Kontron mITX-APL User manual


USER GUIDE
mITX-APL
Doc. Rev. 1.2
Doc-ID: 1061-1200

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mITX-APL Rev. 1.2

MITX
-APL – USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this manual may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the manual or any product characteristics
set out in the manual. Kontron assumes no responsibility or liability for the use of the described product(s), conveys
no license or title under any patent, copyright or mask work rights to these products and makes no representations
or warranties that these products are free from patent, copyright or mask work right infringement unless otherwise
specified. Applications that are described in this manual are for illustration purposes only. Kontron makes no
representation or warranty that such application will be suitable for the specified use without further testing or
modification. Kontron expressly informs the user that this manual only contains a general description of processes
and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron.
This manual is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this manual is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this manual only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2018 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

mITX-APL Rev. 1.2
Revision History
Revision Brief Description of Changes Date of Issue Author
1.0 Initial Issue 2018-Mar-08 hjs
1.1 added information in chapter 5.3 2018-Jul-12 hjs
1.2 added OS versions, chapter 6.24
changed
2018-Jul-24 hjs
Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE
FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR COMMUNICATION SYSTEMS FOR
AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR LIFE SUSTAINING APPLICATIONS,
WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE
PERFORMANCE, OR IN WHICH THE FAILURE OF PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR
SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless
otherwise stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities
and cannot therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or
for resale as device in High Risk Applications. All application and safety related information in this document
(including application descriptions, suggested safety measures, suggested Kontron products, and other materials) is
provided for reference only.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths
into a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace
of mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.

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Symbols
The following symbols may be used in this manual
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
NOTICE indicates a property damage message.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your material.
Please refer also to the "High-Voltage Safety Instructions" portion below in this section.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user manual.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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Table of Contents
Symbols .................................................................................................................................................................................................................6
Table of Contents ...............................................................................................................................................................................................7
List of Tables........................................................................................................................................................................................................9
List of Figures ....................................................................................................................................................................................................10
1/ Introduction...........................................................................................................................................................................................11
2/ Description............................................................................................................................................................................................12
2.1. Configurations............................................................................................................................................................................................12
2.2. Accessories List ........................................................................................................................................................................................12
3/ Installation procedure ......................................................................................................................................................................14
3.1. Packing Check List.....................................................................................................................................................................................14
3.2. Installing the Board .................................................................................................................................................................................14
3.3. Requirements IEC60950-1.....................................................................................................................................................................15
3.4. Lithium battery precautions.................................................................................................................................................................16
4/ System specifications.......................................................................................................................................................................17
4.1. Component Main Data.............................................................................................................................................................................17
4.2. Environmental Conditions....................................................................................................................................................................20
4.3. Block Diagram ...........................................................................................................................................................................................21
5/ Jumpers and Connectors ................................................................................................................................................................22
5.1. Hardware Configuration Setting .........................................................................................................................................................22
5.1.1. Jumpers and Connectors.....................................................................................................................................................................22
5.2. Mainboard Placement and Rear I/O locations...............................................................................................................................23
5.2.1. Inferfaces.................................................................................................................................................................................................24
5.2.2. Rear Side .................................................................................................................................................................................................24
6/ Pin Definitions..................................................................................................................................................................................... 25
6.1. Processor Support...................................................................................................................................................................................26
6.2. System Memory Support......................................................................................................................................................................26
6.3. Flash Memory........................................................................................................................................................................................... 27
6.4. Ethernet Connectors (I/O area).......................................................................................................................................................... 27
6.5. USB Connectors (I/O area) ...................................................................................................................................................................28
6.6. DC Power-Jack Connector J56.............................................................................................................................................................29
6.7. Audio Jack Connectors (I/O area).......................................................................................................................................................30
6.8. Fan Connectors (internal) ....................................................................................................................................................................30
6.9. Front Panel 1 (internal)...........................................................................................................................................................................31
6.10. RS232 Header (internal)......................................................................................................................................................................32
6.11. RS-485 Header (internal) ....................................................................................................................................................................32
6.12. Feature Connector.................................................................................................................................................................................33
6.13. CMOS1 Internal .......................................................................................................................................................................................34
6.14. SPK Internal .............................................................................................................................................................................................34
6.15. MIC1 Connector (J22) ............................................................................................................................................................................34
6.16. SPDIF-OUT Connector (J25)................................................................................................................................................................ 35
6.17. LVDS internal (J3)................................................................................................................................................................................... 35
6.18. SATA (Serial ATA) Disk Interfaces (internal) ................................................................................................................................36
6.19. SATA Power Connector (J14).............................................................................................................................................................. 37
6.20. Display Port ............................................................................................................................................................................................ 37
6.21. DC Power Connector.............................................................................................................................................................................38
6.22. SPI Connector (J2).................................................................................................................................................................................38
6.23. Combo Connector for MicroSD and MicroSIM.............................................................................................................................40

