Kontron KT965/Flex User manual

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KTD-00699-S Public User Manual Date: 2010-04-15 Page 1 of 90
KT965/Flex
KT965/ATXP
KT965/ATXE
User Manual
for the Motherboards:

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Document revision history.
Revision Date By Comment
S April 15th 2010 MLA Updated Voltage Monitor read out. Updated warning info to installation
guide. APM information corrected. Minor corrections.
R Oct. 19th 2009 MLA BIOS part features added, minor corrections and layout changed.
Q Oct. 13th 2009 MLA Corrected BIOS SpeedStep info. Added “mounting the board to
chassis”. Minor layout changes.
P June 9th 2009 MLA
TPM support added. Battery alternative added. CPU E4700 added.
Correction to LAN connector pinning. Added BIOS setting: PCI Slot-2
IRQ Preference.
O Dec. 10th 2008 MLA
Added note on XP for ACPI USB Wakeup. Added info to USB Function
in BIOS description. PCI Riser info corrected. MTBF values added.
CPU list updated. Minor layout changes.
N May 30th 2008 MLA Added info on BIOS version when using XP SP3. Battery type
updated.
M April 22nd 2008 MLA Added Windows Vista support. 3.3V tolerance increased. CPU list
updated.
L April 2nd 2008 MLA
Text “WinCE support” removed. In BIOS description: Deleted
remaining Floppy controller info and corrected IO Controller version to
627DHG.
K Mar. 6th 2008 MLA
Battery load information added. For BIOS part: Added APM settings,
changed SpeedStep setting, added note on ETH1/2 WOL, change
name of Vanderpool to Virtualization, ACPI settings modified and IDE
description changed. Other minor changed.
J Jan. 2nd 2008 MLA
“LPT” replaced with “Printer”. BIOS function “Long Splash” added.
Minor corrections to “Onboard connectors”. 4K7 added to FAN Tables.
Added CPU Q6600 and Q6700.
0 - I Oct. 17th, 2007 MLA (Text removed in revision O of this document)
Copyright Notice:
Copyright ©2007, KONTRON Technology A/S, ALL RIGHTS RESERVED.
No part of this document may be reproduced or transmitted in any form or by any means, electronically or
mechanically, for any purpose, without the express written permission of KONTRON Technology A/S.
Trademark Acknowledgement:
Brand and product names are trademarks or registered trademarks of their respective owners.
Disclaimer:
KONTRON Technology A/S reserves the right to make changes, without notice, to any product, including
circuits and/or software described or contained in this manual in order to improve design and/or
performance.
Specifications listed in this manual are subject to change without notice. KONTRON Technology assumes
no responsibility or liability for the use of the described product(s), conveys no license or title under any
patent, copyright, or mask work rights to these products, and makes no representations or warranties that
these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Applications that are described in this manual are for illustration purposes only. KONTRON Technology A/S
makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification.

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Life Support Policy
KONTRON Technology’s PRODUCTS ARE NOT FOR USE AS CRITICAL COMPONENTS IN LIFE
SUPPORT DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF THE GENERAL
MANAGER OF KONTRON Technology A/S.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
body, or (b) support or sustain life and whose failure to perform, when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in significant injury to
the user.
2. A critical component is any component of a life support device or system whose failure to perform can be
reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
KONTRON Technology Technical Support and Services
If you have questions about installing or using your KONTRON Technology Product, check this User’s
Manual first – you will find answers to most questions here. To obtain support, please contact your local
Distributor or Field Application Engineer (FAE).
Before Contacting Support: Please be prepared to provide as much information as possible:
CPU Board
1. Type.
2. Part-number.
3. Serial Number.
Configuration
1. CPU Type, Clock speed.
2. DRAM Type and Size.
3. BIOS Revision (Find the Version Info in the BIOS Setup).
4. BIOS Settings different than Default Settings (Refer to the BIOS Setup Section).
System
1. O/S Make and Version.
2. Driver Version numbers (Graphics, Network, and Audio).
3. Attached Hardware: Harddisks, CD-rom, LCD Panels etc.

