Kontron COMe-cDV7 User manual


USER GUIDE
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COMe-cDV7
Doc. User Guide, Rev 1.0
Doc. ID: 1065-4078

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
COME
-CDV7 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2019 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.

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Revision History
Revision Brief Description of Changes Date of Issue Author/
Editor
1.0 Initial version 2019-Nov-08 CW
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron Support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products
. Failure to observe the precautions indicated and/or
prescribed by the law may endanger your life/health and/or result in damage to your
material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive

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Table of Contents
Symbols.................................................................................................................................................................................................................6
For Your Safety ...................................................................................................................................................................................................7
High Voltage Safety Instructions ..................................................................................................................................................................7
Special Handling and Unpacking Instruction ............................................................................................................................................7
Lithium Battery Precautions.......................................................................................................................................................................... 8
General Instructions on Usage..................................................................................................................................................................... 8
Quality and Environmental Management................................................................................................................................................ 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents...............................................................................................................................................................................................9
List of Tables ......................................................................................................................................................................................................11
List of Figures....................................................................................................................................................................................................12
1/ Introduction .........................................................................................................................................................................................13
1.1. Product Description...................................................................................................................................................................................13
1.2. Product Naming Clarification ................................................................................................................................................................14
1.3. COM Express® Documentation.............................................................................................................................................................14
1.4. COM Express® Functionality .................................................................................................................................................................15
1.5. COM Express® Benefits...........................................................................................................................................................................15
2/ Product Specification .......................................................................................................................................................................16
2.1. Module Variants ........................................................................................................................................................................................16
2.2. Commercial Grade Modules (0°C to +60°C).....................................................................................................................................16
2.3. Industrial Temperature Grade Modules (E2, -30°C to +85°C) ...................................................................................................16
2.4. Accessories ................................................................................................................................................................................................17
2.5. Memory Modules......................................................................................................................................................................................17
3/ Functional Specification..................................................................................................................................................................19
3.1. Block Diagram ............................................................................................................................................................................................19
3.2. Processor ...................................................................................................................................................................................................20
3.3. System on a Chip (SoC)..........................................................................................................................................................................22
3.4. System Memory.......................................................................................................................................................................................22
3.5. USB ...............................................................................................................................................................................................................22
3.5.1. USB 3.0......................................................................................................................................................................................................23
3.5.2. USB 2.0.....................................................................................................................................................................................................23
3.6. SATA.............................................................................................................................................................................................................23
3.7. PCI Express (PCIE) Configuration........................................................................................................................................................24
3.8. Ethernet......................................................................................................................................................................................................24
3.8.1. On-board Gigabit Ethernet (1 GbE)..................................................................................................................................................24
3.8.2. Quad Ethernet Ports (up to 10 Gb) ................................................................................................................................................. 25
3.9. SoC High-speed Interfaces Overview...............................................................................................................................................26
3.10. Storage...................................................................................................................................................................................................... 27
3.11. BIOS/Software......................................................................................................................................................................................... 27
3.12. COMe Features ....................................................................................................................................................................................... 27
3.13. Special Features..................................................................................................................................................................................... 27
4/ Power Specification .........................................................................................................................................................................28
4.1. Power Supply Specifications................................................................................................................................................................28
4.1.1. Power Supply Voltage Rise Time .....................................................................................................................................................28
4.1.2. Power Supply Voltage Ripple ...........................................................................................................................................................28