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6.24. Slot Connector (mPCIe/mSATA) (J29).............................................................................................................................................41
6.25. PCIe x1 Connector (J17) ........................................................................................................................................................................43
6.26. RTC/Clear CMOS....................................................................................................................................................................................44
7/ uEFI BIOS...............................................................................................................................................................................................45
7.1. Starting the uEFI BIOS .............................................................................................................................................................................45
7.2. Setup Menus..............................................................................................................................................................................................46
7.2.1. Main Setup Menu ..................................................................................................................................................................................46
7.2.2. Advanced Setup Menu........................................................................................................................................................................48
7.2.3. Chipset Setup Menu............................................................................................................................................................................. 53
7.2.4. Security Setup Menu...........................................................................................................................................................................56
7.2.5. Remember the Password ...................................................................................................................................................................57
7.2.6. Boot Setup Menu..................................................................................................................................................................................58
7.2.7. Exit Setup Menu.................................................................................................................................................................................... 59
7.3. The uEFI Shell............................................................................................................................................................................................60
7.3.1. Basic Operation of the uEFI Shell.....................................................................................................................................................60
7.3.1.1. Entering the uEFI Shell......................................................................................................................................................................60
7.3.1.2. Exiting the uEFI Shell.........................................................................................................................................................................61
7.4. uEFI Shell Scripting ..................................................................................................................................................................................61
7.4.1. Startup Scripting....................................................................................................................................................................................61
7.4.2. Create a Startup Script........................................................................................................................................................................61
7.4.3. Examples of Startup Scripts..............................................................................................................................................................61
7.4.3.1. Execute Shell Script on other Harddrive.....................................................................................................................................61
7.5. Firmware Update......................................................................................................................................................................................61
7.5.1. Updating Procedure ..............................................................................................................................................................................61
List of Acronyms..............................................................................................................................................................................................63
About Kontron ..................................................................................................................................................................................................64

