Kirisun TR850 User manual

TR850 Service Manual
Contents
1.OVERVIEW...............................................................................................................................................1
1.1. SCOPE OF MANUAL..................................................................................................................................1
1.2. SAFEY PRECAUTIONS ..............................................................................................................................1
2.PRODUCT CONTROLS AND LED INDICATOR INTRODUCTION ........................................................2
2.1. PRODUCT CONTROLS ..............................................................................................................................2
2.2. LED INDICATOR.......................................................................................................................................3
3.CIRCUIT DESCRIPTION..........................................................................................................................3
3.1. RF CIRCUIT.............................................................................................................................................3
3.1.1. Tx Circuit..................................................................................................................................................................4
3.1.2. RF PowerAmplifier Module Circuit ....................................................................................................................5
3.1.3. Rx Module Circuit...................................................................................................................................................6
3.2. GPS CIRUIT ............................................................................................................................................8
3.3. BASEBAND SECTION ................................................................................................................................9
3.3.1. Circuit Description..................................................................................................................................................9
3.3.2. Power Section.......................................................................................................................................................11
3.3.3. Audio Processing .................................................................................................................................................14
3.3.4. Ethernet Interface.................................................................................................................................................15
3.3.5. Boot Mode..............................................................................................................................................................15
3.3.6. Hardware Version Encode .................................................................................................................................16
3.3.7. Baseband Board Interface and Indicator........................................................................................................17
3.3.8. Tx Unit Interface Definition (J17)......................................................................................................................18
3.3.9. RF PowerAmplifier Module Interface (J18)...................................................................................................19
3.3.10.Rx Unit Interface Definition (J15)....................................................................................................................20
3.3.11.Front Panel Interface Definition (J19).............................................................................................................22
3.3.12.Serial Port Definition (J23)................................................................................................................................22
3.3.13.JTAG Simulator Interface Definition (J2).......................................................................................................23
3.3.14.External Interface Definition (J9).....................................................................................................................24
3.3.15.Case External Interface Definition..................................................................................................................26
4.FUNCTION AND PARAMETER SETTING.............................................................................................28
4.1. CONVENTIONAL FUNCTIONS...................................................................................................................28
4.2. PARAMETER SETTING ............................................................................................................................28
4.2.1. Parameters setting...............................................................................................................................................29
4.2.2. Install CPSp user programming software.......................................................................................................29
5.ASSEMBLY AND DISASSEMBLY INSTRUCTION ...............................................................................32
5.1. DUPLEXER ASSEMBLY............................................................................................................................32
5.2. DISASSEMBLY INSTRUCTION...................................................................................................................34
5.3. EXPLODED VIEW....................................................................................................................................36
5.4. CONNECTION.........................................................................................................................................41
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TR850 Service Manual
6.ADJUSTMENT........................................................................................................................................44
6.1. PREPARATION........................................................................................................................................44
6.2. METHOD OF MODULATION AND TEST ......................................................................................................44
6.2.1. Local OscillatorAdjustment................................................................................................................................44
6.2.2. Tx Adjustment........................................................................................................................................................45
6.2.3. Rx Adjustment.......................................................................................................................................................47
7.MAIN TECHNICAL FUNCTIONS AND SPECIFICATIONS...................................................................49
8.MAINTENANCE AND TEST EQUIPMENT............................................................................................51
9.TROUBLESHOOTING............................................................................................................................52