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4.1.3. Power Supply Inrush Current ...........................................................................................................................................................29
4.2. Power Management...............................................................................................................................................................................29
4.2.1. Power Supply Control Settings........................................................................................................................................................29
4.2.2. Power Supply Modes..........................................................................................................................................................................30
5/ Thermal Management.....................................................................................................................................................................32
5.1. Heatspreader Plate.................................................................................................................................................................................. 32
5.2. Active or Passive Cooling Solutions ..................................................................................................................................................32
5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly................................................................................................. 32
5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly.......................................................................................... 32
5.5. Temperature Sensors ............................................................................................................................................................................ 33
5.6. On-board Fan Connector ......................................................................................................................................................................34
6/ Environmental Specification......................................................................................................................................................... 35
6.1. Temperature.............................................................................................................................................................................................. 35
6.2. Humidity ..................................................................................................................................................................................................... 35
7/ Standards and Certification ..........................................................................................................................................................36
7.1. MTBF............................................................................................................................................................................................................. 37
8/ Mechanical Specification ...............................................................................................................................................................38
8.1. Dimensions.................................................................................................................................................................................................38
8.2. Module Height ..........................................................................................................................................................................................39
8.3. Heatspreader Dimensions....................................................................................................................................................................39
9/ Features and Interfaces .................................................................................................................................................................40
9.1. ACPI Power States....................................................................................................................................................................................40
9.2. APPROTECT Security Solution.............................................................................................................................................................40
9.3. eMMC Flash Memory ..............................................................................................................................................................................41
9.4. Fast I2C ........................................................................................................................................................................................................41
9.5. GPIO...............................................................................................................................................................................................................41
9.6. Hardware Monitor (HWM).....................................................................................................................................................................41
9.7. LPC ................................................................................................................................................................................................................42
9.8. Quick Assist Technology (Intel® QAT) ..............................................................................................................................................42
9.9. RTC ...............................................................................................................................................................................................................42
9.10. SMBus........................................................................................................................................................................................................45
9.11. SpeedStep® Technology ......................................................................................................................................................................45
9.12. Serial Peripheral Interface (SPI) .......................................................................................................................................................43
9.12.1. SPI boot...................................................................................................................................................................................................43
9.12.2. Module SPI Flash Chips ....................................................................................................................................................................44
9.12.3. Using an External SPI Flash ............................................................................................................................................................44
9.12.4. External SPI flash on Modules with Intel® ME.........................................................................................................................44
9.13. TPM 2.0......................................................................................................................................................................................................45
9.14. UART ..........................................................................................................................................................................................................45
9.15. Virtualization Technology (Intel ® VT) ............................................................................................................................................46
9.16. Watchdog Timer (WDT) –Dual Stage............................................................................................................................................46
9.16.1. WDT Signal............................................................................................................................................................................................46
9.17. eXtended Debug Port XDP (Option).................................................................................................................................................47
10/ System Resources ............................................................................................................................................................................48
10.1. Legacy Interrupt Request (IRQ) Lines..............................................................................................................................................48
10.2. Memory Area...........................................................................................................................................................................................48
10.3. I/O Address Map....................................................................................................................................................................................49
10.4. PCI Devices................................................................................................................................................................................................51
10.5. I2C Bus........................................................................................................................................................................................................51

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10.6. System Management (SMBus) ......................................................................................................................................................... 52
11/ COMe Interface Connector............................................................................................................................................................. 53
11.1. Connecting the COMe Interface Connector to the Carrier Board ............................................................................................54
11.2. X1A and X1B COMe Interface Connector Signals ..........................................................................................................................54
11.3. COMe Connector (X1A and X1B) Pin Assignment.......................................................................................................................... 55
11.3.1. Connector X1A Row A1 - A110 ........................................................................................................................................................... 55
11.3.2. Connector X1A Row B1 - B100 .........................................................................................................................................................58
11.3.3. Connector X1B Row C1 - C110............................................................................................................................................................61
11.3.4. Connector X1B Row D1 - D110..........................................................................................................................................................64
12/ uEFI BIOS .............................................................................................................................................................................................. 67
12.1. Starting the uEFI BIOS ........................................................................................................................................................................... 67
12.2. Navigating the uEFI BIOS..................................................................................................................................................................... 67
12.3. Getting help .............................................................................................................................................................................................68
12.4. Setup Menus ...........................................................................................................................................................................................68
12.4.1. Main Menu.............................................................................................................................................................................................69
12.4.2. Advanced Menu ..................................................................................................................................................................................70
12.4.3. InterlRCSetup Menu ..........................................................................................................................................................................78
12.4.4. Security Menu .....................................................................................................................................................................................92
12.4.5. Boot Menu ............................................................................................................................................................................................94
12.4.6. Save and Exit .......................................................................................................................................................................................95
12.5.1. Basic Operation of the uEFI Shell...................................................................................................................................................96
13/ Technical Support............................................................................................................................................................................. 97
13.1. Returning Defective Merchandise .................................................................................................................................................... 97
14/ Warranty..............................................................................................................................................................................................98
14.1. Limitation/Exemption from Warranty Obligation.......................................................................................................................98
Appendix A: List of Acronyms.....................................................................................................................................................................99
List of Tables
Table 1: Pin Assignment of Type 6 and COMe-cDV7 .............................................................................................................................15
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)................................................................16
Table 3: Product Number for Industrial Grade Modules (-30°C to +85°C operating)................................................................16
Table 4: Accessories........................................................................................................................................................................................17
Table 5: Memory Modules.............................................................................................................................................................................17
Table 6: Specification of COMe-cDV7 Processor Variants - Commercial Temperature..........................................................20
Table 7: Specifications of COMe-cDV7 Processor Variants - Industrial Temperature..............................................................21
Table 8: Power Supply Control Settings..................................................................................................................................................29
Table 9: Heatspreader Temperature Specifications............................................................................................................................32
Table 10: Fan Connector (3-Pin) Pin Assignment .................................................................................................................................34
Table 11: Electrical Characteristics of the Fan Connector ..................................................................................................................34
Table 12: Temperature Grade Specifications ......................................................................................................................................... 35
Table 13: Humidity Specification................................................................................................................................................................. 35
Table 14: Standards and Certification Compliance .............................................................................................................................. 36
Table 15: MTBF.................................................................................................................................................................................................. 37
Table 16: Supported Power States Function ..........................................................................................................................................40
Table 17: Supported BIOS Features............................................................................................................................................................42
Table 18: SPI Boot Configuration ................................................................................................................................................................43
Table 19: Supported SPI Boot Flash Types for 8-SOIC Package.......................................................................................................43
Table 20: Dual Stage Watchdog Timer- Time-out Events.................................................................................................................46
Table 21: Legacy IRQ Lines............................................................................................................................................................................48
Table 22: Designated Memory Locations................................................................................................................................................48
Table 23: Designated I/O Port Address Ranges....................................................................................................................................49

