ITOX ML936-B Series User manual

ML936-B Series
System Board
User’s Manual
935-ML9361-000G
A10500920

Copyright
This publication contains information that is protected by copyright. No part of it
may be reproduced in any form or by any means or used to make any transfor-
mation/adaptation without the prior written permission from the copyright hold-
ers.
This publication is provided for informational purposes only. The manufacturer
makes no representations or warranties with respect to the contents or use
of this manual and specically disclaims any express or implied warranties of
merchantability or tness for any particular purpose. The user will assume the
entire risk of the use or the results of the use of this document. Further, the
manufacturer reserves the right to revise this publication and make changes to
its contents at any time, without obligation to notify any person or entity of such
revisions or changes.
© 2009. All Rights Reserved.
Trademarks
Windows®2000 and Windows®XP are registered trademarks of Microsoft Corpo-
ration. Award is a registered trademark of Award Software, Inc. Other trademarks
and registered trademarks of products appearing in this manual are the proper-
ties of their respective holders.

FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment
is operated in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with
the instruction manual, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or televi-
sion reception, which can be determined by turning the equipment off and on,
the user is encouraged to try to correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modications not expressly approved by the party responsible
for compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission
limits.

1
4
Introduction
Table of Contents
Copyright........................................................................................... 2
Trademarks........................................................................................ 2
FCC and DOC Statement on Class B.............................................. 3
About this Manual ............................................................................. 6
Warranty .......................................................................................... 6
Static Electricity Precautions ............................................................. 7
Safety Measures ................................................................................. 8
About the Package ............................................................................ 9
Before Using the System Board ........................................................ 9
Chapter 1 - Introduction ................................................................ 10
Specifications................................................................................ 10
Features ...................................................................................... 12
Chapter 2 - Hardware Installation.................................................. 15
System Board Layout .................................................................... 15
Mechanical Diagram ....................................................................... 17
System Memory ........................................................................... 19
Installing the DIM Module ......................................................... 20
Jumper Settings............................................................................. 22
Clear CMOS Data ..................................................................... 22
PS/2 Power Select.................................................................... 23
Panel Power Select ................................................................... 24
COM 1 / COM 2 RS232/RS422/RS485 Select............................... 25
Rear Panel I/O Ports..................................................................... 26
Line-out Jack ........................................................................... 27
LAN Port ................................................................................. 28
USB Ports................................................................................ 29
PS/2 Port ................................................................................ 30
DVI-I Port ............................................................................... 31
DC-in 12V ............................................................................... 32

1
5
Introduction
I/O Connectors............................................................................ 33
CD-in Internal Audio Connector ................................................. 33
S/PDIF Connector..................................................................... 34
COM Connectors ...................................................................... 35
LVDS LCD Panel and LCD/Inverter Power Connectors ................... 36
IDE Connector ......................................................................... 38
Front Panel Connectors ............................................................. 40
ECX Type 1 Expansion Slot (for EXT-ECX2 Daughterboard) ........... 41
SDIO/MMC Expansion Port ........................................................ 42
LEDs....................................................................................... 43
CompactFlash Socket................................................................ 45
Battery ................................................................................... 46
Installing EXT-ECX2 onto the ML936-B Board .............................. 47
Chapter 3 - BIOS Setup.................................................................. 50
Award BIOS Setup Utility.............................................................. 50
Standard CMOS Features .......................................................... 51
Advanced BIOS Features........................................................... 55
Advanced Chipset Features........................................................ 59
Integrated Peripherals .............................................................. 61
Power Management Setup ......................................................... 67
PnP/PCI Congurations ............................................................. 68
PC Health Status...................................................................... 70
Load Fail-Safe Defaults ............................................................. 71
Load Optimized Defaults ........................................................... 72
Set Supervisor Password........................................................... 73
Set User Password ................................................................... 74
Save & Exit Setup .................................................................... 75
Exit Without Saving.................................................................. 76
Updating the BIOS........................................................................ 77
Chapter 4 - Supported Software ................................................... 79
Appendix A - System Error Message .............................................. 94
Appendix B - Troubleshooting......................................................... 96

1
6
Introduction
About this Manual
An electronic le of this manual is included in the CD. To view the user’s manual
in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board
Utility CD) will appear. Click “User’s Manual” on the main menu.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the
product, inability to use the product, unauthorized replacement or alteration
of components and product specications.
2. The warranty is void if the product has been subjected to physical abuse,
improper installation, modication, accidents or unauthorized repair of the
product.
3. Unless otherwise instructed in this user’s manual, the user may not, under
any circumstances, attempt to perform service, adjustments or repairs on the
product, whether in or out of warranty. It must be returned to the purchase
point, factory or authorized service agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial
damages to the product that has been modied or altered.

