KEPCO RA 19-8B User manual

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IMPORTANT NOTES:
1) This manual is valid for the following Model and associated serial numbers:
MODEL SERIAL NO. REV. NO.
2) A Change Page may be included at the end of the manual. All applicable changes and
revision number changes are documented with reference to the equipment serial num-
bers. Before using this Instruction Manual, check your equipment serial number to identify
your model. If in doubt, contact your nearest Kepco Representative, or the Kepco Docu-
mentation Office in New York, [phone], requesting the correct revision for your par-
ticular model and serial number.
3) The contents of this manual are protected by copyright. Reproduction of any part can be
made only with the specific written permission of Kepco, Inc.
Data subject to change without notice.
KEPCO®
THE POWER SUPPLIER™
MODEL
INSTRUCTION MANUAL
ORDER NO. REV. NO.
KEPCO, INC. 131-38 SANFORD AVENUE FLUSHING, NY. 11355 U.S.A. TEL [phone] FAX [phone]
email: [e-mail] World Wide Web: http://www.kepcopower.com
KEPCO INC.
An ISO 9001 Company.
©2009, KEPCO, INC
P/N 243-0890R1c
RA 19-8B
RACK ADAPTER
HOT SWAP RACK ADAPTER FOR HSF SERIES POWER SUPPLIES
RA 19-8B
RACK ADAPTER
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iRA 19-8B 011409
TABLE OF CONTENTS
SECTION PAGE
SECTION 1 - INTRODUCTION
1.1 Scope of Manual..................................................................................................................................... 1-1
1.2 General Description ................................................................................................................................ 1-1
1.3 Electrical ................................................................................................................................................. 1-1
1.4 Mechanical.............................................................................................................................................. 1-2
1.5 Accessories ............................................................................................................................................ 1-2
1.6 Options ................................................................................................................................................... 1-2
SECTION 2 - INSTALLATION
2.1 Unpacking and Inspection ...................................................................................................................... 2-1
2.2 Configuring the Rack Adapter................................................................................................................. 2-1
2.3 Rack Adapter Keying Instructions........................................................................................................... 2-1
2.3.1 Disassembly to Gain Access to Interior Components....................................................................... 2-1
2.3.2 Establishing Key Positions................................................................................................................ 2-2
2.4 Slot Configuration ................................................................................................................................... 2-2
2.4.1 Independent Operation ..................................................................................................................... 2-4
2.4.1.1 Independent Operation - Local Sensing Using Internal DIP Switches ........................................ 2-5
2.4.1.2 Independent Operation - Local Sensing Using External WIRING ............................................... 2-6
2.4.1.3 Independent Operation - Remote Sensing.................................................................................. 2-7
2.4.2 Parallel Operation ............................................................................................................................. 2-8
2.4.2.1 Parallel DC OUTPUT Connections ............................................................................................. 2-8
2.4.2.2 Parallel Current Share Connections............................................................................................ 2-8
2.4.2.2.1 Parallel Current Share - Internal DIP Switches ...................................................................... 2-8
2.4.2.2.2 Parallel Current Share - External Wiring ................................................................................ 2-10
2.4.2.3 Sense Connections for Parallel Configurations........................................................................... 2-11
2.4.2.3.1 Parallel Configurations Using DIP Switches to Connect Sense Lines in
Parallel and External Wires to Configure Local Sensing ..................................................... 2-12
2.4.2.3.2 Parallel Configurations Using External Wires to Connect Sense Lines
in Parallel and External Wires to Configure Local Sensing.................................................. 2-13
2.4.2.3.3 Parallel Configurations Using DIP Switches to Connect Sense Lines in
Parallel and External Wires to Configure Remote Sensing ................................................. 2-14
2.4.2.3.4 Parallel Configurations Using External Wires to Connect Sense Lines
in Parallel and External Wires to Configure Remote Sensing.............................................. 2-15
2.4.3 Series Operation ............................................................................................................................... 2-16
2.4.4 Alarm Configurations ........................................................................................................................ 2-17
2.4.4.1 N.O. Alarm Line (Close on Failure) ............................................................................................. 2-17
2.4.4.1.1 Close on Failure Using Internal DIP Switches........................................................................ 2-17
2.4.4.1.2 Close on Failure Using External Wiring at I/O Mating Connector........................................... 2-17
2.4.4.2 N.C. Alarm Line (Open on Failure).............................................................................................. 2-20
2.4.4.2.1 Open on Failure Using Internal DIP Switches ........................................................................ 2-20
2.4.4.2.2 Open on Failure Using External Wiring of I/O Connector....................................................... 2-20