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List of Tables
Table 1: Configurations ...................................................................................................................................................................................12
Table 2: List of Accessories...........................................................................................................................................................................12
Table 3: Component Main Data....................................................................................................................................................................17
Table 4: Environmental Conditions ...........................................................................................................................................................20
Table 5: Connector Definitions.................................................................................................................................................................... 25
Table 6: Processor Support..........................................................................................................................................................................26
Table 7: Pin Assignment ................................................................................................................................................................................28
Table 8: Signal Description...........................................................................................................................................................................28
Table 9: DC Power-Jack Connector............................................................................................................................................................29
Table 10: Pin Assignment (Line Out, green, Figure 13 left )................................................................................................................30
Table 11: Pin Assignment (Line In, blue, Figure 13 right) .....................................................................................................................30
Table 12: 4-pin Mode......................................................................................................................................................................................30
Table 13: Signal Description..........................................................................................................................................................................31
Table 14: FP1 Connection................................................................................................................................................................................31
Table 15: RS232 Header ................................................................................................................................................................................. 32
Table 16: Signal Description.........................................................................................................................................................................32
Table 17: RS-485 Header............................................................................................................................................................................... 32
Table 18: Feature Connector........................................................................................................................................................................ 33
Table 19: CMOS1 Internal Connection........................................................................................................................................................34
Table 20: SPK Internal Connection.............................................................................................................................................................34
Table 21: Pin Assignment .............................................................................................................................................................................. 35
Table 22: Pin Assignment ............................................................................................................................................................................. 35
Table 23: LVDS Pin Assignment .................................................................................................................................................................. 35
Table 24: Pin Assignment .............................................................................................................................................................................36
Table 25: Signal Description ........................................................................................................................................................................36
Table 26: Pin Assignment ............................................................................................................................................................................. 37
Table 27: Display Port .................................................................................................................................................................................... 37
Table 28: Pin Assignment .............................................................................................................................................................................38
Table 29: Pin Assignment .............................................................................................................................................................................39
Table 30: Signal description.........................................................................................................................................................................39
Table 31: Pin Assignment MicroSIM...........................................................................................................................................................40
Table 32: Pin Assignment MicroSD............................................................................................................................................................40
Table 33: Pin Assignment ..............................................................................................................................................................................41
Table 34: PCIe x1 ..............................................................................................................................................................................................43
Table 35: RTC/Clear CMOS Configurations.............................................................................................................................................44
Table 36: Navigation Hot Keys Available in the Legend Bar..............................................................................................................45
Table 37: Main Setup Menu Sub-screens................................................................................................................................................47
Table 38: Advanced Setup menu Sub-screens and Functions.........................................................................................................49
Table 39: Chipset Setup menu Sub-screens and Functions.............................................................................................................. 53
Table 40: Security Setup Menu Functions .............................................................................................................................................. 56
Table 41: Boot Setup Menu Functions ......................................................................................................................................................58
Table 42: Save and Exit Setup Menu Functions ....................................................................................................................................60

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List of Figures
Figure 1: Mainboard mITX-APL.....................................................................................................................................................................14
Figure 2: IO Shield (pattern)..........................................................................................................................................................................14
Figure 3: Block Diagram of mITX-APL........................................................................................................................................................21
Figure 4: Front Side and Interfaces ...........................................................................................................................................................23
Figure 5: Interfaces .........................................................................................................................................................................................24
Figure 6: Rear Side...........................................................................................................................................................................................24
Figure 7: Combo Connector for MicroSD and MicroSIM...................................................................................................................... 27
Figure 8: Ethernet Connector ...................................................................................................................................................................... 27
Figure 9: USB 2.0 / 3.0 socket......................................................................................................................................................................28
Figure 10: USB 2.0 High Speed Cable.........................................................................................................................................................28
Figure 11: USB 3.0 High Speed Cable..........................................................................................................................................................29
Figure 12: DC Power-Jack Connector.........................................................................................................................................................29
Figure 13: Audio Jacks.....................................................................................................................................................................................30
Figure 14: 4-pin Fan Connector...................................................................................................................................................................30
Figure 15: FP1 Connector.................................................................................................................................................................................31
Figure 16: 2-wire RS232.................................................................................................................................................................................32
Figure 17: Available Cable Kit (DB9 adapter cables) ............................................................................................................................32
Figure 18: RS-485 Header ............................................................................................................................................................................. 32
Figure 19: Internal Feature Connector (2x22 pins)............................................................................................................................... 33
Figure 20: CMOS1 Internal Connector .......................................................................................................................................................34
Figure 21: SPK Internal Connector.............................................................................................................................................................34
Figure 22: MIC1 Connector ............................................................................................................................................................................34
Figure 23: SPDIF-OUT Connector ............................................................................................................................................................... 35
Figure 24: LVDS Connector........................................................................................................................................................................... 35
Figure 25: SATA Connector ...........................................................................................................................................................................36
Figure 26: Available Cable Kit ...................................................................................................................................................................... 37
Figure 27: SATA Power Connector ............................................................................................................................................................. 37
Figure 28: Display Port .................................................................................................................................................................................. 37
Figure 29: Power Connector.........................................................................................................................................................................38
Figure 30: SPI Connector 10x Pin header .................................................................................................................................................38
Figure 31: Combo Connector for MicroSD and MicroSIM....................................................................................................................40
Figure 32: Slot Connector (mPCIe)..............................................................................................................................................................41
Figure 33: PCIe x1 Connector........................................................................................................................................................................43
Figure 34: Main Setup Menu Initial Screen .............................................................................................................................................46
Figure 35: Advanced Setup Menu Initial Screen....................................................................................................................................48
Figure 36: Chipset Setup Menu Initial Screen......................................................................................................................................... 53
Figure 37: Security Setup Menu Initial Screen ....................................................................................................................................... 56
Figure 38: Boot Setup Menu Initial Screen..............................................................................................................................................58
Figure 39: Save and Exit Setup Menu Initial Screen............................................................................................................................. 59

