Invensense An-000013 User manual

AN-000013

Analog Output MEMS Microphone Flex Evaluation Board User Guide

InvenSense reserves the right to change the detail

specifications as may be required to permit

improvements in the design of its products.

InvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 988–7339

www.invensense.com

Document Number: AN-000013

Revision: 1.5

Release Date: 06/12/2017

GENERAL DESCRIPTION

This user guide applies to the following MEMS microphone

evaluation boards:

•EV_INMP404-FX

•EV_INMP405-FX

•EV_INMP504-FX

•EV_INMP510-FX

•EV_ICS-40180-FX

•EV_ICS-40181-FX

•EV_ICS-40310-FX

•EV_ICS-40212-FX

This is a simple evaluation board that allows quick evaluation

of the performance of single-ended analog MEMS

microphones. The small size and low profile of the flexible

PCB enables direct placement of the microphone into a

prototype or an existing design for an in situ evaluation. The

evaluation board consists of a bottom port microphone

soldered to a flexible PCB with color-coded wires attached.

The only other component on the board is a 0.1 μF supply

bypass capacitor.

Table 1describes the functions of the three connection wires.

Table 2 describes the functional differences between the

different microphones that are used with this flex circuit.

TABLE 1. PIN FUNCTION DESCRIPTIONS

Wire

Color

Microphone

Pin Description

Red

VDD

Power Supply. 1.5 V DC to 3.6 V DC;

(0.9 V DC to 1.3 V DC for ICS-40310)

White

OUTPUT

Analog Output Signal

Black

GND

Ground

TABLE 2. MICROPHONE FUNCTIONAL

DIFFERENCES

Microphone

Maximum

Supply

Current

Maximum

Output

Voltage

Output

Impedance

Offset

INMP404

250 µA

0.18 V rms

200 Ω

0.8 V

INMP405

250 µA

0.18 V rms

200 Ω

0.8 V

INMP504

225 µA

0.18 V rms

200 Ω

0.8 V

INMP510

250 µA

0.40 V rms

350 Ω

0.7 V

ICS-40180 260 µA 0.40 V rms 350 Ω0.7 V

ICS-40181 250 µA 0.40 V rms 350 Ω 0.7 V

ICS-40310

25 µA

0.12 V rms

4.5 kΩ

0.57 V

ICS-40212

165 µA

0.63 V rms

190 Ω

1.0 V

EVALUATION BOARD CIRCUIT

Figure 1 shows the schematic of the evaluation board, and

Figure 2 shows the flex board layout. See the respective

microphone data sheets for complete descriptions and

specifications of the microphones. Note that the layout for

the EV_ICS-40181-FX differs slightly from what is shown in

Figure 2 because of this part’s different package footprint,

but the routing of the three signals is consistent.

Figure 1. Evaluation Board Schematic

Figure 2. Evaluation Board Layout (Top View)

0.1µF

OUTPUT

GND

MICROPHONE

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Document Number: AN-000013

Revision: 1.5

Figure 3. Evaluation Board Dimensions in Millimeters (Wires Not

Included)

BOTTOM PORT EVALUATION BOARD

PHOTOGRAPH

Figure 4. Top and Bottom View

TOP PORT EVALUATION BOARD PHOTOGRAPH

Figure 5. Top View

3.14mm

15mm

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Document Number: AN-000013

Revision: 1.5

REVISION HISTORY

REVISION

DATE REVISION DESCRIPTION

10/14/2015 1.3 This v1.3 is the initial release in Agile. Previous revisions were uncontrolled.

03/26/2015 1.4 Updated part names, added Figure 5

06/12/2017 1.5 Updated part names

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Document Number: AN-000013

Revision: 1.5

COMPLIANCE DECLARATION DISCLAIMER

InvenSense believes the environmental and other compliance information given in this document to be correct but cannot

guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on

file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and

suppliers, which has not been validated by InvenSense.

This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use,

or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense

reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice.

InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no

responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes,

but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any

patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are

the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional

or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,