2.5 Terminations ........................................................................................................................................... 2-22
2.6 Cooling.................................................................................................................................................... 2-23
2.7 Installation............................................................................................................................................... 2-23
2.8 Wiring Instructions .................................................................................................................................. 2-23
2.8.1 Safety Grounding .............................................................................................................................. 2-23
2.8.2 Source Power Connections .............................................................................................................. 2-23
2.8.3 Control Signal Connections .............................................................................................................. 2-24
2.8.4 Output Load Connections ................................................................................................................. 2-24
2.8.4.1 Parallel/Redundant Operation..................................................................................................... 2-25
2.8.4.2 Series/Independent Operation .................................................................................................... 2-25
2.8.4.3 Mixed Operation.......................................................................................................................... 2-25
2.9 Installing HSF Power Supplies ............................................................................................................... 2-25
2.10 Shipping.................................................................................................................................................. 2-26
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LIST OF FIGURES
FIGURE TITLE PAGE
RA 19-8B 011409 ii
1-1 RA 19-8B Rack Adapter............................................................................................................................. iii
1-2 RA 19-8B Rack Adapter with HSF Power Supplies Installed...................................................................... 1-1
1-3 RA 19-8B Interconnections, Simplified Diagram......................................................................................... 1-2
1-4 RA 19-8B Rack Adapter Rear Panel........................................................................................................... 1-3
1-5 Mechanical Outline Drawing, RA 19-8B Rack Adapter............................................................................... 1-4
2-1 Backplate Assembly, Interior View.............................................................................................................. 2-2
2-2 Independent Operation, Local Sensing for PS7 and PS8, using Internal
DIP Switches, Simplified Diagram........................................................................................................... 2-5
2-3 Independent Operation, Local Sensing for PS7 and PS8 using
External Jumpers at Mating I/O Connector, Simplified Diagram ............................................................. 2-6
2-4 Independent Operation, Remote Sensing for PS7 and PS8 using
External Wiring at I/O Mating Connector, Simplified Diagram................................................................. 2-7
2-5 Parallel Outputs Using Internal DIP Switchesto Parallel sense lines and
current share, PS5, PS6, PS7 and PS8 (Typical), Simplified Diagram .................................................. 2-9
2-6 Parallel Outputs Using External Wiring, Typical Configuration, Simplified Diagram ................................... 2-10
2-7 Typical Parallel Connections, using External Wires for
Local Sensing and DIP switches to Parallel Sense Wires....................................................................... 2-12
2-8 Typical Parallel Connections using External Wires for Local Sensing
and I/O Mating Connector Jumpers to Parallel sense wires .................................................................... 2-13
2-9 Typical Parallel Connections, Remote Sensing using DIP
Switches to Parallel Sense Wires............................................................................................................ 2-14
2-10 Typical Parallel Connections, Remote Sensing using I/O Mating
Connector Jumpers to Parallel Sense Wires........................................................................................... 2-15
2-11 Series Configuration, Simplified Diagram ................................................................................................... 2-16
2-12 Close on Failure Alarm Configuration Using Internal DIP Switches, Simplified Diagram ........................... 2-18
2-13 Close on Failure Alarm Configuration Using External Wiring at I/O Connector, Simplified Diagram .......... 2-19
2-14 Open on Failure Alarm Configuration Using Internal DIP Switches, Simplified Diagram............................ 2-21
2-15 Open on Failure Alarm Configuration Using External Wiring at I/O Connector, Simplified Diagram .......... 2-22
1-1 Rack Adapter Options .................................................................................................................................1-3
1-2 RA 19-8B Accessories ................................................................................................................................1-3
2-1 Equipment Supplied ....................................................................................................................................2-1
2-2 Configuration DIP Switch Functions ...........................................................................................................2-3
LIST OF TABLES
TABLE TITLE PAGE
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iii RA 19-8B 011409
FIGURE 1-1. RA 19-8B RACK ADAPTER
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RA 19-8B 011409 1-1
SECTION 1 - INTRODUCTION
1.1 SCOPE OF MANUAL
This manual contains instructions for the installation and operation of the RA 19-8B plug-in rack
adapter (Figure 1-1) used with HSF Series power supplies, manufactured by Kepco, Inc., Flush-
ing, New York, U.S.A.