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Table 24: I2C Bus Port Addresses...............................................................................................................................................................51
Table 25: SMBus Addresses......................................................................................................................................................................... 52
Table 26: General Signal Description........................................................................................................................................................54
Table 27: X1A Connector Pin Assignment Row (A1-A110)................................................................................................................... 55
Table 28: X1A Connector Pin Assignment Row (B1-B110) ..................................................................................................................58
Table 29: X1B Connector Pin Assignment Row (C1-C110)....................................................................................................................61
Table 30: X1B Connector Pin Assignment Row (D1-D110) ..................................................................................................................64
Table 31: Navigation Hot Keys Available in the Legend Bar .............................................................................................................. 67
Table 32: Main Setup Menu Functions .....................................................................................................................................................69
Table 33: Advanced Setup Menu Functions............................................................................................................................................ 70
Table 34: InterlRCSetup Setup Menu Functions ...................................................................................................................................78
Table 35: Security Setup Menu Functions...............................................................................................................................................92
Table 36: Boot Setup Menu Functions......................................................................................................................................................94
Table 37: Save and Exit Menu Functions ................................................................................................................................................. 95
Table 37: List of Acronyms...........................................................................................................................................................................99
List of Figures
Figure 1: COMe-cDV7 COM Express® Module..........................................................................................................................................13
Figure 2: Block Diagram COMe-cDV7 .........................................................................................................................................................19
Figure 3: Temperature Sensor Location on the Module..................................................................................................................... 33
Figure 4: Fan Connector 3-Pin.....................................................................................................................................................................34
Figure 5: MTBF De-rating Values ............................................................................................................................................................... 37
Figure 6: Module Dimensions......................................................................................................................................................................38
Figure 7: Module and Carrier Height..........................................................................................................................................................39
Figure 8: Heatspreader Dimension............................................................................................................................................................39
Figure 9: COMe Connector with 220 pins ................................................................................................................................................ 53
Figure 10: X1A and X1B COMe Interface Connectors............................................................................................................................. 53
Figure 11: Setup Menu Selection Bar .........................................................................................................................................................68
Figure 12: Main Setup Menu Example.......................................................................................................................................................69
Figure 13: Advanced Setup Menu Example ............................................................................................................................................. 70
Figure 14: IntelRCSetup Example................................................................................................................................................................78
Figure 15: Security Setup Menu...................................................................................................................................................................92
Figure 16: Boot Setup Menu .........................................................................................................................................................................94
Figure 17: Save and Exit Setup Menu......................................................................................................................................................... 95