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Table of contents:
1. INTRODUCTION.....................................................................................................................................7
2. INSTALLATION PROCEDURE..............................................................................................................8
2.1 Installing the board............................................................................................................................8
2.2 Requirement according to EN60950..............................................................................................10
3. SYSTEM SPECIFICATION...................................................................................................................11
3.1 Component main data .....................................................................................................................11
3.2 System overview..............................................................................................................................14
3.3 Processor support table..................................................................................................................15
3.4 System Memory support.................................................................................................................16
3.4.1 Memory Operating Frequencies .................................................................................................16
3.4.2 Memory Configurations...............................................................................................................16
3.5 KT965 Graphics Subsystem ...........................................................................................................18
3.5.1 Intel GMA 3000 Graphics Controller...........................................................................................18
3.5.2 Dynamic Video Memory Technology (DVMT) ............................................................................18
3.5.3 Advanced Digital Display (ADD2) card Support .........................................................................19
3.6 KT965 Power State Map ..................................................................................................................20
3.7 Power Consumption........................................................................................................................22
3.8 KT965 Clock Distribution................................................................................................................24
4. CONNECTOR DEFINITIONS................................................................................................................25
4.1 Connector layout..............................................................................................................................26
4.1.1 KT965/Flex..................................................................................................................................26
4.1.2 KT965/ATXP...............................................................................................................................27
4.1.3 KT965/ATXE...............................................................................................................................28
4.2 Power Connector (ATXPWR)..........................................................................................................29
4.3 Keyboard and PS/2 mouse connectors.........................................................................................30
4.3.1 Stacked MINI-DIN keyboard and mouse Connector (MSE & KBD) ...........................................30
4.3.2 Keyboard and mouse pin-row Connector (KBDMSE) ................................................................30
4.4 Display Connectors .........................................................................................................................31
4.4.1 CRT Connector (CRT)................................................................................................................31
4.5 PCI-Express Connectors.................................................................................................................32
4.5.1 PCI-Express x16/ SDVO connector............................................................................................32
4.5.2 PCI-Express x4 in a x16 connector ...........................................................................................33
4.5.3 miniPCI-Express connector ........................................................................................................35
4.6 Serial ATA harddisk interface.........................................................................................................36
4.6.1 SATA Hard Disk Connector (SATA0, SATA1, SATA2, SATA3, SATA4, SATA5)......................36
4.7 Printer Port Connector (PRINTER).................................................................................................37
4.8 Serial Ports.......................................................................................................................................38

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4.8.1 Com1 (Port1) DB9 Connector. ...................................................................................................38
4.8.2 Com2 Pin Header Connector. ....................................................................................................38
4.9 Ethernet connectors........................................................................................................................39
4.9.1 Ethernet connector 1 (ETHER1).................................................................................................39
4.9.2 Ethernet connector 2 (ETHER2).................................................................................................40
4.10 USB Connector (USB)..................................................................................................................41
4.10.1 USB Connector 0/2 (USB0/2).....................................................................................................41
4.10.2 USB Connector 4/5 (USB4/5).....................................................................................................42
4.10.3 USB Connector 6/7 (USB6/7).....................................................................................................42
4.10.4 USB Connector 8/9 (USB8/9).....................................................................................................43
4.11 Audio Connector ..........................................................................................................................44
4.11.1 Audio Line-in, Line-out and Microphone.....................................................................................44
4.11.2 CD-ROM Audio input (CDROM).................................................................................................45
4.11.3 AUDIO Header (AUDIO_HEAD).................................................................................................46
4.12 Fan connectors , FAN_CPU and FAN_SYS. ..............................................................................47
4.13 The Clear CMOS Jumper, Clr-CMOS..........................................................................................48
4.14 TPM connector (unsupported)....................................................................................................49
4.15 SPI connector (unsupported)......................................................................................................49
4.16 Front Panel connector (FRONTPNL)..........................................................................................50
4.17 Feature Connector (FEATURE)...................................................................................................51
4.18 PCI Slot Connector......................................................................................................................52
4.18.1 Signal Description –PCI Slot Connector.....................................................................................53
4.18.2 KT965 PCI IRQ & INT routing.....................................................................................................55
5. ONBOARD CONNECTORS .................................................................................................................56
6. SYSTEM RESSOURCES......................................................................................................................57
6.1 Memory map.....................................................................................................................................57
6.2 PCI devices.......................................................................................................................................58
6.3 Interrupt Usage ................................................................................................................................59
6.4 I/O Map ..............................................................................................................................................60
6.5 DMA Channel Usage........................................................................................................................61
7. OVERVIEW OF BIOS FEATURES.......................................................................................................62
7.1 System Management BIOS (SMBIOS / DMI)..................................................................................62
7.2 Legacy USB Support .......................................................................................................................62
8. BIOS CONFIGURATION / SETUP .......................................................................................................63
8.1 Introduction......................................................................................................................................63
8.2 Main Menu.........................................................................................................................................63