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1/ Introduction
This manual describes the Mini-ITX board with Apollo Lake CPU. This board will also be denoted mITX-APL within
this Users Guide.
The use of this Users Guide implies a basic knowledge of PC hard- and software. This manual is focussed on
describing the mITX-APL board’s special features and is not intended to be a standard PC textbook.
New users are recommended to study the short installation procedure stated in the following chapter before
switching-on the power.
All configuration and setup of the CPU board is either done automatically or manually by the user via the BIOS setup
menus.
Latest revision of this manual, datasheet, thermal simulations, BIOS, drivers, BSPs (Board Support Packages) can be
downloaded from Kontron Web Page.

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2/ Description
The mITX-APL board is based on the Intel Apollo Lake System on Chip (SoC) and is mechanically compliant to the
Mini-ITX (mITX) specification. The motherboard with Mini-ITX formfactor is designed for mobile processors with low
power consumption. Board key features are:
Intel Apollo Lake (APL) microprocessor supporting different speed grades from dual to quad core
memory with one DDR3L 1333/1600/1867 SODIMM socket up to 8 GB
Support for two independent high resolution graphic displays
two Display Port (DP) Connectors
one 24-bit dual-channel LVDS Transmitter
two 10/100/1000 LAN RJ45 (rear)
two USB 3.0 Double Stack Connector
one SATA Gen3 (up to 6GB/s) vertical connector
one RS232, one RS422 (Half-duplex), one RS485 (Half- and Full-duplex) through internal header
SPI Interface for external fast IO support
HD Audio with Stereo Line-in and Line-out (rear)
Kontron Feature connector
Temperature Sensor with active cooling solutions
Wide range from 12 to 24 V DC Power Input or ATX 4-pin (12V)
Built with these functions, mITX-APL Mother Board is ideal for ATM, Automation, Kiosk applications, medical
equipment, industrial automation, financial automation, process control, semiconductor equipment and network
security markets.
2.1. Configurations
Table 1: Configurations
Product Name
(Product Number)
Description MTBF (hours)
N3350 (1060-7395) Intel® Mobile Celeron® N3350 2C 2.3 GHz,
6
W, Commercial temp, Entry
1,454,122
E3930 (1060-7384) Intel® Atom™ x5 E3930 2C 1.8 GHz, 6,5 W,
Industrial temp, Entry
1,073,767
E3940 (1060-7396) Intel® Atom™ x5 E3940 4C 1.8 GHz, 9,5 W,
Industrial temp, Intermediate
1,084,363
E3950 (1060-7397) Intel® Atom™ x7 E3950 4C 2.0 GHz, 12 W,
Industrial temp, High
1,084,363
2.2. Accessories List
Table 2: List of Accessories
Connector
(RefDes)
On-Board Connectors Mating Connectors/Cables
Manufacturer Part No. Manufacturer Part No.
FANCPU, FANSYS
(J6, J5) Molex 53047-0410 Molex 510210400
SATA 1 Straight Lotes ABA-SAT-010-K08 Molex 67489-8005