1
7
Introduction
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components
or devices even before installing them in your system unit. Static electrical dis-
charge can damage computer components without causing any signs of physical
damage. You must take extra care in handling them to ensure against electro-
static build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag
until you are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the compo-
nents, contacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold
modules or connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and
other components. Perform the upgrade instruction procedures described
at an ESD workstation only. If such a station is not available, you can
provide some ESD protection by wearing an antistatic wrist strap and
attaching it to a metal part of the system chassis. If a wrist strap is
unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.

1
8
Introduction
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for instal-
lation or servicing. After installation or servicing, cover the system chassis
before plugging the power cord.
Battery:
• Danger of explosion if battery incorrectly replaced.
• Replace only with the same or equivalent type recommend by the manufac-
turer.
• Dispose of used batteries according to local ordinance.

1
9
Introduction
About the Package
The system board package contains the following items. If any of these items are
missing or damaged, please contact your dealer or sales representative for as-
sistance.
One system board
One IDE cable
One USB cable
One bracket mounted with a COM port
One I/O shield
One user’s manual
One CD
One QR (Quick Reference)
The system board and accessories in the package may not come similar to the
items listed above. This may differ in accordance to the sales region or models
in which it was sold. For more information about the standard package in your
region, please contact your dealer or sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the
following internal components.
• Memory module
• Storage device
You will also need external system peripherals you intend to use which will nor-
mally include at least a keyboard, a mouse and a video display monitor.
IGNORE

1
10
Introduction
Processor
Chipset
System Memory
Expansion Slot
(ECX Type 1)
Graphics
Audio
LAN
IDE
Chapter 1 - Introduction
• Intel® Low Power (IA-32 microarchitecture) processor
- ML936-B11C
: Intel® Z510P processor
: 400MHz system front side bus
: Speed supports 1.1GHz
- ML936-B16C
: Intel® Z530P processor
: 533MHz system front side bus
: Speed supports 1.6GHz
• Intel® US15WP SCH single chip
• One 200-pin SODIMM socket
• Supports 400/533MHz DDR2 SDRAM
• Supports maximum of 2GB system memory
• 1 expansion slot for EXT-ECX2 daughterboard
- 1 Mini PCI Express x1 slot
- 4 USB ports
- 1 8-bit Digital I/O connector
- 1 SDIO/MMC socket
- 4 COM connectors
- Audio (Line-out and Mic-in)
• Intel® GMA 500 integrated graphics engine
• Estimated 200MHz core render clock at 1.05V core voltage
• Ultra low power integrated 3D graphics
• High denition hardware video decode engine
• Supports LVDS and SDVO interfaces
- LVDS: Supports pixel clock depths of 18 or 24 bits, max.
pixel clock of 112MHz, equates to 1376x768 @ 85Hz
- SDVO: Up to 160MHz pixel clock, equates to 1280x1024
@ 85Hz
• Realtek ALC262 High Denition audio CODEC
• 2-channel audio output
• 1 stereo DAC supports 16/20/24-bit PCM format with
44.1/48/96/192KHz sample rate
• 2 stereo ADCs support 16/20-bit PCM format with
44.1/48/96/192KHz sample rate
• One Realtek RTL8111C PCI Express Gigabit controller
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) com-
pliant
• Supports up to two Ultra ATA 33 IDE devices
Note:
We do not recommend using IDE devices and CF card at
the same time.
Specifications