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8.3 Advanced Menu................................................................................................................................64
8.3.1 Advanced settings – CPU Configuration ....................................................................................65
8.3.2 Advanced settings – IDE Configuration......................................................................................66
8.3.3 Advanced settings – LAN Configuration.....................................................................................68
8.3.4 Advanced settings – Super IO Configuration .............................................................................69
8.3.5 Advanced settings – Hardware Health Configuration ................................................................70
8.3.6 Advanced settings – Voltage Monitor .........................................................................................71
8.3.7 Advanced settings – ACPI Configuration ...................................................................................72
8.3.8 Advanced settings – APM Configuration ....................................................................................73
8.3.9 PCI Express Configuration .........................................................................................................74
8.3.10 Advanced settings – Remote Access Configuration ..................................................................75
8.3.11 Advanced settings – TCG/TPM support.....................................................................................76
8.3.12 Advanced settings – USB Configuration ....................................................................................77
8.3.13 Advanced settings – USB Mass Storage Device Configuration.................................................78
8.4 PCIPnP Menu....................................................................................................................................79
8.5 Boot Menu.........................................................................................................................................80
8.5.1 Boot – Boot Settings Configuration ............................................................................................81
8.5.2 Boot – Boot Device Priority.........................................................................................................82
8.6 Security Menu...................................................................................................................................83
8.7 Chipset Menu....................................................................................................................................84
8.7.1 Advanced Chipset Settings – North Bridge Chipset Configuration ............................................85
8.7.2 Advanced Chipset Settings – Video Function Configuration......................................................86
8.7.3 Advanced Chipset Settings – SouthBridge Configuration..........................................................87
8.8 Exit Menu..........................................................................................................................................88
8.9 AMI BIOS Beep Codes.....................................................................................................................89
9. OS SETUP.............................................................................................................................................90
10. WARRANTY..........................................................................................................................................90

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1. Introduction
This manual describes the KT965/Flex, KT965/ATXP and KT965/ATXE boards made by KONTRON
Technology A/S. The boards will also be denoted KT965 family if no differentiation is required.
All boards are to be used with the Intel® Core™2 Quad, Intel® Core™2 Duo, Intel® Pentium® 4 and the
Intel® Celeron® D Processors.
These belong to the Intel Conroe and Cedar Mill processor families.
Use of this manual implies a basic knowledge of PC-AT hard- and software. This manual is focused on
describing the KT965 Board’s special features and is not intended to be a standard PC-AT textbook.
New users are recommended to study the short installation procedure stated in chapter 3 before switching-
on the power.
All configuration and setup of the CPU board is either done automatically or by the user in the CMOS setup
menus. Except for the CMOS Clear jumper, no jumper configuration is required.

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!
2. Installation procedure
2.1 Installing the board
To get the board running, follow these steps. In some cases the board shipped from KONTRON Technology
has CPU, DDR DRAM and Cooler mounted. In this case Step 2-4 can be skipped.
1. Turn off the power supply
2. Insert the DDR2 DIMM 240pin DRAM module(s)
Be careful to push it in the slot(s) before locking the tabs. For a list of approved DDR2 DIMM modules
contact your Distributor or FAE.
DDR2-800 DIMM 240pin DRAM modules (PC6400) are supported.
3. Install the processor
The CPU is keyed and will only mount in the CPU socket in one way. Use the handle to open/ close the
CPU socket. The Intel® Core™2 Quad, Intel® Core™2 Duo, Intel® Pentium® 4 and the Intel® Celeron®
D Processors in LGA775 package are supported, refer to supported processor overview for details.
Opening the socket:
Note: Apply pressure to the corner with right hand thumb while opening/closing the load lever, otherwise
lever can bounce back like a “mouse trap” and WILL cause bent contacts (when loaded)
1. Disengage Load Lever by depressing down and out on the hook to clear retention tab
2. Rotate Load Lever to fully open position at approximately 135°
3. Rotate Load Plate to fully open position at approximately 100°
Remove Socket Protective Cover
With left hand index finger and thumb to support the load plate edge, engage protective cover finger tab with
right hand thumb and peel the cover from LGA775 Socket while pressing on center of protective cover to
assist in removal.
Set protective cover aside. Always put cover back on if the processor is removed from the socket.
Warning: Turn off PSU (Power Supply Unit) completely (no mains power connected to the PSU)
or leave the Power Connectors unconnected while configuring the board. Otherwise
components (RAM, LAN cards etc.) might get damaged.
Do not use PSU’s without 3.3V monitoring watchdog, which is standard feature in ATX PSU’s.
Runnin
g
the board without 3.3V connected will dama
g
e the board after a few minutes.
NOTE: Regardless of the Memory
configuration used, DDR2 SLOT 1 (J1)
must always be populated.
IMPORTANT:
For return goods (RMA): warranty is void if board is returned without Protective cover.
Do NOT touch socket contacts