APPENDIX1 400-470MHZ UHF BAND SPARE PART LIST.....................................................................55
TABLE1PARTS LIST (RX MODULE SECTION) ..................................................................................................55
TABLE2PARTS LIST (TX MODULE SECTION)...................................................................................................65
TABLE3PARTS LIST (POWER AMPLIFICATION SECTION)..................................................................................72
TABLE4PARTS LIST (BASEBAND MAINBOARD)................................................................................................76
TABLE5PARTS LIST (FRONT PANEL)..............................................................................................................84
TABLE6PARTS LIST (POWER BOARD)............................................................................................................84
TABLE7PARTS LIST (ACCESSORY BOARD).....................................................................................................85
FIGURE 1RX MODULE TOP BOARD PCB VIEW...............................................................................................86
FIGURE 2RX MODULE BOTTOM BOARD PCB VIEW........................................................................................87
FIGURE 3TX MODULE TOP BOARD PCB VIEW...............................................................................................88
FIGURE 4POWER AMPLIFIER MODULE TOP BOARD PCB VIEW.......................................................................88
FIGURE 5POWER AMPLIFIER MODULE BOTTOM BOARD PCB VIEW ................................................................89
FIGURE 6BASEBAND MAINBOARD TOP BOARD PCB VIEW .............................................................................90
FIGURE 7BASEBAND MAINBOARD BOTTOM BOARD PCB VIEW.......................................................................91
FIGURE 8FRONT PANEL TOP BOARD PCB VIEW ............................................................................................92
FIGURE 9FRONT PANEL BOTTOM BOARD PCB VIEW .....................................................................................92
FIGURE 10 POWER BOARD TOP BOARD PCB VIEW........................................................................................93
FIGURE 11 ACCESSORY BOARD TOP BOARD PCB VIEW.................................................................................94
FIGURE 12ACCESSORY BOARD BOTTOM BOARD PCB VIEW..........................................................................94
FIGURE 13 RX MODULE SCHEMATIC DIAGRAM...............................................................................................95
FIGURE 14TX MODULE SCHEMATIC DIAGRAM .............................................................................................102
FIGURE 15 POWER AMPLIFIER MODULE SCHEMATIC DIAGRAM .....................................................................107
FIGURE 16 BASEBAND MAINBAORD SCHEMATIC DIAGRAM............................................................................ 110
FIGURE 17 FRONT PANEL SCHEMATIC DIAGRAM...........................................................................................125
FIGURE 18 POWER BOARD SCHEMATIC DIAGRAM ........................................................................................126
FIGURE 19ACCESSORY SCHEMATIC DIAGRAM.............................................................................................127
APPENDIX2 136-174 MHZ VHF BAND SPARE PART LIST..................................................................128
TABLE 1PART LIST(RX MODULE SECTION)..................................................................................................128
TABLE 2PART LIST(TX MODULE SECTION) ..................................................................................................145
TABLE 3PART LIST(POWER AMPLIFICATION MODULE SECTION).....................................................................151
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TR850 Service Manual
TABLE 4PART LIST(BASEBAND BOARD).......................................................................................................155
TABLE 5PART LIST(FRONT COVER).............................................................................................................163
TABLE 6PART LIST(POWER BOARD)............................................................................................................163
TABLE 7PART LIST(ACCESSORY BOARD).....................................................................................................164
FIGURE 1RX MODULE TOP BOARD POSITION MARK DIAGRAM......................................................................165
FIGURE 2RX MODULE BUTTOM BOARD POSITION MARK DIAGRAM...............................................................166
FIGURE 3TX MODULE TOP BOARD POSITION MARK DIAGRAM......................................................................167
FIGURE 4POWER AMPLIFIER MODULE TOP BOARD POSITION MARK DIAGRAM..............................................167
FIGURE 5POWER AMPLIFIER MODULE BUTTOM POSITION MARK DIAGRAM...................................................168
FIGURE 6BASEBAND MAINBOARD TOP BOARD POSITION MARK DIAGRAM....................................................169
FIGURE 7BASEBAND MAINBOARD BUTTOM BOARD POSITION MARK DIAGRAM .............................................170
FIGURE 8FRONT PANNEL TOP BOARD POSITION MARK DIAGRAM.................................................................171
FIGURE 9FRONT PANNEL BUTTOM BOARD POSITION MARK DIAGRAM..........................................................171
FIGURE 10 POWER BOARD TOP BOARD POSITION MARK DIAGRAM ..............................................................172
FIGURE 11 ACCESSORY BOARD TOP BOARD POSITION MARK DIAGRAM........................................................173
FIGURE 12ACCESSORY BUTTOM BOARD POSITION MARK DIAGRAM.............................................................173
FIGURE 13 RX MODULE SCHEMATIC DIAGRAM..............................................................................................174
FIGURE 14TX MODULE SCHEMATIC DIAGRAM .............................................................................................181
FIGURE 15 POWER AMPLIFIER MODULE SCHEMATIC DIAGRAM .....................................................................186
FIGURE 16 BASEBAND MAINBOARD SCHEMATIC DIAGRAM............................................................................189
FIGURE 17 FRONT PANNEL SCHEMETIC DIAGRAM ........................................................................................204
FIGURE 18 POWER BOARD SCHEMETIC.......................................................................................................205
FIGURE 19ACCESSORY SCHEMATIC DIAGRAM.............................................................................................206
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TR850 Service Manual
1.Overview
1.1.Scope of Manual
This manual is intended for use by trained engineers and professional technicians for the maintenance
and repair of TR850 Repeater. Data changes in this manual may occur with the improvement of
technology. To get the latest technology information, please contact us or your local distributors.