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Connector
(RefDes)
On-Board Connectors Mating Connectors/Cables
Manufacturer Part No. Manufacturer Part No.
(J15)
Kontron 821035 (kit)
SATA 2 Right
Angle (J16) Molex 47080-4001 Molex 67489-8005
Kontron 821035 (kit)
SATA Power (J14) Molex 22-23-2041 Molex 22.01.2045
TE Connectivity 640456-4 TE Connectivity 1375820-4
ATX +12V -4p
(J28)
Molex 39-28-1043
Molex 39-01-2045
Foxconn HM3502E
Lotes ABA-POW-003-
K04
DC Jack (J32) Singatron 2DC1003-010111 Singatron 2DP1505-000111
Headphone (J24) Molex 53047-0410 Molex 51021-0400
LVDS (J3)
Samtec SHF-120-01-L-D-
SM-K-TR Kontron 910000005
Pinrex 53C-90-40GBE0 Kontron 821515 (kit) *
Kontron 821515 (kit)
COM 1 RS232
(J30)
Foxconn HL2205F Molex 90635-1103
Pinrex 510-90-10GB00 Kontron 821016 (kit)
Cen Link ZP91-014B1-10Y1 Kontron 821017 (kit) *
COM 2 RS485
(J4) JST B5B-PH-K-
S(LF)(SN)(P) JST PHR-5
USB 2.0 (J26,
FRONTPNL)
Pinrex 510-80-24GB05 Kontron 821401 (kit)
Foxconn HL2112V-P9
USB 3.0 (J18) Foxconn HLL2107-CBC2D-
4H
SPI Hardflash
(J2) Pinrex 210-92-06GB01
SPDIF –OUT (J30) Molex 53047-0210 Molex 51021-0200
USB 2.0 (J26,
FRONTPNL)
Pinrex 510-80-24GB05 Molex 90635-1243
Foxconn HL2112V-P9 Kontron 821042 (kit) *
FEATURE (J31) Pinrex 52A-90-44GB00 Don Connex A05c-44-B-G-A-1-
G
Molex 87831-4420 Kontron 1052-5885 (kit) *
CAN Bus (J11) Molex 53047-0410 Molex 510210400
USB Client (J21) Mill-Max 897-10-010-00-
300002
Würth Electronics
Inc. 692904100000
FTDI USB 3.0 A MICRO B
CABLE

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3/ Installation procedure
3.1. Packing Check List
The mITX-APL package includes the following basic items accompany with this manual.
One mainboard
One IO shield
Figure 1: Mainboard mITX-APL
Figure 2: IO Shield (pattern)
If any of these items is damaged or missed, please contact your vendor and save all packing materials for future
replacement and maintenance.
Note: The above packing list is for standard single box packing only.
3.2. Installing the Board
ESD Sensitive Device!
Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry.
•Wear ESD-protective clothing and shoes
•Wear an ESD-preventive wrist strap attached to a good earth ground
•Check the resistance value of the wrist strap periodically (OK: 1 MΩto 10 MΩ)
•Transport and store the board in its antistatic bag
•Handle the board at an approved ESD workstation
•Handle the board only by the edges

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To get the board running follow these steps. If the board shipped from Kontron has already components like RAM
and CPU cooler mounted, then relevant steps below can be skipped.
1.
Turn off the PSU (Power Supply Unit)
Turn off PSU (Power Supply Unit) completely (no mains power connected to the PSU)
or leave the Power Connectors unconnected while configuring the board. Otherwise
components (RAM, LAN cards etc.) might get damaged.
2.
Insert the memory module
Be careful to push it in the slot(s) before locking the tabs. For a list of approved memory modules contact your
Distributor or FAE. See also chapter “System Memory Support”. Use memory modules with the same density in
all sockets!
3.
Connecting Interface
s
Insert all external cables for hard disk, keyboard etc. A monitor must be connected in order to change BIOS
settings.
4.
Connect and turn on PSU
Connect PSU to the board by the ATX+12 V-4pin connector or alternatively connect a 12 V DC power adapter to
the I/O power jack.
5.
BIOS Setup
Enter the BIOS setup by pressing the <F2> key during boot up.
Enter “Exit Menu” and load Setup Defaults.
Refer to the “BIOS Configuration / Setup“ section of this manual for details on BIOS setup.
To clear all BIOS settings, including Password protection, activate “Load Default BIOS
Settings” Jumper for
⋲>
10 sec (without power connected).
6. Mounting the board in chassis
When mounting the board to chassis etc. please notice that the board contains components
on both sides of the PCB which can easily be damaged if board is handled without
reasonable care. A damaged component can result in malfunction or no function at all.
When fixing the Motherboard on a chassis it is recommended to use screws with integrated washer and a
diameter of >7 mm. Do not use washers with teeth, as they can damage the PCB and cause short circuits.
3.3. Requirements IEC60950-1
Take care when designing chassis interface connectors in order to fulfil the IEC60950-1 standard. Users of mITX-APL
must evaluate the end product to ensure compliance the requirements of the IEC60950-1 safety standard are met:
The motherboard must be installed in a suitable mechanical, electrical and fire enclosure.
The system in its enclosure must be evaluated for temperature and air flow considerations.
The motherboard must be powered by a CSA or UL approved power supply that limits the maximum input
current to 10 A via external barrel-type 12-24 VDC connector, and to 16 A via internal square 12 VDC ATX
connector.
For interfaces having a power pin such as external power or fan, ensure that the connectors and wires are
suitably rated. All connections from/to the product shall be with SELV circuits only.
Wires have suitable rating to withstand the maximum available power.
The enclosure of the peripheral device fulfils the fire protecting requirements of IEC60950-1.