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! Warning: When mounting the board to chassis etc. please notice that the board contains
components on both sides of the PCB which can easily be damaged if board is handled
without reasonable care. A damaged component can result in malfunction or no function at all.
Visually inspect protective cover for damage
If damage observed, replace the cover.
NOTE: After cover removal, make sure socket load plate and contacts are free of foreign material. Debris
may be removed with compressed air.
NOTE: Removing protective cover after CPU insertion will compromise the ability to visually inspect socket.
Processor Installation
Locate Connection 1 indicator and the two orientation key notches.
Grasp the processor with thumb and index finger. (Grasp the edges without the orientation notches.) The
socket has cutouts for your fingers to fit into.
Carefully place the package into the socket body using a purely vertical motion. (Tilting the processor into
place or shifting it into place on the socket can damage the sensitive socket contacts.)
CAUTION: Recommend not to use a Vacuum Pen for installation.
Verify that package is within the socket body and properly mated to the orientation keys
Close the socket by:
A. Close the Load Plate
B. While pressing down lightly on Load Plate, engage the Load Lever.
C. Secure Load Lever with Load Plate tab under retention tab of Load Lever
4. Cooler Installation
Use heat paste or adhesive pads between CPU and cooler and connect the Fan electrically to the
FAN_CPU connector.
5. Connecting Interfaces
Insert all external cables for hard disk, keyboard etc. A CRT monitor must be connected in order to
change CMOS settings to flat panel support. When using bootable SATA disk, then connect to SATA0 or
SATA2 or select in BIOS “ATA/IDE Configuration” = Enhanced.
6. Connect Power supply
Connect power supply to the board by the ATX/ BTXPWR and 4-pin ATX connectors. For board to operate
connection of both the ATX/BTX and 4-pin ATX (12V) connectors are required.
7. Turn on the power on the ATX/ BTX power supply
8. Power Button
The PWRBTN_IN must be toggled to start the Power supply; this is done by shorting pins 16
(PWRBTN_IN) and pin 18 (GND) on the FRONTPNL connector (see Connector description). A “normally
open” switch can be connected via the FRONTPNL connector.
9. BIOS Setup
Enter the BIOS setup by pressing the <Del> key during boot up. Refer to the “BIOS Configuration / Setup“
section of this manual for details on BIOS setup.
Enter Advanced Menu / CPU Configuration / Intel SpeedStep Tech. and set this option to “Maximum
Performance”.
10. Mounting the board to chassis
When fixing the Motherboard on a chassis it is recommended using screws with integrated washer and
having diameter of ~7mm.
Note: Do not use washers with teeth, as they can damage the PCB mounting hole and may cause short
circuits.
Note: To clear all CMOS settings, including Password protection, move the Clr-CMOS jumper (with or
without power) for approximately 1 minute. Alternatively turn off power and remove the battery for 1
minute, but be careful to orientate the battery correctly when reinserted.

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2.2 Requirement according to EN60950
Users of KT965 boards should take care when designing chassis interface connectors in order to fulfill the
EN60950 standard:
Lithium Battery precautions:
CAUTION!
Danger of explosion if battery is incorrectly
replaced.
Replace only with same or equivalent type
recommended by manufacturer.
Dispose of used batteries according
to the manufacturer’s instructions.
VORSICHT!
Explosionsgefahr bei unsachgemäßem Austausch
der Batterie.
Ersatz nur durch den selben oder einen vom
Hersteller empfohlenen gleichwertigen Typ.
Entsorgung gebrauchter Batterien nach
Angaben des Herstellers.
ADVARSEL!
Lithiumbatteri – Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende
type anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en ekvivalent
typ som rekommenderas av apparattillverkaren.
Kassera använt batteri enligt fabrikantens
instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti
asennettu.
Vaihda paristo ainoastaan laltevalmistajan
suosittelemaan
tyyppiln. Hävitä käytetty paristo valmistajan
ohjeiden
mukaisesti.
When an interface/connector has a VCC (or other power) pin, which is directly connected to a power
plane like the VCC plane:
To protect the external power lines of peripheral devices the customer has to take care about:
•That the wires have the right diameter to withstand the maximum available power.
•That the enclosure of the peripheral device fulfils the fire protecting requirements of IEC/EN 60950.