Before repairing the unit, please read this manual.
1.2.Safey Precautions
Electromagnetic Radiation
Radios generate and radiate electromagnetic energy, the security design of Kirisun radios’
electromagnetic radiation on human meets national and international standards.
Electromagnetic Interference
Installation should be in accordance with local radio regulations.
Explosive and Harmful Gases
Do not install the repeater in areas with explosive and harmful gases, such as the lower deck of the hull,
fuel or chemical storage facilities, area where the air contains chemicals or particles, dust or metal dust.
Do not install the repeater when close to the blasting area, electric blasting detonators.
Replacement Parts
When replacing any replacement part, please be aware of the model. Do not arbitrarily replace the
component that does not match with the radio.
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TR850 Service Manual
2.Product Controls and LED Indicator
Introduction
2.1.Product Controls
No. Part Name No. Part Name
1 Handle 2 Front Panel LED Indicator
3 Power Switch 4 GPS Atenna Connector
5 ACCY Connector 6 Internet Connector
7 AC Connector (with fuse) 8 Grouding Scew
9 Transmit Antenna Connector (N) 10 Fan
11 Heat Sink 12 Receive Antenna Connector (BNC)
13 DC Connector - -
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TR850 Service Manual
2.2.LED Indicator
LED Description
TX-A Indicates slot 1 is transmitting.
RX-A Indicates slot 1 is receiving.
TX-B Indicates slot 2 is transmitting.
RX-B Indicates slot 2 is receiving.
Repeater mode. When illuminated, the repeater is active. When the
repeater is inactive, the LED is off.
Analog mode. For analog or mixed signals the LED flashes when active.
The LED is off when inactive.
Digital mode. For digital or mixed signals the LED flashes when active. The
LED is off when inactive.
Alarm mode. Illuminates when there is a problem with the repeater.
Illuminates when the repeater is switched on.
3.Circuit Description
3.1.RF Circuit
The RF part is composed of transmitter module, power amplifier module and receiver module.
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TR850 Service Manual
3.1.1.Tx Circuit
Figure 3-1 Transmitter Circuit
X100
MODE1
SDATA
TXPLLCS
SCLK
TXLD
MODEIN
Q2002
IC100 SKY72310
IC306
U402
TOTXPA
MODE2
TXVCOSELECT
TXVCO1+TXVCO2
Q105
Q106
TXENABLE
Transmitter circuit includes three parts:
Two Point Modulation Circuit
The RF center frequency calibration from the baseband and the low frequency part of 4FSK signal will
be processed with addition algorithm, then sent to the DAC to get MODE1 signal. The MODE1 directly
enters the reference clock X100, which is used for center frequency control and low frequency modulation.
The MODE2 signal, which passes the two-level low pass filter which is composed of IC301s for DAC
sampling interference filter, will be sent into VCO for high frequency part modulation.
Transmitter Frequency Generation Unit Circuit
The transmitter PLL includes two VCOs,one PLL(IC100) IC SKY72310 and reference clock X100. The
transmitting frequencies of the two VCOs controlled by the TXVCOSELECT signal are 400~435MHz and
435~470MHz respectively.(VHF is 136~155MHz and 155~174MHz)
a.Working Principle of Voltage Controlled Oscillator
The Tx Module employs two VCOs which cover the band of 400~435MHz and 435~470MHz (VHF is
136~155MHz and 155~174MHz). The switch of VCO is controlled by the TXVCOSELECT signal. VCO
employs three point capacitance oscillation circuit. The VCO that covers the band of 400~435MHz (VHF is
136~155MHz) is composed of D106~D109、L119、Q106 and some other components, while the VCO
covers the band of 435~470MHz (VHF is 155~174MHz) is composed of D101~D104、L107、Q105 and
some other components.
b.Working Principle of Frequency Generation Unit
The 12.8 MHz reference clock (X100) output signal which is controlled by MODE1 signal will enter the
reference input port of PLL IC (IC100 SKY72310), then according to the configuration of register, it will be
divided to get 3.2MHz reference frequency, and the frequency will be compared in phase difference with
the signal generated by the frequency division which is resulted from the VCO’s enter into the input port of
PLL chip. The PLL (IC100 SKY72310) PD pin will output the positive or negative pulse current which is in
output pulse width, is directly proportional to the aforementioned signal phase difference. When the pulse
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TR850 Service Manual
current passes the loop filter, it will be converted to CV voltage via RC integral. The the CV voltage will be
sent to the VCO varactor to adjust and control the output frequency from the VCO until the CV voltage
becomes constant. The loop is locked in the meantime.