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1/ Introduction
This user guide describes the COMe-cDV7 made by Kontron and focuses on describing the COMe-cDV7’s special
features. New users are recommended to study this user guide before switching on the power.
1.1. Product Description
The COMe-cDV7 is part of Kontron’s COM Express® module family. The COMe-cDV7 is an entry-level server-grade
platform based on the Intel® Atom® C3000 series processor product family, featuring scalable Soc performance with up
to 16 cores. This performance combined with quad 10 GbE interfaces, and an additional Gigabit interface makes the
COMe-cDV7 ideal for network intensive implementations.
Key COMe-cDV7 features are:
Entry level server-grade platform
Quad 10 GbE and one Gigabit Ethernet
High-speed connectivity PCIe 3.0, SATA3, USB 3.0
Up to 32 GB DDR4 memory
Industrial grade version
Support of Kontron’s Embedded Security Solution- APPROTECT
Figure 1: COMe-cDV7 Front Side
1SoC
22x DDR4 SODIMM sockets
33-pin fan connector
46x mounting points for standoffs
1
3
4
4
4
4
4
4
2

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1.2. Product Naming Clarification
COM Express® defines a Computer-on-Module (COM), with all the components necessary for a bootable host computer,
packaged as a super component. The product names for Kontron COM Express® Computer-on-Modules consist of:
Industry standard short form
COMe-
Module form factor
b=basic (125mm x 95mm)
c=compact (95mm x 95mm)
m=mini (84mm x 55mm)
Intel’s® processor code name
DV = Denverton-NS
Pinout type
Type 6
Type 7
Type 10
Available temperature variants
Commercial
Extended (E1)
Industrial (E2)
Screened industrial (E2S) and Rapid shutdown screened industrial (R E2S)
Processor Identifier
Chipset identifier (if chipset assembled)
Memory size
Memory module (#G) /eMMC pSLC memory (#S)
1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. The COM Express
document is available on the PICMG® website.
The COM Express® specification defines the COM Express® module form factor, pinout and signals. For more
information about the COM Express® specification, visit the PCI Industrial Computer Manufacturers Group (PICMG®)
website.

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1.4. COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220-pin connectors. Each connector has two rows
called Row A & B on the primary connector and Row C & D on the secondary connector. COM Express® Computer-on-
Modules feature the following maximum amount of interfaces according to the PICMG module pinout type. The Type 7
pinout contains the Type 6 features with the exception of audio and video interfaces and with reduced SATA and USB
interfaces.
Table 1: Pin Assignment of Type 6 and COMe-cDV7
Feature Type 7 Pinout COMe-cDV7 Pinout
Gigabit Ethernet 1x 1x
10 Gb Ethernet 4x 4x
NC-SI Interface 1x 1x
Serial ATA 2x 2x
(SoC HSIO Port 19 is joint SATA1/USB 3.0 port with default SATA1)
PCI Express 32x Up to 14 PCIe Gen3
USB Client 1x
USB 3.0 4x 3x
(SoC HSIO Port 19 is joint SATA1/USB 3.0 port with default SATA1)
USB 2.0 4x 4x
(Option: WIBU implemented on USB 2.0 port 3)
LPC 1x ( or eSPI) 1x
External SMB 1x 1x
External I2C 1x 1x
GPIO 8x 8x
SDIO shared w/GPIO 1x
UART (2-wire COM) 2x 2x
FAN PWM out 1x 1x
1.5. COM Express® Benefits
COM Express® defines a Computer-on-Module (COM), with all the components necessary for a bootable host computer,
packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and feature a
standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based
on the COM Express® specification. This standardization allows designers to create a single-system carrier board that
can accept present and future COM Express® modules.
The carrier board designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a carrier board optimally designed to fit a system’s
packaging.
A single carrier board design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® carrier board can work with several successive generations of
COM Express® modules.
A COM Express® carrier board design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