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3. System specification
3.1 Component main data
The table below summarises the features of the KT965/Flex, KT965/ATXP and KT965/ATXE embedded
motherboards.
Form factor KT965/Flex: Flex-ATX (190,50millimeters by 228,60millimeters)
KT965/ATXP: ATX (190,50millimeters by 304,00millimeters)
KT965/ATXE: ATX (190,50millimeters by 304,00millimeters)
Processor •Support for Intel® Core™2 Quad, Intel® Core™2 Duo, Intel® Pentium® 4 and the
Intel® Celeron® D in LGA775 package with up to 1066MHz system bus and
1/2/4/8MB internal cache.
•Support for Conroe (65 nanometer) and Cedar Mill (65 nanometer) family processors.
Memory •4 pcs DDR2 DIMM 240pin DRAM sockets.
•Support for DDR 533/667/800MHz (PC2-4200/PC2-5300/PC2-6400)
•Support system memory from 512MB and up to 4GB (*) (32 bit OS) / 8GB (64 bit OS).
(*) Only approx. 3GB displayed in System Properties.
(Shared Video Memory is withdrawn).
•ECC not supported
Chipset Intel Q965 Chipset consisting of:
•Intel® 82Q965 Graphics Memory Controller Hub (GMCH)
•Intel® ICH8DO I/O Controller Hub (ICH8DO)
Video •Intel® GMA 3000 graphics engine
•Dynamic Video Memory Technology (DVMT 4.0), allowing up to 256MB dynamically
allocated Video Memory (System memory is allocated when it is needed).
•Analog Display Support CRT, 400-MHz, 24 bit integrated RAMDAC with support for
analogue monitors up to 2048x1536 at 75 Hz
•Single or dual channel 24bit LVDS panel support (OpenLDI/ SPWG) up to UXGA
(1600x1200) panel resolution supported by using ADD2 / SDVO cards. Interlaced
Display output support.
•Serial Digital Video Out (SDVO) ports (2 channels) for additional CRT, LVDS panel,
DVI, TV-Out and/or HDMI support via Advanced Digital Display 2 (ADD2) cards or
Media Expansion Cards.
•Dual independent pipe support, Mirror and Dual independent display support
Dual Monitor support with combinations of SDVO port devices and onboard CRT
Audio Audio, 7.1 and 7.2 Channel High Definition Audio Codec using the Realtek ALC882 codec
•Line-out
•Line-in
•Surround output: SIDE, LFE, CEN, BACK and FRONT
•Microphone: MIC1
•CDROM in
•SPDIF Interface
Onboard speaker
(continues)

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I/O Control Winbond W83627DHG LPC Bus I/O Controller
Peripheral
interfaces •Eight USB 2.0 ports on I/O area
•Two USB 2.0 ports on internal pinrows
•Two Serial ports (RS232)
•One Parallel port, SPP/EPP/ECP
•Six Serial ATA-300 IDE interfaces
•PS/2 keyboard and mouse ports
LAN
Support •2x 10/100/1000Mbits/s LAN using Realtek RTL8111B controllers
•RPL/PXE netboot supported. Wake On LAN (WOL) supported.
BIOS •Kontron Technology / AMI BIOS (core version)
•Support for Advanced Configuration and Power Interface (ACPI 2.0), Plug and Play
oSuspend To Ram
oSuspend To Disk
oIntel Speed Step
•Secure CMOS/ OEM Setup Defaults
•“Always On” BIOS power setting
•RAID Support (RAID modes 0, 1, 5 and 10) (for Linux O/S only RAID 0 and 1)
Expansion
Capabilities •PCI Bus routed to PCI slot(s) (PCI Local Bus Specification Revision 2.3)
oKT965/Flex: 2 slots PCI 2.3, 32 bits, 33 MHz, 5V compliant
oKT965/ATXP: 6 slots PCI 2.3, 32 bits, 33 MHz, 5V compliant
oKT965/ATXE: 5 slots PCI 2.3, 32 bits, 33 MHz, 5V compliant
•PCI-Express bus routed to PCI Express slot(s) (PCI Express 1.0a)
oKT965/Flex: 1 slot PCI-Express x16, 1 slot PCI-Express x4
oKT965/ATXP: 1 slot PCI-Express x16
oKT965/ATXE: 1 slot PCI-Express x16, 1 slot PCI-Express x4
•Mini PCI-Express routed to mini PCI-Express connector
Support for Mini PCI-Express modules with no components on backside.
oKT965/Flex: None
oKT965/ATXP: 1 slot mini PCI-Express x1
oKT965/ATXE: None
•SMBus routed to FEATURE, PCI slot, PCI Express and mini-PCI Express connectors
•LPC Bus routed to TPM connector
•DDC Bus routed to LVDS and CRT connector
•8 x GPIOs (General Purpose I/Os) routed to FEATURE connector
Hardware
Monitor
Subsystem
•Smart Fan control system, support Thermal® and Speed® cruise for three onboard
Fan control connectors: FAN_CPU, FAN_SYS and FEATURE
•Three thermal inputs: CPU die temperature, System temperature and External
temperature input routed to FEATURE connector. (Precision +/- 3ºC)
•Voltage monitoring
•Intrusion detect input
•SMI violations (BIOS) on HW monitor not supported. Supported by API (Windows).
Operating
Systems
Support
•Win2000
•WinXP
•Win2003
•WinXP Embedded (limitations may apply)
•Windows Vista
•Linux: Feodora Core 5, Suse 10.01 (limitations may apply)
(continues)

