Jameco Atmel AT89C2051 User manual

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4-15
Pin Configuration
PDIP/SOIC
/VPP
Features
•Compatible with MCS-51™ Products
•2K Bytes of Reprogrammable Flash Memory
– Endurance: 1,000 Write/Erase Cycles
•2.7V to 6V Operating Range
•Fully Static Operation: 0 Hz to 24 MHz
•Two-Level Program Memory Lock
•128 x 8-Bit Internal RAM
•15 Programmable I/O Lines
•Two 16-Bit Timer/Counters
•Six Interrupt Sources
•Programmable Serial UART Channel
•Direct LED Drive Outputs
•On-Chip Analog Comparator
•Low Power Idle and Power Down Modes
Description
The AT89C2051 is a low-voltage, high-performance CMOS 8-bit microcomputer with
2K Bytes of Flash programmable and erasable read only memory (PEROM). The
device is manufactured using Atmel’s high density nonvolatile memory technology
and is compatible with the industry standard MCS-51™ instruction set. By combining
a versatile 8-bit CPU with Flash on a monolithic chip, the Atmel AT89C2051 is a pow-
erful microcomputer which provides a highly flexible and cost effective solution to
many embedded control applications.
The AT89C2051 provides the following standard features: 2K Bytes of Flash, 128
bytes of RAM, 15 I/O lines, two 16-bit timer/counters, a five vector two-level interrupt
architecture, a full duplex serial port, a precision analog comparator, on-chip oscillator
and clock circuitry. In addition, the AT89C2051 is designed with static logic for opera-
tion down to zero frequency and supports two software selectable power saving
modes. The Idle Mode stops the CPU while allowing the RAM, timer/counters, serial
port and interrupt system to continue functioning. The Power Down Mode saves the
RAM contents but freezes the oscillator disabling all other chip functions until the next
hardware reset.
0368D-B–12/97
8-Bit
Microcontroller
with 2K Bytes
Flash
AT89C2051
Jameco Part Number 168874

AT89C2051
4-16
Block Diagram

AT89C2051
4-17
Pin Description
VCC
Supply voltage.
GND
Ground.
Port 1
Port 1 is an 8-bit bidirectional I/O port. Port pins P1.2 to
P1.7 provide internal pullups. P1.0 and P1.1 require exter-
nal pullups. P1.0 and P1.1 also serve as the positive input
(AIN0) and the negative input (AIN1), respectively, of the
on-chip precision analog comparator. The Port 1 output
buffers can sink 20 mA and can drive LED displays directly.
When 1s are written to Port 1 pins, they can be used as
inputs. When pins P1.2 to P1.7 are used as inputs and are
externally pulled low, they will source current (IIL) because
of the internal pullups.
Port 1 also receives code data during Flash programming
and verification.
Port 3
Port 3 pins P3.0 to P3.5, P3.7 are seven bidirectional I/O
pins with internal pullups. P3.6 is hard-wired as an input to
the output of the on-chip comparator and is not accessible
as a general purpose I/O pin. The Port 3 output buffers can
sink 20 mA. When 1s are written to Port 3 pins they are
pulled high by the internal pullups and can be used as
inputs. As inputs, Port 3 pins that are externally being
pulled low will source current (IIL) because of the pullups.
Port 3 also serves the functions of various special features
of the AT89C2051 as listed below:
Port 3 also receives some control signals for Flash pro-
gramming and verification.
RST
Reset input. All I/O pins are reset to 1s as soon as RST
goes high. Holding the RST pin high for two machine cycles
while the oscillator is running resets the device.
Each machine cycle takes 12 oscillator or clock cycles.
XTAL1
Input to the inverting oscillator amplifier and input to the
internal clock operating circuit.
XTAL2
Output from the inverting oscillator amplifier.
Oscillator Characteristics
XTAL1 and XTAL2 are the input and output, respectively,
of an inverting amplifier which can be configured for use as
an on-chip oscillator, as shown in Figure 1. Either a quartz
crystal or ceramic resonator may be used. To drive the
device from an external clock source, XTAL2 should be left
unconnected while XTAL1 is driven as shown in Figure 2.
There are no requirements on the duty cycle of the external
clock signal, since the input to the internal clocking circuitry
is through a divide-by-two flip-flop, but minimum and maxi-
mum voltage high and low time specifications must be
observed.
Figure 1. Oscillator Connections
Note: C1, C2 = 30 pF ±10 pF for Crystals
= 40 pF ±10 pF for Ceramic Resonators
Figure 2. External Clock Drive Configuration
Port Pin Alternate Functions
P3.0 RXD (serial input port)
P3.1 TXD (serial output port)
P3.2 INT0 (external interrupt 0)
P3.3 INT1 (external interrupt 1)
P3.4 T0 (timer 0 external input)
P3.5 T1 (timer 1 external input)

