Invensense An-000094 User manual

AN-000094

TDM Microphone Array Demo Board Guide

InvenSense reserves the right to change the detail

specifications as may be required to permit

improvements in the design of its products.

InvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 988–7339

www.invensense.com

Document Number: AN-000094

Revision: 1.0

Release Date: 4/6/2017

GENERAL DESCRIPTION

This user guide describes operation of the TDM Microphone

Array Demo board, which uses 16 ICS-52000 microphones.

This allows evaluation of the ICS-52000 in a large 4x4 array,

with 15 mm spacing between adjacent microphones in the

array. The order of the microphones in the 16 TDM slots in

shown on the board’s top silkscreen.

TABLE 1. BOARD SETTINGS

Headers,

Jumpers,

Switches Description

TDM data interface

Connect SCK to mics 1-4

Connect SCK to mics 5-8

Connect SCK to mics 9-12

Connect SCK to mics 13-16

Connect SD between rows 1 & 2

Connect SD between rows 2 & 3

Connect SD between rows 3 & 4

Board power connection, >2.3 V, 40 mA

Select whether the board’s SD output signal is

buffered (left) or unbuffered (right).

Select whether the board’s SCK input signal is

buffered (left) or unbuffered (right)

TABLE 2. J1 PINOUT

Function

Board VDD, Output of 1.8 V regulator. Do not

connect external supply to this pin.

No connect

SD – microphone data output

SCK – microphone serial clock input

WS – microphone frame clock input

2, 4, 6, 8, 10

Ground

BOARD OPERATION

The board can be set up for arrays of 4, 8, 12, or 16

microphones. The SCK signal to each horizontal row of four

microphones is enabled with jumpers J2-5. For an array of 4

mics, only populate jumper J2, for an array of 8 mics,

populate J2 & J3, and so on.

Jumpers J6-8 are used to connect or disconnect the SD trace

between rows, depending on how many mics are being used.

This is to minimize the loading of the SD line on a long trace.

Typically, switches S1 and S2 are set to enable buffers for the

SD output and SCK input. These can be disabled if necessary

for evaluation.

The board is powered by applying 2.3 – 3.3 V on J9. The

bottom pin of this jumper is VDD, the top pin is ground.

Figure 1. TDM Microphone Array Demo Board

AN-000094

Page 2of 4

Document Number: AN-000094

Revision: 1.0

SCHEMATIC

Figure 2. Schematic

Serial Data Interface

Connector Pinout

10. GND

9. WS

8. GND

7. SCK

6. GND

5. SD

4. GND

3. WSO/LR (unused)

2. GND

1. VDD

R45 should be 70 ohms to enable serial path SCK

R46-48 should be 0 ohms to enable serial path SCK

R&C OPTIONS

SD sign al switch

SCK signal switch:

TP2 TP3

TP4

TP5

TP6 TP7

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

0.10uF

10uF R1

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

0.10uF

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

0.10uF

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

0.10uF

OPEN

22R1

20k0

22R1 R8

22R1

HEADER_10WAY_POL

R42

68R1

R43

68R1

C27

22pF

C28

22pF

SPDT_SLIDE_CAS-120TA_SMD

C30

0.10uF

3S2

SPDT_SLIDE_CAS-120TA_SMD

2A1

3A2

B1 6

VCCA

VCCB

4GND

5DIR

U17

SN74LVC2T45DCTR_2BITLVLSHFT

R45

0R00

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

0.10uF

C10

10uF R16

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

0.10uF

R14

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

0.10uF

R12

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

0.10uF

R10

OPEN

R17

22R1

R18

OPEN

R13

22R1 R11

22R1

R15

22R1

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

ICS-52000

C11

0.10uF

C15

10uF R19

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

U10

ICS-52000

C12

0.10uF

R21

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

U11

ICS-52000

C13

0.10uF

R23

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

U12

ICS-52000

C14

0.10uF

R25

OPEN

R20

22R1

R27

OPEN

R24

22R1 R26

22R1

R22

22R1

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

U16

ICS-52000

C19

0.10uF

C20

10uF R28

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

U15

ICS-52000

C18

0.10uF

R30

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

U14

ICS-52000

C17

0.10uF

R32

OPEN

6SCK

7 SD

5WS

2CONFIG

1WSO

GND

3 VDD

U13

ICS-52000

C16

0.10uF

R34

OPEN

R29

22R1

R36

OPEN

R33

22R1 R35

22R1

R31

22R1

1VIN

2GND

3EN 4

VOUT

U18 ADP121C26

1.0uF

C25

1.0uF

R37

68R1

C21

22pF

R38

68R1

C22

22pF

R39

68R1

C23

22pF

R40

68R1

C24

22pF

R44

OPEN

C29

OPEN

R41

100R

D2 D3 D4

TP1

TP8 TP9 TP10TP11

TP12 TP13 TP14 TP15

TP16

R46

OPEN

R47

OPEN

R48

OPEN

DVDD

DVDD DVDD

SD_2

DVDD

DVDD DVDD

SD_3

DVDD

DVDD DVDD

SD_4

DVDD

DVDD DVDDDVDD

SCK_1

SD_1

SD_2

SCK_2

SD_3

SCK_3

SD_4

SCK_4

DVDD

SCK_1

SCK_2

SCK_3

SCK_4

SD_1

WSO_4

WSO_8

WSO_12

DVDD

SCK_2

SCK_3

SCK_4

AN-000094

Page 3of 4

Document Number: AN-000094

Revision: 1.0

REVISION HISTORY

Revision Date

Revision

Description

4/6/2017

1.0

Initial Release

AN-000094

Page 4of 4

Document Number: AN-000094

Revision: 1.0

COMPLIANCE DECLARATION DISCLAIMER

InvenSense believes the environmental and other compliance information given in this document to be correct but cannot

guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on

file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and

suppliers, which has not been validated by InvenSense.

This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any

infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the

right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes

no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any

claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to,

claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.

Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any

patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are

the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional

or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,