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3.4. Lithium battery precautions
Danger of explosion if the lithium battery is incorrectly replaced.
•Replace only with the same or equivalent type recommended by the manufacturer
•Dispose of used batteries according to the manufacturer’s instructions
VORSICHT! Explosionsgefahr bei unsachgemäßem Austausch der Batterie.
•Ersatz nur durch denselben oder einen vom Hersteller empfohlenen gleichwertigen
Typ
•Entsorgung gebrauchter Batterien nach Angaben des Herstellers
ATTENTION! Risque d'explosion avec l'échange inadéquat de la batterie.
•Remplacement seulement par le même ou un type équivalent recommandé par le
producteur
•L'évacuation des batteries usagées conformément à des indications du fabricant
PRECAUCION! Peligro de explosión si la batería se sustituye incorrectamente.
•Sustituya solamente por el mismo o tipo equivalente recomendado por el fabricante
•Disponga las baterías usadas según las instrucciones del fabricante
ADVARSEL! Lithiumbatteri – Eksplosionsfare ved fejlagtig håndtering.
•Udskiftning må kun ske med batteri af samme fabrikat og type
•Levér det brugte batteri tilbage til leverandøren.
ADVARSEL! Eksplosjonsfare ved feilaktig skifte av batteri.
•Benytt samme batteritype eller en tilsvarende type anbefalt av apparatfabrikanten.
•Brukte batterier kasseres i henhold til fabrikantens instruksjoner
VARNING! Explosionsfara vid felaktigt batteribyte.
•Använd samma batterityp eller en ekvivalent typ som rekommenderas av
apparattillverkaren.
•Kassera använt batteri enligt fabrikantens instruktion.
VAROITUS! Paristo voi räjähtää, jos se on virheellisesti asennettu.
•Vaihda paristo ainoastaan lalteval- mistajan suosittelemaan tyyppiln
•Hävitä käytetty paristo valmistajan ohjeiden mukaisesti

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4/ System specifications
4.1. Component Main Data
The table below summarizes the features of the mITX-APL embedded motherboard.
Table 3: Component Main Data
Motherboard mITX-APL
Form factor
Mini ITX (170.18 mm by 170.18 mm by 1.6 mm/LengthxWidthxThickness)
Processor
Onboard CPU variants
Intel® Apollo Lake Processor line, 14 nm SoC
Intel® Atom™ x7 E3950 4C 2.0 GHz, 12 W
Intel® Atom™ x5 E3940 4C 1.8 GHz, 9.5 W
Intel® Atom™ x5 E3930 2C 1.8 GHz, 6.5 W
Intel® Mobile Celeron® N3350 2C 2.3 GHz, 6 W
BIOS
Winbond W25Q128FVSIG or Micron N25Q128A13ESE40F (128Mb) for System BIOS
Platform
Controller Hub
(PCH)
BGA-1296
Memory A DDR3L 204-pin SODIMM memory module can be used, like
DDR3L, 4 GB 1867 MHz, PC3-1867, non-ECC SODIMM
DDR3L, 8 GB 1867 MHz, PC3-1867, non-ECC SODIMM
DDR3L, 4 GB 1867MHz, PC3-1867, non-ECC, E2 SODIMM
DDR3L, 8 GB 1867MHz, PC3-1867, non-ECC, E2 SODIMM
Flash Memory The mITX-APL supports embedded embedded Multimedia Card (eMMC) interface 5.0 with a
maximum bus speed of 400 MB/s. The board will also support a SD card interface UHS-I
standard with a maximum bus speed of 104 MB/s. The eMMC chip is soldered on board. The
microSD card interface is sharing a combo connector with the micro SIM card.
Storage two SATA 3.0: While the first vertical SATA port is dedicated port from the SoC, the second
right angle port is combined with mSATA.
Watchdog Timer Watchdog timer will be supported by the MAX10 CPLD
Wake On
Wake on LAN, USB, Power button (S3 to S5)
Hardware Status
Monitor
Monitoring CPU and system temperature, voltage status and fan speed
TPM Infineon SLB9665 (option)
Power
management
ACPI System States support (S0, S3, S4 and S5)
Processor Core/Package States support (C0, C1, C1E, C6, C7, C7L, C8, C9, C10)
Processor Display States support (D0 to D5, and D9)
Dynamic I/O power reduction (disabling sense amps on input buffers, tri-stating
output buffers)
Active power-down of display links
Battery
BR2032/CR2032
See Safety Instructions below this table!