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Environmental
Conditions Operating:
0°C – 50°C operating temperature (forced cooling). It is the customer’s responsibility
to provide sufficient airflow around each of the components to keep them within
allowed temperature range.
10% - 90% relative humidity (non-condensing)
Storage:
-20°C – 70°C
5% - 95% relative humidity (non-condensing)
Electro Static Discharge (ESD) / Radiated Emissions (EMI):
All Peripheral interfaces intended for connection to external equipment are ESD/ EMI
protected.
EN 61000-4-2:2000 ESD Immunity
EN55022:1998 class B Generic Emission Standard.
Safety:
UL 60950-1:2003, First Edition
CSA C22.2 No. 60950-1-03 1st Ed. April 1, 2003
Product Category: Information Technology Equipment Including Electrical Business
Equipment
Product Category CCN: NWGQ2, NWGQ8
File number: E194252
Theoretical MTBF:
189.130 hours @ 40ºC for KT965/Flex
178.744 hours @ 40ºC for KT965/ATXP
179.110 hours @ 40ºC for KT965/ATXE
Restriction of Hazardeous Substances (RoHS):
All boards in the KT965 family are RoHS compliant.
Capacitor utilization:
No Tantal capacitors on board
Only Japanese brand Aluminium capacitors rated for 100ºC used on board
Battery Exchangeable 3.0V Lithium battery for onboard Real Time Clock and CMOS RAM.
Manufacturer Panasonic / PN CR2032NL/LE, CR-2032L/BE or CR-2032L/BN.
Expected minimum 5 years retention varies depending on temperature, actual
application on/off rate and variation within chipset and other components.
Approximately current draw is 3µA (no PSU connected).
CAUTION: Danger of explosion if the battery is incorrectly replaced. Replace
only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.

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3.2 System overview
The block diagram below shows the architecture and main components of the KT965 boards. The two key
components on the board are the Intel®Q965 and Intel®ICH8DO Embedded Chipsets.
Components shown shaded are optional depending on board type (KT965/Flex, /ATXP or /ATXE) and
variants of the board.

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3.3 Processor support table.
The KT965/Flex, /ATXP and /ATXE are designed to support the following LGA775 processors:
Intel® Core™2 Quad Processor
Intel® Core™ 2 Duo Processor
Intel® Pentium® 4 Processor
Intel® Celeron®, Intel® Celeron® D Processor
Processor Brand Clock
Speed
[GHz]
Bus
Speed
[MHz]
Processor
Number
sSpec
no.
Thermal
Guideline
[Watt]
Cache Embedded
Intel
®
Core™2 Quad 2.66 1066 Q6700 SLACQ 95 8M No
2.40 1066 Q6600 SLACR 95 8M No
2.40 1066 Q6600 SL9UM 105 8M No
Intel® Core™ 2 Duo 2.66 1066 E6700 SL9S7 65 4M No
(Conroe) 2.66 1066 E6700 SL9ZF 65 4M No
2.66 1066 E6700 SLAPB 65 3M No
2.66 1066 E6700 SLB9X 65 3M No
2.53 1066 E7200 SLAPC 65 3M No
2.53 1066 E7200 SLAVN 65 3M No
2.40 1066 E6600 SL9SL 65 4M No
2.40 1066 E6600 SL9S8 65 4M No
2.13 1066 E6420 SLA4T 65 4M Yes
2.13 1066 E6400 SL9T9 65 2M Yes
2.13 1066 E6400 SLA97 65 2M Yes
2.13 1066 E6400 SL9S9 65 2M Yes
1.86 1066 E6320 SLA4U 65 4M No
1.86 1066 E6300 SL9SA 65 2M No
2.60 800 E4700 SLALT 65 2M No
1.80 800 E4300 SL9TB 65 2M Yes
1.80 800 E2160 SLA3H 65 1M No
1.80 800 E2160 SLA8Z 65 1M No
1.80 800 E2160 SLA9Z 65 1M No
Intel® Pentium® 4 3.60 800 661 86 2M No
(Cedar Mill) 3.40 800 651 SL9KE 86 * 2M Yes
3.20 800 641 86 2M No
3.0 800 631 86 2M No
Intel® Celeron
®
2.0 800 440 SL9XL 35 512Kb Yes
(Conroe-L)
Intel® Celeron® D 3.6 533 365 65 512Kb No
(Cedar Mill) 3.46 533 360 65 512Kb No
3.33 533 356 86 512Kb No
3.2 533 352 SL96P 86 * 512Kb Yes
3.06 533 347 86 512Kb No
* 65W when D0 stepping.