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2/ Product Specification
2.1. Module Variants
The COMe-cDV7 is available in different processor, chipset and temperature variants to cover demands in performance,
price and power.
2.2. Commercial Grade Modules (0°C to +60°C)
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)
Product Number Product Name Description
66002-0000-38-5 COMe-cDV7 C3538 10K+2GX COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3538, 4 core, 2.1GHz,
2x 10GBASE-KR + 2x 2500BASE-X, 2x DDR4 SO-DIMM
66002-0000-58-5 COMe-cDV7 C3558 10K+2GX COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3558, 4 core, 2.2GHz,
2x 10GBASE-KR + 2x 2500BASE-X, 2x DDR4 SO-DIMM
66002-0000-58-7 COMe-cDV7 C3758 10K COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3758, 8 core, 2.2GHz,
4x 10GBASE-KR, 2x DDR4 SO-DIMM
66002-0000-58-8 COMe-cDV7 C3858 10K COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3858, 12 core, 2.0GHz,
4x 10GBASE-KR, 2x DDR4 SO-DIMM
66002-0000-58-9 COMe-cDV7 C3958 10K COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3958, 16 core, 2.0GHz,
4x 10GBASE-KR, 2x DDR4 SO-DIMM
2.3. Industrial Temperature Grade Modules (E2, -30°C to +85°C)
Table 3: Product Number for Industrial Grade Modules (-30°C to +85°C operating)
Product Number Product Name Description
66003-0000-08-3 COMe-cDV7 E2 C3308 2GX COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3308, 2 core, 1.6GHz,
4x 2500BASE-X, 1x DDR4 SO-DIMM
66003-0000-08-5 COMe-cDV7 E2 C3508 2GX COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3508, 4 core, 1.5GHz,
4x 2500BASE-X, 2x DDR4 SO-DIMM
66003-0000-08-7 COMe-cDV7 E2 C3708 10K COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3708, 8 core, 1.7GHz,
4x 10GBASE-KR, 2x DDR4 SO-DIMM
66003-0000-08-8 COMe-cDV7 E2 C3808 10K COM Express® compact pin-out type 7 Computer-on-
Module with Intel® Atom® processor C3808, 12 core, 2.0GHz,
4x 10GBASE-KR, 2x DDR4 SO-DIMM

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2.4. Accessories
Accessories are either product specific, COMe-type 7 specific or general COMe accessories. For more information
contact your local Kontron sales representative or Kontron Inside Sales.
Table 4: Accessories
Part Number Product Name Description
66003-0000-99-0 HSP COMe-cDV7 (E2) THREAD Heatspreader for COMe-cDV7 (E2) threaded
mounting holes
66003-0000-99-1 HSP COMe-cDV7 (E2) THROUGH Heatspreader for COMe-cDV7 (E2) through
mounting holes
68300-0000-00-0 COMe Eval Carrier Type 7 COM Express® Eval Carrier Type 7
Project Code: Topanga Canyon
68300-0000-01-0 ADA-COME-T7 4X10G RJ45 COMe Type 7 Interposer card, 4x 10 GbE RJ45
adapter to be used in combination with COMe
Eval Carrier T7
96079-0000-00-0 KAB-HSP 200 mm Adapter cable fan to module 200 mm
96079-0000-00-2 KAB-HSP 40 mm Adapter cable fan to module 40 mm
2.5. Memory Modules
Table 5: Memory Modules
Part Number Memory (Non ECC) Description
97017-4096-24-0 DDR4-2400 SODIMM 4 GB_COM DDR4-2400, 4 GB, 260P, 1200 MHz, PC4-2400
SODIMM
97017-8192-24-0 DDR4-2400 SODIMM 8 GB_COM DDR4-2400, 8 GB, 260P, 1200 MHz, PC4-2400
SODIMM
97017-1600-24-0 DDR4-2400 SODIMM 16 GB_COM DDR4-2400, 16 GB, 260P, 1200 MHz, PC4-2400
SODIMM
97017-3200-24-0 DDR4-2400 SODIMM 32GB_COM DDR4-2400, 32GB, 260P, 1200MHz, PC4-2400
SODIMM
97017-4096-24-2 DDR4-2400 SODIMM 4 GB E2_COM DDR4-2400, 4 GB, E2, 260P, 1200 MHz, PC4-2400
SODIMM, industrial temperature
97017-8192-24-2 DDR4-2400 SODIMM 8 GB E2_COM DDR4-2400, 8 GB, E2, 260P, 1200 MHz, PC4-2400
SODIMM, industrial temperature
97017-1600-24-2 DDR4-2400 SODIMM 16 GB E2_COM DDR4-2400, 16 GB, E2, 260P, 1200 MHz, PC4-2400
SODIMM, industrial temperature
97017-3200-24-2 DDR4-2400 SODIMM 32GB E2_COM DDR4-2400, 32GB, E2, 260P, 1200MHz, PC4-2400
SODIMM
Part Number Memory (ECC) Description
97018-4096-24-0 DDR4-2400 SODIMM 4 GB ECC_COM DDR4-2400, 4 GB, ECC, 260P, 1200 MHz, PC4-
2400 SODIMM
97018-8192-24-0 DDR4-2400 SODIMM 8 GB ECC_COM DDR4-2400, 8GB, ECC, 260P, 1200 MHz, PC4-2400
SODIMM
97018-1600-24-0 DDR4-2400 SODIMM 16 GB ECC_COM DDR4-2400, 16 GB, ECC, 260P, 1200 MHz, PC4-
2400 SODIMM