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Expansion 
one PCI-Express 2.0 x1 Slot
one mPCIe/ mSATA with USB/UIM SIM interface
Operating System
Support
Six different Board Support Packages are offered:
BSP1: Windows 10 IOT Enterprise 64 bit, eMMC Boot
BSP2: Windows 10 IOT Core, Redstone 64 bit
BSP3: Windows 7, 64 bit, eMMC boot (optional)
BSP4: Windows ES 7, 64 bit, eMMC boot (optional)
BSP5: Linux 64 bit, Yocto
BSP6: VxWorks 7.x or newer (optional)
API: KEAPI 3 for all OS (except fo VxWorks)
External I/O
LAN, USB3.0 two RJ-45 LAN Ports (with two LED indicators) + 2x dual USB3.0 + 2x dual USB2.0 (4 x USB)
Audio
two audio Jacks for Line-out (lime-color) and Line-input (blue-color)
Display Port (DP) two Display Port connectors Version 1.2
Power 12 to 24 V DC-IN Power Connector
Internal I/O
SATA two connectors (straight and right angle) SATA3.0 (6
Gb/s) and one power connector +5
V
and +12 V for external SATA drives
PC Buzzer Standard PC buzzer on board
USB
two-port USB 3.0 Header on a 19-pin 2mm pitch dual row shrouded header, 1x microUSB 3.0
Type-B, Vertical
Serial Peripheral
Interface (SPI)
one SPI on 10-pin (2x5) straight 2.54 mm pitch header
LVDS one (2 x 20 ) 1.25
mm pin-header
Mini PCIe one mPCIe/mSATA
Audio
one microphone, one headphone, one SPDIF
Serial one RS232, one RS485
GPIO one 2 x 22-pin header
Internal Header
Power two (1 x 4 )-pin-header for CPU & System, Power connector +5 V and +12 V for external SATA
drives, one 4-pin ATX Power
CMOS Clear 1 x (1 x 3 ) 2,54 mm pin-header (RTC Circuit)
Front Panel
1 x 24 pin connector, Pin 9 void
MicroSD/microSIM one microSD & microSIM combo socket adapter

