%,
X7S, ROHS
TDK
GCJ188R72A102KA01D 6 ea C11-C16 CAP-AEC-Q200, SMD, 0603, 0.001µF, 100V,
10%, X7R, ROHS
MURATA
ECJ-1VB2A221K 1 ea C21 CAP, SMD, 0603, 220pF, 100V, 10%, X7R, ROHS PANASONIC
0 ea C22 CAP, SMD, 0603, DNP-PLACE HOLDER, ROHS
LMK107B7105KAHT 1 ea C7 CAP-AEC-Q200, SMD, 0603, 1.0µF, 10V, 10%,
X7R, ROHS
TAIYO YUDEN
XAL6060-153MEC 2 ea L1, L2 COIL-PWR INDUCT, SMD, 15µH, 20%, 39.7mΩ,
11Mhz, 6.5X6.3mm, ROHS
COILCRAFT
1514-2 5 ea J1-J5 CONN-TURRET, TERMINAL POST, TH, ROHS KEYSTONE
22-05-3101 1 ea J7 CONN-HEADER, TH, 10P, 2.54mm, R/A,
FRICTIONLOCK, ROHS
MOLEX
22-11-2042 1 ea J39 CONN-HEADER, 1X4, SOLID, 2.54mm,
VERTICAL, FRICTION LOCK, GOLD
MOLEX
5002 14 ea TP1-TP14 CONN-MINI TEST POINT, VERTICAL, WHITE,
ROHS
KEYSTONE
68000-236HLF 5 ea JP1A-JP5A CONN-HEADER, 1x3, BREAKAWY 1X36,
2.54mm, ROHS
BERG/FCI
69190-202HLF 27 ea J6, J8-J31, JP1, JP9 CONN-HEADER, 1X2, RETENTIVE, 2.54mm,
0.230X 0.120, ROHS
BERG/FCI
PMEG6030EP, 115 1 ea D1 DIODE-SCHOTTKY RECTIFIER, SMD, SOD128,
60V, 3A, ROHS
NXP SEMICONDUCTOR
LWY87C-T1U1-3K8L-Z 60 ea D2-D61 LED, SMD, 2P, 3X1.2, WHITE/DIFFUSED, 3.2V,
20mA, 420mcd, ROHS
OSRAM
ISL78171ARZ-T 1 ea U1 IC-6-CHANNEL LED DRIVER, 20P, QFN, ROHS INTERSIL
FDS4435BZ_F085 1 ea Q1 TRANSISTOR-MOS, P-CHANNEL, 8P, SOIC, -30V,
-8.8A, ROHS
FAIRCHILD
3299W-1-105LF 2 ea RA1, RA2 POT-TRIM, TH, 1M, 0.5W, 10%, 3P, 3/8SQ,
25TURN, ROHS
BOURNS
CRCW06030000Z0EA 2 ea R10, R14 RES, SMD, AEC-Q200, 0603, 0Ω, 1/10W, TF,
ROHS
VISHAY
CRCW060310K0FKEA 2 ea R2, R2A RES-AEC-Q200, SMD, 0603, 10k, 1/10W, 1%,
TF, ROHS
VISHAY/DALE
CRCW06032K21FKEA 1 ea R12 RES-AEC-Q200, SMD, 0603, 2.21k, 1/10W, 1%,
TF, ROHS
VISHAY/DALE

User Guide 035
11
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is
cautioned to verify that the document is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
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CRCW0603357KFKEA 1 ea R1 RES-AEC-Q200, SMD, 0603, 357k, 1/10W, 1%,
TF, ROHS
VISHAY/DALE
CRCW06034K70FKEA 2 ea R6, R7 RES-AEC-Q200, SMD, 0603, 4.7k, 1/10W, 1%,
TF, ROHS
VISHAY/DALE
CRCW06034K99FKEA 1 ea R16 RES-AEC-Q200, SMD, 0603, 4.99k, 1/10W, 1%,
TF, ROHS
VISHAY/DALE
RC0805FR-074R99L 2 ea R3, R4 RES, SMD, 0805, 4.99Ω, 1/8W, 1%, TF, ROHS YAGEO
SJ-5003SPBL 4 ea Bottom four corners BUMPONS, 44inW x 20inH, DOMETOP, BLACK 3M
212403-013 1 ea Place assy in bag BAG, STATIC, 5X8, ZIPLOC, ROHS INTERSIL
0 ea C10, C18 (0603
AUTO-AEC-Q200)
DO NOT POPULATE OR PURCHASE
0 ea C23
(CGA5L3X7R1H475
K160AE)
DO NOT POPULATE OR PURCHASE
0eaL1A,L2A
(SRP1038A-150M)
DO NOT POPULATE OR PURCHASE
0 ea R9, R13 (0603
AUTO-AEC-Q200)
DO NOT POPULATE OR PURCHASE
Bill of Materials (Continued)
MANUFACTURER PART QTY UNITS
REFERENCE
DESIGNATOR DESCRIPTION MANUFACTURER