Buffer Amplifier Circuit
VCO outputs the modulated carrier signal to enter Q2002 for buffer amplication and then passes the LPF
U402 to eliminate the harmonic wave. After that, the signal will go into IC306 for pre-amplification, then
passes the LPF to filter the harmonic wave again, and the signal is output to the SMA connector which is
connected to the transmitting power amplification.
3.1.2.RF Power Amplifier Module Circuit
Figure 3-2 RF power amplification module
D103
SWR-R
IC100
POWERCONTROL
IC101
DS18B20
RFOUT
SWR-T
Q102
RF IN
U100
D104
The power amplifier module will amplify the modulated carrier signal from the transmitter module to a
certain power level, then send to the transmitter port.
The power amplifier module includes the three parts:
PowerAmplification Part
The modulated carrier from the transmitter module will enter Q102 for pre-amplification, then the signal
will attenuate to a certain level to make the amplitude of the signal which will be input with U100 operates
between 17~20dBm. Under the control of POWERCONTROL signal, the RF signal output from U100 will
pass the LPF to suppress the harmonic wave and collect power stationary wave sample from the
directional coupler before being sent to the antenna port.
APC and Stationary Wave Protection Circuit
The directional coupler detects the forward and reverse directions RF signal and passes the Q103,Q104
to convert the signal to the DC voltage which is corresponding to the forwardand reverse direction power.
After the voltage division, the forward direction DC voltage with the reverse direction voltage pass the
selection switch which is composed of D201,D202 and enter IC100(NJM2904) for buffer amplification
before being sent to the reverse phase input port of the operational amplifier of IC100(NJM2904). The
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TR850 Service Manual
POWERCONTROL control signal form the baseband will be sent to the identical phase input port of
IC100(NJM2904)’s operational amplifier. After the operational amplification and external circuit’s function
calculation, the signal is output as a conrol signal which controls the U100 gain control port to ensure that
the actual output power remains stable when the impedance matches and to decrease the output power
for power amplifier protection when the impedance mismatches.
Temperature Detection Circuit
The continuous temperature rise can lead to a decrease of transmitting power. The temperature detection
employs IC101(DS18B20) to collect the digital temperature sample.When the temperature exceeds the
threshold value, the fan will be switched on for heat dissipation.
3.1.3.Rx Module Circuit
Figure 3-3 Receiver Module
IC6003
FS
DATAOUTB
CLK
DATAOUTA
IC6001
AD9864SYNCB
IC1000
Q1009/1011
U5002
Q2002
PD
PC
PE
PLL
PLL CONFIG
12.8MHz
BPF ADJUST
IC3000
L3006/8/9
L3000/1/2 Z3001 IC3005
L3010/11/12 Z3000 Q3001/2
U4000 AD9864
2rd LO 18MHz CLOCK
IC3003
RXVCOSELECT
Receiver Circuit
The receiver circuit includes RF Band pass filter, Low-noise amplifier, mixer, IF filter, IF amplifier and IF
processor.
The signal from the receiving port first passes the low pass filter to suppress the high frequency
interference, and passes the electrical tuning BPF to suppress the image interference and the out-band
interference.The in-band signal is sent to the low noise amplifier (IC3000) and the amplified signal passes
the electrical tuning BPF controlled by BPFADJUST to filter the out-band interference, so the effective high
frequency will be sent to the mixer(IC3005). Meanwhile, the first local oscillation passes the LPF and gets
mixed with the effective signal in IC3005 to generate the first IF signal (51.65MHz). The first IF signal
passes the crystal filter (Z3001) to suppress the out-band signal. The signal is then sent to IF amplifier
(IC6003) for amplification before being sent to the crystal filter to strenghthen the suppression of the the
adjacent channel. After being sent to the limiting amplifier composed of Q3001 and Q3002, the signal
enters AD9864 (U4000) for the second frequency mixing ,IF amplification and AD sampling. The digital IQ
signal will be finally output to the baseband for further processing.
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