AT89C2051
4-18
Special Function Registers
A map of the on-chip memory area called the Special Func-
tion Register (SFR) space is shown in the table below.
Note that not all of the addresses are occupied, and unoc-
cupied addresses may not be implemented on the chip.
Read accesses to these addresses will in general return
random data, and write accesses will have an indetermi-
nate effect.
User software should not write 1s to these unlisted loca-
tions, since they may be used in future products to invoke
new features. In that case, the reset or inactive values of
the new bits will always be 0.
Table 1. AT89C2051 SFR Map and Reset Values
0F8H 0FFH
0F0H B
00000000 0F7H
0E8H 0EFH
0E0H ACC
00000000 0E7H
0D8H 0DFH
0D0H PSW
00000000 0D7H
0C8H 0CFH
0C0H 0C7H
0B8H IP
XXX00000 0BFH
0B0H P3
11111111 0B7H
0A8H IE
0XX00000 0AFH
0A0H 0A7H
98H SCON
00000000 SBUF XXXXXXXX 9FH
90H P1
11111111 97H
88H TCON
00000000 TMOD 00000000 TL0 00000000 TL1 00000000 TH0 00000000 TH1 00000000 8FH
80H SP
00000111 DPL 00000000 DPH 00000000 PCON 0XXX0000 87H

AT89C2051
4-19
Restrictions on Certain Instructions
The AT89C2051 and is an economical and cost-effective
member of Atmel’s growing family of microcontrollers. It
contains 2K bytes of flash program memory. It is fully com-
patible with the MCS-51 architecture, and can be pro-
grammed using the MCS-51 instruction set. However,
there are a few considerations one must keep in mind when
utilizing certain instructions to program this device.
All the instructions related to jumping or branching should
be restricted such that the destination address falls within
the physical program memory space of the device, which is
2K for the AT89C2051. This should be the responsibility of
the software programmer. For example, LJMP 7E0H would
be a valid instruction for the AT89C2051 (with 2K of mem-
ory), whereas LJMP 900H would not.
1. Branching instructions:
LCALL, LJMP, ACALL, AJMP, SJMP, JMP @A+DPTR
These unconditional branching instructions will execute
correctly as long as the programmer keeps in mind that the
destination branching address must fall within the physical
boundaries of the program memory size (locations 00H to
7FFH for the 89C2051). Violating the physical space limits
may cause unknown program behavior.
CJNE [...], DJNZ [...], JB, JNB, JC, JNC, JBC, JZ, JNZ With
these conditional branching instructions the same rule
above applies. Again, violating the memory boundaries
may cause erratic execution.
For applications involving interrupts the normal interrupt
service routine address locations of the 80C51 family archi-
tecture have been preserved.
2. MOVX-related instructions, Data Memory:
The AT89C2051 contains 128 bytes of internal data mem-
ory. Thus, in the AT89C2051 the stack depth is limited to
128 bytes, the amount of available RAM. External DATA
memory access is not supported in this device, nor is exter-
nal PROGRAM memory execution. Therefore, no MOVX
[...] instructions should be included in the program.
A typical 80C51 assembler will still assemble instructions,
even if they are written in violation of the restrictions men-
tioned above. It is the responsibility of the controller user to
know the physical features and limitations of the device
being used and adjust the instructions used correspond-
ingly.
Program Memory Lock Bits
On the chip are two lock bits which can be left unpro-
grammed (U) or can be programmed (P) to obtain the addi-
tional features listed in the table below:
Lock Bit Protection Modes(1)
Note: 1. The Lock Bits can only be erased with the Chip Erase
operation.
Idle Mode
In idle mode, the CPU puts itself to sleep while all the on-
chip peripherals remain active. The mode is invoked by
software. The content of the on-chip RAM and all the spe-
cial functions registers remain unchanged during this
mode. The idle mode can be terminated by any enabled
interrupt or by a hardware reset.
P1.0 and P1.1 should be set to ’0’ if no external pullups are
used, or set to ’1’ if external pullups are used.
It should be noted that when idle is terminated by a hard-
ware reset, the device normally resumes program execu-
tion, from where it left off, up to two machine cycles before
the internal reset algorithm takes control. On-chip hardware
inhibits access to internal RAM in this event, but access to
the port pins is not inhibited. To eliminate the possibility of
an unexpected write to a port pin when Idle is terminated by
reset, the instruction following the one that invokes Idle
should not be one that writes to a port pin or to external
memory.
Power Down Mode
In the power down mode the oscillator is stopped, and the
instruction that invokes power down is the last instruction
executed. The on-chip RAM and Special Function Regis-
ters retain their values until the power down mode is termi-
nated. The only exit from power down is a hardware reset.
Reset redefines the SFRs but does not change the on-chip
RAM. The reset should not be activated before VCC is
restored to its normal operating level and must be held
active long enough to allow the oscillator to restart and sta-
bilize.
P1.0 and P1.1 should be set to ’0’ if no external pullups are
used, or set to ’1’ if external pullups are used.
Program Lock Bits
LB1 LB2 Protection Type
1 U U No program lock features.
2 P U Further programming of the Flash
is disabled.
3 P P Same as mode 2, also verify is
disabled.

