JETWAY NF93 Series User manual

TECHNICAL MANUAL
Of
Intel GM45 Express Chipset
&
ICH9M Chipset
Based
Mini-ITX M/B for Penyn Processor
NO.G03-NF3-F
Rev 1.0
Release date: Feb., 2009
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.
ii

TABLE OF CONTENT
USER’S NOTICE .................................................................................................................................. iii
MANUAL REVISION INFORMATION............................................................................................ iii
ITEM CHECKLIST.............................................................................................................................. iii
CHAPTER 1 INTRODUCTION OF INTELCHIPSET MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD..............................................................................……1
1-2 SPECIFICATION.................................................................................................................. 2
1-3 LAYOUT DIAGRAM & JUMPER SETTING................................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING..............................................................................................................7
2-2 CONNECTORS AND HEADERS ....................................................................................... 10
2-2-1 CONNECTORS....................................................................................................... 10
2-2-2 HEADERS ............................................................................................................... 11
CHAPTER 3
3-1 ENTERING SETUP…………………………………………………………………………19
3-2 GETTING HELP..…………………………………………………………………………...19
3-3 THE MAIN MENU…………………………………………………………………………..19
3-4 ADVANCED BIOS FEATURES.……………………………………………………………22
3-4-1 CPU FEATURE………………………………………………………………………………25
3-5 INTERGRATED PERIPHERALS…….................................................................................25
3-5-1 INTEL DTS FEATURE………………………………………………………………………26
3-6 PC HEALTH STATUS………………………………………………………………………28
3-7 ADVANCED CHIPSET FEATURES……………………………………………………….29
3-8 POWER MANAGEMENT SETTING..………………………………………...…….……..30
3-9 PnP/PCI CONFIGURATION………………………………………………………………...32
iii

Safety Environmental Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in any
area where it may become wet.
z0 to 60 centigrade is the suitable temperature. (The figure comes from the request of the
main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact malfunction
and crackles due to constant thermal expansion and contraction from the welding spots’
that connect components and PCB. Computer should go through an adaptive phase
before it boots when it is moved from a cold environment to a warmer one to avoid
condensation phenomenon. These water drops attached on PCB or the surface of the
components can bring about phenomena as minor as computer instability resulted from
corrosion and oxidation from components and PCB or as major as short circuit that can
burn the components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer. Using the
close case may decrease the life of other device because the higher temperature in the
inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may decrease
the life of the device and burned the capacitor.
iv

v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE INTEL GM45 CHIPSET
MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL
CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIALORCONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF
BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition February, 2009
Item Checklist
5Motherboard
5Cable(s)
5CD for motherboard utilities
5Motherboard User’s Manual
5Back panel

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of motherboard
zIntel GM45+ICH9M chipset.
zPenyn CPU, with low power consumption never denies high performance.
zSupport FSB 1066MHz
zSupport two DDRII SODIMM 800/667MHz up to 4 GB.
zOnboard two REALTEK RTL 8111C Gigabit Ethernet LAN.
zIntegrated ALC888 6-channel HD audio CODEC.
zSupport USB2.0 data transport demands.
zSupport RS422/485 and watchdog.
zSupport GPIO function.

2
1-2 Specification
Spec Description
Design ∗Mini ITX form factor 8 layers PCB size: 17.0x17.0cm
Chipset ∗Intel GM45+ICH9M Chipset
CPU ∗Penyn CPU
Memory Socket
∗200-pin DDRII SO-DIMM socket x2
∗Support DDRII SODIMM 800/667 MHz system Modules DDRII
SODIMM memory
∗Expandable to 4GB.
x
Expansion Slots ∗32-bit PCI slot x 1pcs
∗Mini PCI-E x1pcs
Integrate IDE ∗One PCI IDE controller that supports PCI Bus Mastering, ATA
PIO/DMA and the ULTRA DMA 100/66 functions that deliver
the data transfer rate up to 100 MB/s.
LAN
∗Integrated two Realtek RTL8111C PCI-E Gigabit LAN.
∗Support Fast Ethernet LAN function of providing
10Mb/100Mb/1000Mb Ethernet data transfer rate
Audio ∗ALC888 6 channel Audio Codec integrated
∗Audio driver and utility included
BIOS ∗Award 8MB Flash DIP ROM
Multi I/O ∗Hard disk drive connector x1
∗SATAII x4
∗USB2.0 port x 4 and headers x6
∗RJ45 LAN connector x2
∗Audio connector x1 (Line-in, Line-out, MIC,SPDIF_OUT)
∗COM connector x 2
∗COM Header x2

∗LVDS Connector x1
∗VGA Connector x1
∗DVI-D Connector x1
∗TV OUT x1
∗HDMI Connector x1
1-3 Layout Diagram & Jumper Setting
DVI-D
Connector
3
COM
nnector
Co
RJ45 LAN
RJ45 LAN
Line-Out
Line-In/
SPDIF Out
MIC-IN
HDMI
Connector VGA Connector USB Connector USB Connector COM Connector

Inverter Connector
4
ATX Power Connector
HDMI Connector
Intel Penyn
VGA & DVI-D
Connector
SYS FAN1
TV OUT Connector
Intel GM45 Chipset
Intel ICH9M Chipset
DDRII
SO-DIMM
CPU FAN
USB Connector
IDE Connecto
r
Speaker connecto
r
USB Connector
SATAII Connector (1,2)
COM Connector
Mini PCI-E Slot
Audio Connector Front Panel Connector
PCI Slot
GPIO Connector
Front Panel Audio
SYS FAN2
SATAII Connector 3，4)
COM Connector

ALC 888
RealtekRTL8111C
Gi
g
abit Lan
RealtekRTL8111C
Gi
g
abit Lan
DDRII
SO-DIMM
5