1
11
Introduction
Rear Panel I/O
Ports
I/O Connectors
BIOS
Energy Efcient
Design
Damage Free
Intelligence
Temperature
Humidity
PCB
• 1 mini-DIN-6 port for PS/2 mouse and PS/2 KB ports
• 1 DVI-I port (DVI-D signal only)
• 1 RJ45 LAN port
• 2 USB ports
• 1 line-out audio jack
• 1 DC-in 12V jack
• 1 connector for 2 additional external USB 2.0/1.1 ports
• 2 connectors for 2 external serial ports (RS232/RS422/
RS485 selectable)
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 S/PDIF-in/out connector
• 1 CD-in internal audio connector
• 1 44-pin IDE connector
• 1 front panel connector
• 1 CompactFlash socket
• 1 SDIO/MMC expansion port
• 1 expansion slot
• Award BIOS
• 8Mbit ash memory
• Supports ACPI specication 2.0/1.0
• Enhanced Intel®SpeedStep Technology
• Monitors CPU/system temperature and overheat alarm
• Monitors CPU(V)/1.05V/1.8V/5V/12V voltages and failure
alarm
• 0oC to 60oC
• 10% to 90%
• 10-layers, ECX form factor
• 10.5cm (4.14”) x 14.6cm (5.75”)

1
12
Introduction
Features
CompactFlash
The system board is equipped with the CompactFlashTM socket for inserting a
CompactFlashTM card. CompactFlashTM card is a small removable mass storage
device designed with ash technology - a non-volatile storage solution that does
not require a battery to retain data indenitely. The CompactFlashTM technology
is widely used in products such as portable and desktop computers, digital cam-
eras, handheld data collection scanners, PDAs, Pocket PCs, handy terminals and
personal communicators.
DDR2
DDR2 is a higher performance DDR technology whose data transfer rate delivers
bandwidth of 4.3 GB per second and beyond. That is twice the speed of the con-
ventional DDR without increasing its power consumption. DDR2 SDRAM modules
work at 1.8V supply compared to 2.6V memory voltage for DDR modules. DDR2
also incorporates new innovations such as the On-Die Termination (ODT) as well
as larger 4-bit pre-fetch against DDR which fetches 2 bits per clock cycle.
Graphics
The Intel SCH’s integrated Intel GMA 500 provides integrated graphics (2D and
3D) and high-denition video decode capabilities with minimal power consump-
tion. It supports DVI and LVDS LCD interfaces.
DVI
DVI (Digital Visual Interface) is a form of video interface technology made to
maximize the quality of at panel LCD monitors and modern video graphics
cards. Data is transmitted using the TMDS (Transition Minimized Differential Sig-
naling) protocol, providing a digital signal from the PC’s graphics subsystem to
the display.
LVDS
The Intel SCH supports a Low-Voltage Differential Signaling (LVDS) interface that
allows the Intel Graphics Media Adapter to communicate directly to the at-panel
display. The LVDS interface supports pixel color depths of 18 and 24 bits.

1
13
Introduction
Secure Digital I/O (SDIO) / Multimedia Card (MMC)
The SDIO/MMC expansion port is used to insert a Secure Digital Input/Output
(SDIO) or Multimedia Card (MMC) device. Aside from storing data les, an SDIO
card is also capable of storing powerful software applications.
PCI Express
PCI Express is a high bandwidth I/O infrastructure that possesses the ability to
scale speeds by forming multiple lanes. The x1 PCI Express lane supports trans-
fer rate of 2.5 Gigabytes (250MBbps) per second which is nearly 4 times faster
than the traditional PCI.
S/PDIF
S/PDIF is a standard audio le transfer format that transfers digital audio sig-
nals to a device without having to be converted rst to an analog format. This
prevents the quality of the audio signal from degrading whenever it is converted
to analog. S/PDIF is usually found on digital audio equipment such as a DAT
machine or audio processing device. The S/PDIF connector on the system board
sends surround sound and 3D audio signal outputs to ampliers and speakers
and to digital recording devices like CD recorders.
Gigabit LAN
The Realtek RTL8111C PCI Express Gigabit controller supports up to 1Gbps data
transmission.
USB
The system board supports USB 2.0 and USB 1.1 ports. USB 1.1 supports 12Mb/
second bandwidth while USB 2.0 supports 480Mb/second bandwidth providing a
marked improvement in device transfer speeds between your computer and a
wide range of simultaneously accessible external Plug and Play peripherals.

1
14
Introduction
ACPI
The system board is designed to meet the ACPI (Advanced Conguration and
Power Interface) specication. ACPI has energy saving features that enables PCs
to implement Power Management and Plug-and-Play with operating systems that
support OS Direct Power Management.