FIGURE 1-1.
1.2 GENERAL DESCRIPTION
Kepco Series RA 19-(X)B rack adapters are specifically designed for the installation of Kepco
HSF Series Power Supplies into 19-inch EIA standard equipment racks. The RA 19-8B Model
accommodates up to eight 50 Watt or 100 Watt (1/8 rack) HSF power supplies (Figure 1-2).
NOTE: It is also possible to use 150 Watt (1/6 rack) modules in 1/8 rack slots; contact Kepco
Applications Engineering for assistance with non-standard configurations.
The rack adapter is user-configurable for parallel, series, or independent power supply opera-
tion. Forced current sharing and OR’ing diodes for N+1 redundancy are built in to the HSF
power supplies. User-configurable keying ensures that only the correct power supply can be
installed in a keyed slot.
FIGURE 1-2. RA 19-8B RACK ADAPTER WITH HSF POWER SUPPLIES INSTALLED
1.3 ELECTRICAL
An internal PCB back plate mounts connectors which interface directly with the power and sig-
nal connectors of HSF Series power supplies, permitting hot swappable insertion and extrac-
tion. The other side of the back plate assembly, available from the rear, contains the fixed power
and signal connections. Figure 1-3 illustrates the interconnections provided by the RA 19-8B
Rack Adapter. Dual input terminal blocks on the back plate assembly (Figure 1-4) distribute
input power to each group of four powers supplies.
All mechanical and electrical specifications are contained in the mechanical outline drawing:
Figure 1-5
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1-2 RA 19-8B 011409
FIGURE 1-3. RA 19-8B INTERCONNECTIONS, SIMPLIFIED DIAGRAM
1.4 MECHANICAL
The rack adapter is equipped with mounting ears for mounting in EIA standard 19-inch racks.
For mounting in non-standard racks, consult Kepco Applications Engineering. The rack adapter
is not configured for slides. Optional blank filler panels (see Table 1-2) are available if the full
complement of power supplies is not utilized.
Mechanical dimensions, material, and finish of the RA 19-8B Rack Adapter is provided in Figure
1-5.
1.5 ACCESSORIES
Accessories for RA 19-8B Rack Adapters are listed in Table 1-2.
1.6 OPTIONS
Table 1-1 below describes the standard model options available with Series RA 19-(X)B rack
adapters. For non-standard options, contact Kepco Applications Engineering for assistance.
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RA 19-8B 011409 1-3
FIGURE 1-4. RA 19-8B RACK ADAPTER REAR PANEL
TABLE 1-1. RACK ADAPTER OPTIONS
MODEL
1/8 Rack Slots 1/6 Rack Slots
Tota l Compatible HSF Models Tot al Compatible HSF Models
50 Watt 100 Watt 150 Watts
RA 19-6B * 6
(max)
HSF5-30, HSF12-12,
HSF15-10, HSF24-6,
HSF28-5, HSF48-2.8
RA 19-7B
(see PAR. 1.2)
6
(max)
HSF5-10, HSF12-4.2,
HSF15-3.4, HSF24-2.1,
HSF48-1
HSF5-20, HSF12-8.3,
HSF15-6.6, HSF24-4.2,
HSF28-3.5, HSF48-2
4
(max)
HSF5-30, HSF12-12,
HSF15-10, HSF24-6,
HSF28-5, HSF48-2.8
RA 19-8B 8
(max)
HSF5-10, HSF12-4.2,
HSF15-3.4, HSF24-2.1,
HSF48-1
HSF5-20, HSF12-8.3,
HSF15-6.6, HSF24-4.2,
HSF28-3.5, HSF48-2
*
* Contact Kepco Applications Engineering for assistance with non-standard configurations.