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Typical Performance Curves
FIGURE 9. EFFICIENCY vs LED CURRENT AT LX
FREQUENCY = 600kHz AT -40°C vs VIN
FIGURE 10. EFFICIENCY vs LED CURRENT AT LX
FREQUENCY = 600kHz AT 25°C vs VIN
FIGURE 11. EFFICIENCY vs LED CURRENT AT LX
FREQUENCY = 600kHz AT +105°C vsVIN
FIGURE 12. EFFICIENCY vs INPUT VOLTAGE AT LX
FREQUENCY = 600kHz vs VIN
FIGURE 13. EFFICIENCY vs LED CURRENT AT LX
FREQUENCY = 1.2MHz AT -40°C vs VIN
FIGURE 14. EFFICIENCY vs LED CURRENT AT LX
FREQUENCY = 1.2MHz AT +25°C vs VIN
EFFICIENCY (%)
LED CURRENT (A)
50
55
60
65
70
75
80
85
90
95
0 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
5V
12V
24V
26.5V
50
55
60
65
70
75
80
85
90
95
0 0.020.040.060.080.100.120.140.160.180.20
5V
12V
24V
26.5V
EFFICIENCY (%)
LED CURRENT (A)
EFFICIENCY (%)
LED CURRENT (A)
50
55
60
65
70
75
80
85
90
95
0 0.020.040.060.080.100.120.140.160.180.20
5V
12V
24V
26.5V
60
65
70
75
80
85
90
95
0 5 10 15 20 25 30
EFFECIENCY (%)
VIN (V)
-40°C
+25°C
+105°C
EFFICIENCY (%)
LED CURRENT (A)
50
55
60
65
70
75
80
85
90
95
0 0.020.040.060.080.100.120.140.160.180.20
5V
12V
24V
26.5V
EFFICIENCY (%)
LED CURRENT (A)
50
55
60
65
70
75
80
85
90
95
0 0.020.040.060.080.100.120.140.160.180.20
5V
12V
24V
26.5V

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FIGURE 15. EFFICIENCY vs LED CURRENT AT LX
FREQUENCY = 1.2MHz AT +105°C vs VIN
FIGURE 16. EFFICIENCY VS INPUT VOLTAGE AT LX
FREQUENCY = 1.2MHz vs VIN
FIGURE 17. CHANNEL-TO-CHANNEL CURRENT MATCHING, 600kHz vs VIN
FIGURE 18. CURRENT LINEARITY vs LOW LEVEL PWM DIMMING
DUTY CYCLE vs VIN
FIGURE 19. NORMALIZED LED CURRENT vs. DIMMING FACTOR,
(MEASURED AT ILED = 20mA)
Typical Performance Curves (Continued)
EFFICIENCY (%)
LED CURRENT (A)
50
55
60
65
70
75
80
85
90
95
0 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
5V
12V
24V
26.5V
60
65
70
75
80
85
90
95
0 5 10 15 20 25 30
EFFECIENCY (%)
VIN (V)
-40°C
+25°C
+105°C
CHANNEL MATCHING (%)
CHANNEL NUMBER
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
012345
5V 12V 24V 26.5V
5V 12V 24V 26.5V
5V 12V 24V 26.5V
+25°C,
+105°C,
-40°C,
0
0.2
0.4
0.6
0.8
1.0
1.2
01 4
PWM DIMMING DUTY CYCLE (%)
23 56
12 VIN
4.5 VIN
CURRENT (mA)
NORMALIZED LED CURRENT
0.00001
0.0001
0.001
0.01
0.1
1
0.00001 0.0001 0.001 0.01 0.1 1
DIMMING FACTOR
(PWM Reg Value x DC Reg Value) / (255 x 255)