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3.4 System Memory support
The KT965 boards have four onboard DDR2 DIMM sockets and support the following memory features:
•1.8V (only) 240-pin DDR2 SDRAM DIMMs with gold-plated contacts
•DDR2 800 (PC6400), DDR2 667 (PC5300) or DDR2 533 MHz (PC4200) SDRAM DIMMs
•DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
•Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMs
with x16 organization are not supported.
•8 GB maximum total system memory using 64-bit OS. (Shared Video Memory is withdrawn).
•4 GB maximum total system memory using 32-bit OS. ~3GB is displayed in System Properties.
(Shared Video Memory is withdrawn).
•Minimum total system memory: 512 MB
•Non-ECC DIMMs
•Serial Presence Detect
The installed DDR2 SDRAM should support the Serial Presence Detect (SPD) data structure. This allows
the BIOS to read and configure the memory controller for optimal performance. If non-SPD memory is used,
the BIOS will attempt to configure the memory settings, but performance and reliability may be impacted.
Important: If only one Memory module is used then use DDR2 SLOT 1.
3.4.1 Memory Operating Frequencies
Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor
system bus frequency. For example, if DDR2 800 memory is used with a 533 MHz system bus frequency
processor, the memory will operate at 533 MHz. The table below lists the resulting operating memory
frequencies based on the combination of DIMMs and processors.
DIMM Type Processor system
bus frequency Resulting memory frequency
DDR2 533 533 MHz 533 MHz
DDR2 533 800 MHz 533 MHz
DDR2 533 1066 MHz 533 MHz
DDR2 667 533 MHz 533 MHz
DDR2 667 800 MHz 667 MHz
DDR2 667 1066 MHz 667 MHz
DDR2 800 533 MHz 533 MHz
DDR2 800 800 MHz 800 MHz
DDR2 800 1066 MHz 800 MHz
3.4.2 Memory Configurations
The KT965 boards support the following three types of memory organization:
Dual channel (Interleaved) mode. This mode offers the highest throughput. Dual channel mode is enabled
when the installed memory capacities of both DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each channel must be equal. If
different speed DIMMs are used between channels, the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation. This
mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are used between channels,
the slowest memory timing will be used.

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Flex mode. This mode provides the most flexible performance characteristics. The bottommost DRAM
memory (the memory that is lowest within the system memory map) is mapped to dual channel operation;
the topmost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped
to single channel operation. Flex mode results in multiple zones of dual and single channel operation across
the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.
**IMPORTANT NOTE:
Regardless of the memory configuration used (dual channel, single channel, or flex mode), DDR2
SLOT 1 must always be populated.
The below tables shows examples of possible Memory slot configurations for the support of the various
Memory modes.
Dual Channel (Interleaved) Mode Configurations
Channel A Channel B
DDR2 DIMM 0 (SLOT 1) DDR2 DIMM 1 (SLOT 2) DDR2 DIMM 0 (SLOT 3) DDR2 DIMM 1 (SLOT 4)
1 GB 1 GB
512 MB 512 MB 1 GB
512 MB 1 GB 512 MB 1 GB
In these examples the combined capacity of the two DIMMs in Channel A equals the combined capacity of
the two DIMMs in Channel B.
Single Channel (Asymmetric) Mode Configurations
Channel A Channel B
DDR2 DIMM 0 (SLOT 1) DDR2 DIMM 1 (SLOT 2) DDR2 DIMM 0 (SLOT 3) DDR2 DIMM 1 (SLOT 4)
1 GB
512 MB 1GB 1GB
In these examples the combined capacity of the two DIMMs in Channel A does not equal the capacity of the
DIMMs in Channel B.
Flex Mode Configurations
Channel A Channel B
DDR2 DIMM 0 (SLOT 1) DDR2 DIMM 1 (SLOT 2) DDR2 DIMM 0 (SLOT 3) DDR2 DIMM 1 (SLOT 4)
512 MB 1 GB
The 512 MB DIMM in the Channel A, DIMM 0 socket and the lower 512 MB of the DIMM in the Channel B,
DIMM 0 socket operate together in dual channel mode. The remaining (upper) 512 MB of the DIMM in
Channel B operates in single channel mode.
Channel A, DDR2 DIMM 0 (SLOT 1)**
Channel A, DDR2 DIMM 1 (SLOT 2)
Channel B, DDR2 DIMM 0 (SLOT 3)
Channel B, DDR2 DIMM 1 (SLOT 4)