TABLE 1-2. RA 19-8B ACCESSORIES
ACCESSORY PART NUMBER USE
Filler Panel (1/8 Rack) RFP 19-18 Cover unused 1/8 rack slots.
Filler Panel (2/8 Rack) RFP 19-28 Cover unused 1/4 rack slots.
Filler Panel (3/8 Rack) RFP 19-38 Cover unused 3/8 rack slots
Filler Panel (4/8 Rack) RFP 19-48 Cover unused 1/2 rack slots
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1-4 RA 19-8B 011409
FIGURE 1-5. MECHANICAL OUTLINE DRAWING, RA 19-8B RACK ADAPTER
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RA 19-8B 011409 2-1
SECTION 2 - INSTALLATION
2.1 UNPACKING AND INSPECTION
This equipment has been thoroughly inspected and tested prior to packing and is ready for
operation. After careful unpacking, inspect for shipping damage before attempting to operate. If
any indication of damage is found, file an immediate claim with the responsible transport ser-
vice. See Table 2-1 for a list of equipment supplied.
2.2 CONFIGURING THE RACK ADAPTER
Prior to installation the rack adapter must be configured by the user. Configuration consists of
the following:
• For configurations that use multiple output voltages it is possible to key the rack adapter
to accept only a power supply with corresponding keying (see PAR 2.3).
• Configuring slots for independent, parallel, or series operation. This can be done by
means of internal DIP switches, or externally by wiring the associated I/O mating con-
nector and DC OUTPUT terminals (see PAR. 2.4).
2.3 RACK ADAPTER KEYING INSTRUCTIONS
Series RA 19-(X)B rack adapters incorporate a keying mechanism to prevent accidental inser-
tion of the incorrect model HSF power supply into any position. The HSF power supplies are
keyed by voltage at the factory. The keying mechanism will prevent engagement of any of the
HSF power supply's connectors with those on the rack adapter's back plate unless the key and
keyway align. The user can configure each power supply position of the rack adapter for the
desired voltage in the desired position (see Figure 2-1). First gain access to the interior compo-
nents (PAR.2.3.1), then position the key as required (PAR. 2.3.2).
NOTE: After removing the rear panel, the keying pins can be accessed through the front of the
rack adapter, although it is recommended that the back plate be removed to gain easy
access to interior components.
2.3.1 DISASSEMBLY TO GAIN ACCESS TO INTERIOR COMPONENTS
NOTE: All power supplies must be removed prior to disassembly.
1. Remove eight spacers securing the four I/O connectors to the rear panel
TABLE 2-1. EQUIPMENT SUPPLIED
ITEM QUANTITY PART NUMBER
Rack Adapter 1 RA 19-8B
I/O Connector (Mating) 4 142-0449
Line cord (115 V a-c, 15A max, North American style plug, 6 ft) 2 118-0506
Instruction Manual 1 243-0890
Keying pins 8 108-0305
Hood for I/O Connector (Mating) P/N 142-0449 4 108-0204
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2-2 RA 19-8B 011409
2. Remove the four screws (two at the top and two at the bottom) securing the rear panel to the
chassis and separate the rear panel from the chassis (it is not necessary to remove the
ground connection (if present) between the rear panel and the chassis).
3. Remove seven screws (three at the top and four at the bottom) securing the back plate to the
chassis and remove the back plate to gain access to the interior components (see Figure 2-1)
FIGURE 2-1. BACKPLATE ASSEMBLY, INTERIOR VIEW
2.3.2 ESTABLISHING KEY POSITIONS
To establish the keying of any position, simply insert the key pin from the front and secure with
mounting nut at the back plate using two ¼" nutdrivers or deep sockets. HSF module keying is
identified in Figure 2-1 and in the HSF operator's manual. DO NOT ALTER THE KEYING AT
THE POWER SUPPLY.