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Display
Graphics Controller
The mITX-APL board supports onboard graphics through two independent interfaces
simultaneously: Two DP-Ports and the LVDS-Port.
The two standard outputs in the rear are connected directly to Display Port
connectors.
The alternative output will be converted from Embedded DisplayPort (eDP) to LVDS.
The LVDS conversion is done by NXP PTN3460BS DisplayPort to dual-channel 24-bit
LVDS converter. Configuration for 1x18-, 1x24-, 2x18- and 2x24-bit / pixel can be
selected by resistor option on board. The LVDS interface is provided on a standard
40-pin connector.
DP to LVDS
Controller
NXP PTN3460I/PTN3460BS
Display Interface
two Display Ports and LVDS
Note: Three (3) Independent Displays Max.
Resolution DP/LVDS 4096x2304 @ 60
Hz, 24
bpp (One panel display)
Ethernet
Controller Intel GE WGI210IS/WGI211AT
Interface IEEE 802.3 10BASE-T / 100BASE-TX / 1000BASE-T compliant
Audio
Universal Audio
Architecture (UAA)
The on-board Audio circuit implements six Channel High Definition Audio with UAA (Universal
Audio Architecture), featuring three 24-bit stereo Digital-to-Analog converter (DACs)
and two
24-bit stereo Analog-to-Digital Converter ADC.
Power
Onboard Power
Supply
All used power rails are generated internal by a highly integrated DC/DC power unit
Voltage Ripple specification max ±5 % peak to peak 0 to 20 MHz
Rise Time specification 2 to 20ms from input voltage <10% to nominal VCC
External Power
Supply
The mITX-APL is operated by a single 12 to 24 V wide Input Voltage (VIN) DC supply from DC
Jack on rear I/O Singatron 2DC1003-010111 or optionally 12 V DC supply through an internal
ATX 4-pin header.
Danger of explosion if the lithium battery is incorrectly replaced.
•Replace only with the same or equivalent type recommended by the manufacturer
•Dispose of used batteries according to the manufacturer’s instructions

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4.2. Environmental Conditions
Table 4: Environmental Conditions
Operating The board has two temperature ranges:
commercial grade: 0°C to +60°C (32°F~140°F) operating temperature (forced
cooling).
extended grade: -25°C to +75°C (-13°F~167°F) operating temperature
It is the customer’s responsibility to provide sufficient airflow around each of the
components to keep them within allowed temperature range. Please refer to the thermal
simulation report for information about airflow.
10% to 95% relative humidity (non-condensing)
Storage -40°C to 85°C (-40°F to 185°F); lower limit of storage temperature is defined by
specification restriction of on-board BR2032/CR2032 battery.
Up to 95
% relative humidity (temperature 25°C to 30°C)
Radiated Emissions
(EMI)
All Peripheral interfaces intended for connection to external equipment are EMI protected.
EN55022 Class B radiated and conducted
EN 61000-6-4:2007 (EMC) Generic emission standard Part 6-4: Emission standard
for industrial environments
EN 61000-6-2:2005 (EMC) – Generic standard – Immunity for industrial
environmental
Includes following tests accordingly
IEC 61000 PT4-2, (EN 61000-4-2) Electrostatic discharge immunity ESD
IEC 61000 PT4-3, (EN 61000-4-3 and ENV 50204) Radiated Field
IEC 61000 PT4-4, (EN 61000-4-4) Electrical fast transient/burst (EFT) BURST
IEC 61000 PT4-5, (EN 61000-4-5) Surge immunity test
IEC 61000 PT4-6, (EN 61000-4-6) Immunity to conducted disturbances
IEC 61000 PT4-8, (EN 61000-4-8) Immunity to magnetic fields (LOW)
IEC 61000 PT4-11, (EN 61000-4-11) Testing and measuring techniques-voltage dips,
short interruption, and voltage variations immunity tests
Safety EN 60950-1:2006 +A11:2009 +A1:2010 +A12:2011:
Safety for information technology equipment including electrical business equipment
Shock Conducted in standard available ATX chassis. Test is following Standard IEC 60068-2-27,
half-sine wave, Acceleration2g, Pulse duration：11ms. Number of shocks: 600 shocks (100
shocks for each face.)
Bump IEC 60068-2-27: Half Sine Waveform Acceleration 2g; Pulse Duration 11ms. Number of
shocks: 600 shocks (100 shocks for each face.)
Vibration AW IEC 60068-2-64, test Fh, Random Vibration, 90 min per axis, 3 axes at 1.9 grms, with
PSD: 10-20Hz: 0.05 g²/Hz and 20-500Hz:- 3dB/octave.
Theoretical MTBF 1,073,767 to 1,454,122 hours depending on processor type at 30° C for the mITX-APL
Restriction of
Hazardous
Substances
(RoHS
II)
The product will comply to the European Council Directive on the approximation of the laws
of the member states relating to Directive 20011/65/EU or the last status thereof.
Altitude 2000 m max.