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3.5 KT965 Graphics Subsystem
The KT965 boards use the Intel Q965 Express chipset for the graphical control. This chipset contains two
separate, mutually exclusive graphics options. Either the GMA 3000 graphics controller (contained within the
82Q965 GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Expressx16 add-in
card is installed, the GMA 3000 graphics controller is disabled.
3.5.1 Intel GMA 3000 Graphics Controller
Features of the Intel GMA 3000 graphics controller includes:
•667 MHz core frequency
•High performance 3-D setup and render engine
•High quality texture engine
oDX9.0c* and OpenGL* 1.4 + extensions compliant
o32-bit and 16-bit Full Precision Floating Point Operations
oUp to eight Multiple Render Targets (MRTs)
o128-bit floating point texture formats
oBilinear, Trilinear, and Anisotropic MipMap filtering
oAlpha and luminance maps
•3D Graphics Rendering enhancements
o1.3 dual texture GigaPixel/sec fill rate
o16 and 32 bit color
oMaximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz
oVertex cache
oAnti-aliased lines
oOpenGL version 1.5 support with vertex buffer and EXT_Shadow extensions
•2D Graphics enhancements
o8, 16, and 32 bit color
oOptimized 256-bit BLT engine
oColor space conversion
oAnti-aliased lines
•Video
oHardware motion compensation for MPEG2 and HD video
oSoftware DVD at 30 fps full screen
oMotion adaptive de-interlacing
•Display
oIntegrated 24-bit 400 MHz RAMDAC
oUp to 2048 x 1536 at 75 Hz refresh (QXGA)
oDVI specification 1.0 compliant
oDual independent display options with digital display (using ADD2 card)
o180-degree hardware screen rotation
oHDCP support
oDDC2B compliant interface with Advanced Digital Display 2 card or Media Expansion Card
(ADD2/MEC), support for TV-out/TV-in and DVI digital display connections
oSupports flat panels up to 2048 x 1536 at 75 Hz (when in dual-channel mode) or digital
CRT/HDTV at 1920 x 1080 at 85 Hz (with ADD2/MEC)
oTwo multiplexed SDVO port interfaces with 270 MHz pixel clocks using an ADD2/MEC card
•Dynamic Video Memory Technology (DVMT) support up to 256 MB
3.5.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient memory utilization.
DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics
performance. Up to 256 MB of system memory can be allocated to DVMT on systems that have 512 MB or
more of total system memory installed. DVMT returns system memory back to the operating system when
the
additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup) for
compatibility with legacy applications. An example of this would be when using VGA graphics under DOS.
Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics
buffer as needed for performing graphics functions.
IMPORTANT: The use of DVMT requires driver support by the operating system.

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3.5.3 Advanced Digital Display (ADD2) card Support
The KT965 board routes two multiplexed SDVO ports that are each capable of driving up to a 200 MHz pixel
clock to the PCI Express x16 connector. The SDVO ports can be paired for a dual channel configuration to
support up to a 400 MHz pixel clock. When an ADD2 card is detected, the Intel GMA 3000 graphics
controller is enabled and the PCI Express x16 connector is configured for SDVO mode. SDVO mode
enables the SDVO ports to be accessed by the ADD2 card. An ADD2 card can either be configured to
support simultaneous display with the primary VGA display or can be configured to support dual independent
display as an extended desktop configuration with different color depths and resolutions.
ADD2 cards can be designed to support the following configurations:
•TV-Out (composite video)
•Transition Minimized Differential Signaling (TMDS) for DVI 1.0
•Low Voltage Differential Signaling (LVDS)
•Single device operating in dual channel mode
•VGA output
•HDTV output
•HDMI/UDI support (when used with the HD Audio Link)
Currently the following ADD2 cards are available
•P/N 820950, ADD2-Dual LVDS
•P/N 820951, ADD2-DVI-Dual-Internal
•P/N 820952, ADD2-DVI-Dual
•P/N 820953, ADD2-LVDS
•P/N 820954, ADD2-CRT
•P/N 820955, ADD2-DVI-Dual-Internal-C01
•P/N 820958, ADD2-DVI-Dual-Internal
Please visit the Kontron website (http://emea.kontron.com/ ) for details.

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3.6 KT965 Power State Map
Continues