JETWAY R3288LC-2N Series User manual

R3288LC-2N Series
User’s Manual
P/N: G03-R3288LC-F
Revision: 2.0
Release date: October 1, 2019
Notice:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST .....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 PRODUCT DIAGRAM.................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 REAR I/O CONNECTORS ..........................................................................................6
2-2 INTERNAL CONNECTORS, HEADERS AND JUMPERS.........................................7
TABLE OF CONTENT

iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES ANDWE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
2.0 Second Edition October 1, 2019
Item Checklist
Motherboard

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Rockchip® ARM Cortex A17 RK3288 Quad-core 1.8GHz
Onboard 2GB DDR3L 1333MHz DRAM
Onboard 8G Flash ROM (Max.64GB)
1 * Realtek GbE LAN
1*RS232, 2*UART,1*Debug
Support 6* USB2.0
Support 1* OTG (Co-lay with USB2.0)
1* HDMI, 1*eDP, 1* 24-bit Dual CH LVDS,1*MIPI DSI, 1*MIPI CSI
1 * Micro SD (TF) Card socket
Support 802.11 b/g/n 2.4G, BT-V4.0
Support Android 5.1 and Debian9.0 OS

2
1-2 Specification
Spec
Description
Size
120 * 72mm
CPU
Rockchip® ARM Cortex A17 RK3288 1.8GHz SoC
* for detailed CPU support information please visit our website.
PMU
Rockchip®RK808-B PMU
Memory
Onboard 2GB DDR3L 1333MHz DRAM
Expansion
1* Micro SD (TF) Card Socket (Max 64GB)
Storage
Onboard 8GB EMMC Flash ROM (Max. 64GB)
Network
1* Realtek RTL8211E-VB Gigabit LAN (Support Fast Ethernet LAN
function of providing 10/100/1000Mbps Ethernet data transfer rate)
1* Realtek RTL8723BS WIFI & Bluetooth module for 802.11b/g/n
2.4G WIFI &BT-V4.0
Rear I/O
1* 12V DC-IN Power Jack
2* USB 2.0 port (1 co-lay USB OTG function via Jumper select)
1* HDMI port
1* Audio (Line-out & MIC Combo)
1* RJ-45 port
1* Micro SD (TF) Card Socket (bottom)
Internal I/O
1* IR connector
1* Power switch/Recover/Reset connector
4* USB 2.0 connector
3* UART connector + 1* Debug connector
1* Speaker connector (3W amplifier)
1* MIPI DSI
1* MIPI CSI
1* 4-bit GPIO & I2C combo header block
1* eDP header
1* LVDS header &1* Inverter
1* EDP _VCC jumper &1* LVDS_VCC jumper
1* Backlight_PWR jumper
1*OTG/HOST select jumper

3
1-3 Product Diagram
Top View:
CPU
DRAM
DRAM
DRAM
DRAM
DSI: MIPI DSI
Wi-Fi & Bluetooth
Chip
CON38: MIPI CSI
CON33:
Power Switch/
Reset/ Recover
DCIN:
12V DC-In
Power Jack
HUB_USB2:
USB 2.0 Port
OTG:
OTG/ USB 2.0
Port
J3:
HDMI Port
ADUIO:
Line-out/MIC
Port
LAN:
RJ-45 LAN Port
CON1:
EDP
CON36:
UART/RS232/485
(Default: UART TTL)
CON39:
UART TTL
CON37:
RS232/UART TTL
(Default:RS232)
CON47:
Debug
INVERTER:
LVDS Inverter
GPIO:
GPIO & I2C
Header
HUB_USB3/ HUB_USB1/
HUB_USB4/HOST_USB:
4*USB 2.0
CON3:
LVDS
OTG_JP (Jumper):
USB/OTG Select
CON2 (Jumper):
EDP_VCC Select
CON44:
Speaker
CON25 (Jumper):
LVDS_VCC Select
CON31(Jumper):
Backlight_PWR VCC Select
CON6:
IR

4
Bottom View:
Rear Connectors:
P/N
Name
DCIN
12V DC–in Power Jack
HUB_USB2
USB 2.0 Port
OTG
USB 2.0 & OTG Port
J3
HDMI Port Connector
AUDIO
Audio Line-out & MIC Combo Jack
TF (Bottom)
Micro-SD (TF) Card Socket
LAN
RJ-45 LAN Port Connector
EMMC
J1:Micro_SD(TF)
Card Socket

5
Internal Connector, Headers & Jumpers:
P/N
Name
Description
CON6
IR Connector
3-pin Block
CON 33
Power Switch/Recovery/ Reset
Connector
4-pin Block
HUB_USB3/HUB_USB1/
HUB_USB4/HOST_USB
USB 2.0 Connector
4-pin Block
CON36
UART TTL/ RS232/ RS485 Connector
4-pin Block
CON39
UART TTL Connector
4-pin Block
CON37
RS232/UART TTL Connector
4-pin Block
CON47
Debug Connector
4-pin Block
CON44
3W Speaker Connector
4-pin Block
CON38
MIPI CSI Connector
15-pin Block
DSI
MIPI DSI Connector
15-pin Block
GPIO
GPIO & I2C Combo Header
10-pin Block
CON1
EDP Header
20-pin Block
CON3
LVDS Header
30-pin Block
INVERTER
LVDS Inverter
6-pin Block
CON2
EDP LCD_VCC Select Jumper
6-pin Block
CON25
LVDS LCD_VCC Select Jumper
6-pin Block
CON31
Backlight_PWR VCC Select Jumper
3-pin Block
OTG_JP
OSB/ OTG Select Jumper
4-pin Block