2.4 SLOT CONFIGURATION
Configuring slots of the rack adapter for independent, parallel or series operation is accom-
plished either internally by means of DIP switches associated with each slot (see Figure 2-1),
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RA 19-8B 011409 2-3
or externally by connecting the appropriate pins of the associated I/O mating connector. DIP
switch functions are explained in Table 2-2. Refer to PAR. 2.3.1 to gain access to the DIP
switches.
Slot configuration requires the following selection:
1. Select independent (PAR. 2.4.1) parallel (PAR. 2.4.2), series (PAR. 2.4.2) operation.
2. Select local or remote sensing: PAR. 2.4.1 (independent), 2.4.2 (parallel), or 2.4.2 (series).
3. Optional: Select close-on-failure or open-on-failure alarm (PAR. 2.4.3).
TABLE 2-2. CONFIGURATION DIP SWITCH FUNCTIONS
DIP
SWITCH
POSITION*
FUNCTION DIP SWITCH SET TO ON (CLOSED) DIP SWITCH SET TO OFF (OPEN)
NOTES: 1. BOLD TYPE INDICATES FACTORY SETTINGS.
2. For DIP switch A1, only positions 1 and 2 are active; all other positions are not connected.
3, 4
Connect
Sense
+ and –
in parallel
Required ON for parallel configurations using DIP
switch settings to connect the sense leads in par-
allel. Position 3 connects +S to adjacent slot +S,
Position 4 connects –S to adjacent slot –S (see
PAR. 2.4.2.3.1 for local sensing, PAR. 2.4.2.3.3 for
remote sensing).
Position 3 and 4 required OFF for all configu-
rations except parallel configurations using
DIP switch settings to connect the sense
leads in parallel.
5Current
Share
Required ON for parallel operation with forced cur-
rent sharing (connects current share lines in paral-
lel) unless connections are made via external
wires (see PAR. 2.4.2.2.1)
Required OFF for
a) independent and series configurations.
b) Parallel configurations with forced current
sharing using external wires to connect cur-
rent share lines in parallel.
c. Parallel configurations without forced cur-
rent sharing (current balancing).
6, 7
Close on
Failure
Alarm
When set to ON, allows a single alarm to provide
failure indication (contact closure between N.O.
pin and COM pin) if any one of many power sup-
plies fails (see PAR. 2.4.4.1).
When set to OFF, individual power supplies
produce closure between I/O connector N.O.
and COM pins upon failure (see PAR. 2.4.4.1).
7, 8
Open on
Failure
Alarm
When set to ON, allows a single alarm to provide
failure indication (contact open between N.C. pin
and COM pin) if any one of many power supplies
fails. Position 7 of DIP switch 2 is used for COM
pin connection between slots 1 and 2.(see PAR.
2.4.4.2).
When set to OFF, individual power supplies
produce open between I/O connector N.C. and
COM pins upon failure.
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2-4 RA 19-8B 011409
2.4.1 INDEPENDENT OPERATION
The rack adapter is preconfigured at the factory for independent operation of all slots. DIP
switch positions 3, 4 and 5 associated with each slot must be set to OFF (open) for
each power supply to be operated independently.
NOTE: Either local or remote sensing must be connected for the HSF power supplies to
work properly.
The rack adapter is shipped from the factory with each power supply position configured for
local sensing (see Figure 2-2). Sensing for each slot can be configured independently:
• Local sensing using internal DIP switches
• Local sensing using external jumpers connected to the I/O mating connector or the DC
OUTPUT terminal block.