AT89C2051
4-20
Programming The Flash
The AT89C2051 is shipped with the 2K bytes of on-chip
PEROM code memory array in the erased state (i.e., con-
tents = FFH) and ready to be programmed. The code mem-
ory array is programmed one byte at a time.
Once the array
is programmed, to re-program any non-blank byte, the
entire memory array needs to be erased electrically.
Internal Address Counter: The AT89C2051 contains an
internal PEROM address counter which is always reset to
000H on the rising edge of RST and is advanced by apply-
ing a positive going pulse to pin XTAL1.
Programming Algorithm: To program the AT89C2051,
the following sequence is recommended.
1. Power-up sequence:
Apply power between VCC and GND pins
Set RST and XTAL1 to GND
2. Set pin RST to ’H’
Set pin P3.2 to ’H’
3. Apply the appropriate combination of ’H’ or ’L’ logic
levels to pins P3.3, P3.4, P3.5, P3.7 to select one of the
programming operations shown in the PEROM Pro-
gramming Modes table.
To Program and Verify the Array:
4. Apply data for Code byte at location 000H to P1.0 to
P1.7.
5. Raise RST to 12V to enable programming.
6. Pulse P3.2 once to program a byte in the PEROM array
or the lock bits. The byte-write cycle is self-timed and
typically takes 1.2 ms.
7. To verify the programmed data, lower RST from 12V to
logic ’H’ level and set pins P3.3 to P3.7 to the appropiate
levels. Output data can be read at the port P1 pins.
8. To program a byte at the next address location, pulse
XTAL1pinonce toadvancetheinternaladdresscounter.
Apply new data to the port P1 pins.
9. Repeat steps 5 through 8, changing data and advancing
the address counter for the entire 2K bytes array or until
the end of the object file is reached.
10.Power-off sequence:
set XTAL1 to ’L’
set RST to ’L’
Turn VCC power off
Data Polling: The AT89C2051 features Data Polling to
indicate the end of a write cycle. During a write cycle, an
attempted read of the last byte written will result in the com-
plement of the written data on P1.7. Once the write cycle
has been completed, true data is valid on all outputs, and
the next cycle may begin. Data Polling may begin any time
after a write cycle has been initiated.
Ready/Busy:The Progress of byte programming can also
be monitored by the RDY/BSY output signal. Pin P3.1 is
pulled low after P3.2 goes High during programming to indi-
cate BUSY. P3.1 is pulled High again when programming is
done to indicate READY.
Program Verify: If lock bits LB1 and LB2 have not been
programmed code data can be read back via the data lines
for verification:
1. Reset the internal address counter to 000H by bringing
RST from ’L’ to ’H’.
2. Apply theappropriatecontrolsignalsforReadCodedata
and read the output data at the port P1 pins.
3. Pulse pin XTAL1 once to advance the internal address
counter.
4. Read the next code data byte at the port P1 pins.
5. Repeat steps 3 and 4 until the entire array is read.
The lock bits cannot be verified directly. Verification of the
lock bits is achieved by observing that their features are
enabled.
Chip Erase: The entire PEROM array (2K bytes) and the
two Lock Bits are erased electrically by using the proper
combination of control signals and by holding P3.2 low for
10 ms. The code array is written with all “1”s in the Chip
Erase operation and must be executed before any non-
blank memory byte can be re-programmed.
Reading the Signature Bytes: The signature bytes are
read by the same procedure as a normal verification of
locations 000H, 001H, and 002H, except that P3.5 and
P3.7 must be pulled to a logic low. The values returned are
as follows.
(000H) = 1EH indicates manufactured by Atmel
(001H) = 21H indicates 89C2051
Programming Interface
Every code byte in the Flash array can be written and the
entire array can be erased by using the appropriate combi-
nation of control signals. The write operation cycle is self-
timed and once initiated, will automatically time itself to
completion.
All major programming vendors offer worldwide support for
the Atmel microcontroller series. Please contact your local
programming vendor for the appropriate software revision.