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Part Number Memory (Non ECC) Description
97018-3200-24-0 DDR4-2400 SODIMM 32GB ECC_COM DDR4-2400, 32GB, ECC, 260P, 1200MHz, PC4-
2400 SODIMM
97018-4096-24-2 DDR4-2400 SODIMM 4 GB ECC E2_COM DDR4-2400, 4 GB, ECC, E2, 260P, 1200 MHz, PC4-
2400 SODIMM, industrial temperature
97018-8192-24-2 DDR4-2400 SODIMM 8 GB ECC E2_COM DDR4-2400, 8 GB, ECC, E2, 260P, 1200 MHz, PC4-
2400 SODIMM, industrial temperature
97018-1600-24-2 DDR4-2400 SODIMM 16 GB ECC E2_COM DDR4-2400, 16 GB, ECC, E2, 260P, 1200 MHz, PC4-
2400 SODIMM, industrial temperature
97018-3200-24-2 DDR4-2400 SODIMM 32GB ECC E2_COM DDR4-2400, 32GB, ECC, E2, 260P, 1200MHz, PC4-
2400 SODIMM

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3/ Functional Specification
3.1. Block Diagram
Figure 2: Block Diagram COMe-cDV7

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3.2. Processor
The Intel® Atom ® processor C3000 series uses the 14 nm processor technology with 34 mm x 28 mm package size and
BGA 1310.
The processor variants support the followin technologies:
Intel® 64 Architecture
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Intel® Turbo Boost Technology
Intel® Streaming SIMD Extensions 4.1 (Intel® SSE4.1)
Intel® Streaming SIMD Extensions 4.1 (Intel® SSE4.1)
Secure Hash Algorithm New Instruction (SHA-NI)
Enhanced Intel SpeedStep® Technology
Intel® AES New Instructions (AES-NI)
Execute Disable Bit
Quick Assist Technology
The following table lists the specification of the processor variants. The COMe-cDV7’s functional specification deviates
from the processor specification.
Table 6: Specification of COMe-cDV7 Processor Variants - Commercial Temperature
Intel®
Processor
Atom® Atom® Atom® Atom® Atom®
C3958 C3858 C3758 C3558 C3538
# of Cores 16 12 8 4 4
# of Threads 16 12 8 4 4
# of High Speed IO
Lanes
20[2]20[2]20[2]12[2]12[2]
Processor Base
Frequency
2 GHz 2 GHz 2.2 GHz 2.2 GHz 2.1 GHz
Max Turbo Frequency 2 GHz 2 GHz 2.2 GHz 2 GHz 2.1 GHz
TDP 31 W 25 W 25 W 16 W 15 W
Cache 16 MB 12 MB 8 MB 8 MB 8 MB
Memory Types DDR4-2400 DDR4-2400 DDR4-2400 DDR4-2133 DDR4-2133
Max.# Memory
Channels
2 2 2 2 2
Max. Memory Size 256 GB[1] 256 GB[1] 256 GB[1] 256 GB[1] 256 GB [1]
ECC Memory Yes Yes Yes Yes Yes
Integrated LAN 4x 10/2.5/1 GbE 4x 10/2.5/1 GbE 4x 10/2.5/1 GbE 2x 10/2.5/1 GbE
+ 2x 2.5/1 GbE
2x 10/2.5/1 GbE
+ 2x 2.5/1 GbE
Intel®Quick Assist
(QAT)
Supported
QAT Speed High Medium Low Low low
QAT Cryptographic
Functions
Supported Not supported