• Remote sensing
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RA 19-8B 011409 2-5
2.4.1.1 INDEPENDENT OPERATION - LOCAL SENSING USING INTERNAL DIP SWITCHES
The rack adapter slots are preconfigured at the factory for local sensing using internal DIP
switches. If a slot has been configured for other than local sensing using DIP switches and it is
necessary to reconfigure a slot for local sensing, simply set positions 1 and 2 of the DIP switch
associated with that slot to ON (closed). External sensing connections must be removed. When
set to ON (closed) DIP switch position 1 connects (V+) to (S+) and position 2 connects (V–) to
(S–). See Figure 2-1 for DIP switch locations. Figure 2-2 illustrates local sensing of PS7 and
PS8 by setting positions 1 and 2 of internal DIP switches E7 and F8 to ON (closed); positions 3
and 4 must be set to OFF (open). Position 5 (current share) must be set to OFF and positions 6,
7, and 8 (alarms) can be configured per PAR. 2.4.4.
FIGURE 2-2. INDEPENDENT OPERATION, LOCAL SENSING FOR PS7 AND PS8, USING INTERNAL
DIP SWITCHES, SIMPLIFIED DIAGRAM
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2-6 RA 19-8B 011409
2.4.1.2 INDEPENDENT OPERATION - LOCAL SENSING USING EXTERNAL WIRING
To configure a slot for local sensing using external wiring, first set internal DIP switch positions 1
and 2 of the DIP switches associated with that slot to OFF (open).
External local sensing is accomplished by connecting (V+) to (S+) and (V–) to (S–). This can be
done at either the mating I/O connector supplied (see Table 2-1) or the DC OUTPUT terminal
block. See Figure 2-1 for DIP socket locations. Figure 1-3 illustrates I/O connector pin assign-
ments. Figure 2-3 illustrates local sensing of PS7 and PS8 using external jumpers connected to
the I/O mating connector.
NOTE: The internal DIP switch settings established at the factory for positions 1 and 2 of the
associated DIP switch MUST be changed to OFF (open) if local sensing using external
wiring is chosen.
Positions 3 and 4 (connecting sense lines in parallel) and Position 5 (current share) must be set
to OFF. Configure Positions 6, 7, and 8 (alarms) per PAR. 2.4.4.
FIGURE 2-3. INDEPENDENT OPERATION, LOCAL SENSING FOR PS7 AND PS8 USING
EXTERNAL JUMPERS AT MATING I/O CONNECTOR, SIMPLIFIED DIAGRAM
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RA 19-8B 011409 2-7
2.4.1.3 INDEPENDENT OPERATION - REMOTE SENSING
Remote sensing is accomplished by connecting +Load to (S+) and –Load to (S–). Figure 2-4
illustrates remote sensing for PS7 and PS8 using wires connected to the I/O mating connector.
NOTE: The internal DIP switch settings established at the factory for positions 1 and 2 of the
associated DIP switch MUST be changed to OFF (open) if remote sensing is chosen.
Positions 3 and 4 (connecting sense lines in parallel) and Position 5 (current share) must be set
to OFF. Configure Positions 6, 7, and 8 (alarms) per PAR. 2.4.4.
FIGURE 2-4. INDEPENDENT OPERATION, REMOTE SENSING FOR PS7 AND PS8 USING
EXTERNAL WIRING AT I/O MATING CONNECTOR, SIMPLIFIED DIAGRAM
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2-8 RA 19-8B 011409
2.4.2 PARALLEL OPERATION
HSF power supplies having identical voltage ratings can be connected in parallel to provide
redundant operation or increased output current to a common load. The power leads must be
connected in parallel externally (see PAR. 2.8.4.1). (Configurations using internal parallel busing
of the power leads are also possible; consult Kepco’s Applications Engineering for details.)
Three things must be considered when configuring the rack adapter for parallel operation:
• DC OUTPUT
• CURRENT SHARE
• SENSE
2.4.2.1 PARALLEL DC OUTPUT CONNECTIONS
The power leads must be connected in parallel externally (see PAR. 2.8.4.1). DC Output V(+)
and V(–) must be connected in parallel at the DC OUTPUT terminal block (see Figures 2-5
through 2-10).
2.4.2.2 PARALLEL CURRENT SHARE CONNECTIONS
The Current Share pins of the HSF power supplies must be connected together for parallel
operation. This can be done either internally using the DIP switches to configure adjacent slots
in parallel (PAR 2.4.2.2.1), or externally by wiring the I/O mating connector for configuring slots
1, 4, 5, and 8 (PAR. 2.4.2.2.2).