AT89C2051
4-21
Flash Programming Modes
Notes: 1. The internal PEROM address counter is reset to 000H on the rising edge of RST and is advanced by a positive pulse at
XTAL 1 pin.
2. Chip Erase requires a 10-ms PROG pulse.
3. P3.1 is pulled Low during programming to indicate RDY/BSY.
Figure 3. Programming the Flash Memory Figure 4. Verifying the Flash Memory
Mode RST/VPP P3.2/PROG P3.3 P3.4 P3.5 P3.7
Write Code Data(1)(3) 12V L H H H
Read Code Data(1) HHLLHH
Write Lock Bit - 1 12V H H H H
Bit - 2 12V H H L L
Chip Erase 12V H L L L
Read Signature Byte H H L L L L
(2)
PP

AT89C2051
4-22
Flash Programming and Verification Characteristics
TA= 0°C to 70°C, VCC = 5.0 ±10%
Note: 1. Only used in 12-volt programming mode.
Flash Programming and Verification Waveforms
Symbol Parameter Min Max Units
VPP Programming Enable Voltage 11.5 12.5 V
IPP Programming Enable Current 250 µA
tDVGL Data Setup to PROG Low 1.0 µs
tGHDX Data Hold After PROG 1.0 µs
tEHSH P3.4 (ENABLE) High to VPP 1.0 µs
tSHGL VPP Setup to PROG Low 10 µs
tGHSL VPP Hold After PROG 10 µs
tGLGH PROG Width 1 110 µs
tELQV ENABLE Low to Data Valid 1.0 µs
tEHQZ Data Float After ENABLE 01.0µ
s
t
GHBL PROG High to BUSY Low 50 ns
tWC Byte Write Cycle Time 2.0 ms
tBHIH RDY/BSY\ to Increment Clock Delay 1.0 µs
tIHIL Increment Clock High 200 ns

AT89C2051
4-23
Absolute Maximum Ratings*
DC Characteristics
TA= -40°C to 85°C, VCC = 2.0V to 6.0V (unless otherwise noted)
Notes: 1. Under steady state (non-transient) conditions, IOL must be externally limited as follows:
Maximum IOL per port pin: 20 mA
Maximum total IOL for all output pins: 80 mA
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater
than the listed test conditions.
2. Minimum VCC for Power Down is 2V.
Operating Temperature ................................. -55°C to +125°C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Storage Temperature..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground.....................................-1.0V to +7.0V
Maximum Operating Voltage............................................. 6.6V
DC Output Current...................................................... 25.0 mA
Symbol Parameter Condition Min Max Units
VIL Input Low Voltage -0.5 0.2 VCC - 0.1 V
VIH Input High Voltage (Except XTAL1, RST) 0.2 VCC + 0.9 VCC + 0.5 V
VIH1 Input High Voltage (XTAL1, RST) 0.7 VCC VCC + 0.5 V
VOL Output Low Voltage(1)
(Ports 1, 3) IOL = 20 mA, VCC = 5V
IOL = 10 mA, VCC = 2.7V 0.5 V
VOH Output High Voltage
(Ports 1, 3) IOH = -80 µA, VCC = 5V ±10% 2.4 V
IOH = -30 µA0.75V
CC V
IOH = -12 µA 0.9 VCC V
IIL Logical 0 Input Current
(Ports 1, 3) VIN = 0.45V -50 µA
ITL Logical 1 to 0 Transition Current
(Ports 1, 3) VIN = 2V, VCC = 5V ±10% -750 µA
ILI Input Leakage Current
(Port P1.0, P1.1) 0 < VIN < VCC ±10 µA
VOS Comparator Input Offset Voltage VCC = 5V 20 mV
VCM Comparator Input Common
Mode Voltage 0V
CC V
RRST Reset Pulldown Resistor 50 300 KΩ
CIO Pin Capacitance Test Freq. = 1 MHz, TA= 25°C 10 pF
ICC Power Supply Current Active Mode, 12 MHz, VCC = 6V/3V 15/5.5 mA
Idle Mode, 12 MHz, VCC = 6V/3V
P1.0 & P1.1 = 0V or VCC
5/1 mA
Power Down Mode(2) VCC = 6V P1.0 & P1.1 = 0V or VCC 100 µA
VCC = 3V P1.0 & P1.1 = 0V or VCC 20 µA