15
2
Hardware Installation
System Board Layout
Chapter 2 - Hardware Installation
Expansion slot
1
S/PDIF
1
CD-in
Line-out
LAN
USB 0-1
PS/2 KB/Mouse
PS/2 power
select (JP8)
1Chrontel
CH7307C
Realtek
RTL8111C
2
6
COM 2 RS232/422/
select (JP7)485
COM1RS232/422/ select (JP13)485
5
12
6
5
1USB 2-3
10
2
19Battery
2
1
9
COM 2
10
2
1
9
COM 1
10
ITE
IT8516E
BIOS
Intel CPU
Intel
US15WP
12
11
2
1
Front panel
LED 3
LED 4
LED 5
LED 6
LED 1
LED 2 SDIO LEDs (LEDs1and 2)
DVI-I
(DVI-D signal
only)
DC-in 12V
DDR2 SODIMM
5
1
2
6
Panel powerselect (JP4)
1
8
LCD/Inverter
power
1920
12
1
Clear CMOS (JP2)
LVDS LCD
panel
12
43 44
IDE
Component Side

16
2Hardware Installation
Realtek
ALC262
CompactFlash
SDIO/MMC
Solder Side

17
2
Hardware Installation
Mechanical Diagram
ML936-B - Component Side
0.00
0.00
8.90
19.69 36.14
54.72
71.30
99.45
128.54
142.80
3.18
3.18
23.60
4.29
76.22
16.16
98.40
8.90 142.80
98.40
44.20
11.70
146.00
105.00
96.42
113.60
1
ML936-B - Solder Side
0.00
0.00
8.90
142.80
3.18
3.18
76.22
16.16
8.90 142.80
98.40
44.20
11.70
146.00
105.00
96.75
15.03
127.60
70.90
98.40

18
2Hardware Installation
EXT-ECX2
C1
C8
C7
C4
C11
R22
R21 R20 R19
R8
R7
R380
C51
C50
C49
C48
C45
LED2
-+
LED1
-+
LED3
-+
M3
M2
M18
M22
M7
M1
M10M9
C53
C54
C55
C56
FB57
FB19
FB18
FB17
FB16
FB15
FB14
FB59
FB61
J8 1
3
L4
1 2
34
L1
1 2
34
L2
1 2
34
L3
1 2
34
L9
1
2
3
4
1
U2
1
U4
U9
1 2
9
10
J5
1 2
9
10
J4
1 2
9
10
J3
1 2
9
10
J6
MH3
1
58
4
CN2
1
58
4
13 CN8
456
87 2914
1011121328 27
30
29
16
15
17
18 19 20 22 21 23 25 26 24
MPCIE1
1 9 17 25 35 45
15 51
REV.2
R370 R371
R376 R377
R400
R426 R427 R430 R609
R383
R395
R429
R396
R610
R411
R412
M25
M144
M145
M180
M142
M165
J7
13
U10
37
48
25 36
24
13
1
12
1 2
J23
19 20
1
220
19
J15
CN11
5
4
3
2
1
7
6
8
CN10
5
4
32
17
6
8
X2
1
23
4
EC19
F8
F7
C209
C208
C207
C206
FA N
LPC
SDIO
COM6 COM5 COM4 COM3
DIO
Line_in
Mic_in
Mini PCIE
USB4/5
10 90
110
1.5
5
1
6.5
9.5
12
105
13.75
67
1.5
1 12
33.75

19
2
Hardware Installation
System Memory
Important:
Electrostatic discharge (ESD) can damage your system board, processor,
disk drives, add-in boards, and other components. Perform the upgrade
instruction procedures described at an ESD workstation only. If such a
station is not available, you can provide some ESD protection by wearing
an antistatic wrist strap and attaching it to a metal part of the system
chassis. If a wrist strap is unavailable, establish and maintain contact
with the system chassis throughout any procedures requiring ESD pro-
tection.
SODIMM
The system board is equipped with a 200-pin SODIMM socket that supports DDR2
module.
BIOS Setting
Congure the system memory in the Advanced Chipset Features submenu of the
BIOS.

20
2Hardware Installation
Installing the SODIMM DDR2 Module
1. Make sure the PC and all other peripheral devices connected to it has been
powered down.
2. Disconnect all power cords and cables.
3. Locate the SODIMM socket on the board.
4. Note the key on the socket. The key ensures the module can be plugged into
the socket in only one way.
5. Grasping the module by its edges, align the module into the socket at an
approximately 30 degrees angle. Note that the socket and module are both
keyed, which means the module can be plugged into the socket in only one
direction.