2.4.2.2.1 PARALLEL CURRENT SHARE - INTERNAL DIP SWITCHES
To configure adjacent slots, use the internal DIP switches to connect the Current Share bus.
Using internal DIP switches permits only adjacent power supplies be connected in parallel.(e.g.,
PS1 and PS2, PS5 and PS6, PS1, PS2, and PS3, etc., PS1 and PS3 cannot be configured in
parallel using internal DIP switches). Contact Kepco Applications Engineering for non-standard
configurations using internal DIP switches.
To connect the current share lines locate DIP switches between the parallel-connected supplies
(see Figure 2-1) and set position 5 to ON (closed). Isolate the parallel group by locating the DIP
switches at both ends of the group and set positions 3 through 5 to OFF (open); refer to PAR.
2.4.2.3 for instructions on setting positons 3 and 4 for parallel connections. For example to con-
nect PS4, PS5 and PS6 in parallel, set DIP switches F8 and E7, position 5, to ON (closed) (see
Figure 2-5); set DIP switch D5, positions 1 through 5 to OFF (open) (positions 1-2 of D5 must be
OFF for parallel configurations and positions 3-5 isolate the parallel group).
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RA 19-8B 011409 2-9
FIGURE 2-5. PARALLEL OUTPUTS USING INTERNAL DIP SWITCHESTO PARALLEL SENSE LINES AND
CURRENT SHARE, PS5, PS6, PS7 AND PS8 (TYPICAL), SIMPLIFIED DIAGRAM
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2-10 RA 19-8B 011409
2.4.2.2.2 PARALLEL CURRENT SHARE - EXTERNAL WIRING
The Current Share lines for each supply must be connected in parallel at the I/O mating connec-
tor (pin 4) using external wiring (see Figure 2-6). Figure 2-6 is a simplified diagram of a typical
parallel configuration using external wiring at the I/O mating connector. Only slots 1, 4, 5, and
8 can be configured for parallel operation using external wiring. Position 5 of the associated
DIP switch must be set to OFF (open).
FIGURE 2-6. PARALLEL OUTPUTS USING EXTERNAL WIRING, TYPICAL
CONFIGURATION, SIMPLIFIED DIAGRAM
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RA 19-8B 011409 2-11
2.4.2.3 SENSE CONNECTIONS FOR PARALLEL CONFIGURATIONS
NOTE: HSF power supply sense lines MUST be connected to the respective output terminals;
otherwise the power supplies will not work.
For parallel configurations the sense lines must be connected in parallel. This can be accom-
plished either by using the DIP switches (positions 3 and 4 set to ON) or by setting the DIP
switch positions 3 and 4 to OFF and using external wires. When configuring units to work in par-
allel, the current share bus (PAR. 2.4.2.2) must also be configured.
For local sensing (at the rack adapter) connect the sense lines in parallel using either the DIP
switches or external jumpers, then connect one +S and one –S from the I/O mating connector to
the DC OUTPUT terminal block using short jumpers.
For remote sensing (at the load) connect the sense lines in parallel using either the DIP
switches or external jumpers to connect the sense lines in parallel, then connect one +S and
one –S from the I/O connector to the load using external wires.
For both local and remote sensing Positions 1 and 2 of each DIP switch in the parallel configura-
tion must be set to OFF (open); refer to Figure 2-1 to identify the DIP switch associated with a
corresponding slot.
See the following paragraphs for more details:
• PAR. 2.4.2.3.1: Parallel configurations using DIP switches to connect the sense lines in par-
allel and external wires to configure local sensing.
• PAR. 2.4.2.3.2: Parallel configurations using external wires to connect the sense lines in
parallel and external wires to configure local sensing.
• PAR. 2.4.2.3.3: Parallel configurations using DIP switches to connect the sense lines in par-
allel and external wires to configure remote sensing.
• PAR. 2.4.2.3.4: Parallel configurations using external wires to connect the sense lines in
parallel and external wires to configure remote sensing.
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